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公开(公告)号：US20170093085A1
公开(公告)日：2017-03-30
申请号：US15017417
申请日：2016-02-05
申请人： APPLE INC.
IPC分类号： H01R13/52
CPC分类号： H01H13/00 , G06F1/1626 , G06F1/1656 , G06F1/1671 , H01R13/703
摘要： An electronic device has a concealed external electrical connector that may be activated by a pin of a mating connector. When the pin applies a force to an electrically conductive and flexible region of an exterior housing of an electronic device the electrically conductive region deflects inwards coupling to a contact within the electronic device. A bi-directional communications path is then established from the pin of the connector, through the conductive portion of the housing, to the contact and to circuitry within the housing of the electronic device.
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公开(公告)号：US20160256979A1
公开(公告)日：2016-09-08
申请号：US14714876
申请日：2015-05-18
申请人： Apple Inc.
发明人： Naoto Matsuyuki , Bin Yi , Dezheng Qu , Jairam Manjunathaiah , Scott M. Nathanson , Trevor J. Ness , David I. Nazzaro , Raul A. Molina
CPC分类号： B24B37/042 , B24B37/02 , B24B37/025 , B29C70/745 , B29C70/88 , C03C25/005 , F16B11/006
摘要： A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.
摘要翻译： 一种用于共整理表面的方法将由第一材料形成的第一结构粘结在具有由第二材料形成的第二结构中限定的孔中的第一表面，并且具有第二表面，使得在第一表面和第二表面之间存在偏移 第二个表面。 共同研磨第一表面和第二表面以减少偏移。 第一表面和第二表面被共抛光以进一步减少偏移。 然后第一表面和第二表面可以是齐平的。 可以将第一表面的边缘倒角以减轻在共研磨和/或共抛光期间的损伤。 填充材料可以位于第一和第二结构之间的间隙中，以减轻在共研磨和/或共抛光期间的损伤。
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公开(公告)号：US20160190719A1
公开(公告)日：2016-06-30
申请号：US14843905
申请日：2015-09-02
申请人： APPLE INC.
CPC分类号： H01R12/716 , H01R12/73 , H01R13/5216 , H01R13/5219 , H01R43/005 , H01R43/205
摘要： Board-to-board connectors that may provide durable and reliable connections, may save board space, and may be easy to manufacture. One example may provide board-to-board connectors that provide durable connections by providing a seal between board-to-board plugs and receptacles. The seal may be an O-ring, gasket, or other seal. The seal may protect contacts on the board-to-board connectors from exposure to fluids, such as water or other corrosive fluids. This seal may provide a level of redundancy with one or more seals protecting a device from external fluids, such as a seal at or in the device enclosure.
摘要翻译： 可提供持久可靠连接的板对板连接器可节省电路板空间，并且可以容易地制造。 一个示例可以提供板对板连接器，其通过在板对板插头和插座之间提供密封来提供耐用的连接。 密封件可以是O形圈，垫圈或其他密封件。 密封可以保护板对板连接器上的触点暴露于流体，如水或其他腐蚀性液体。 该密封件可以提供一种冗余度，其中一个或多个密封件可保护设备免受外部流体的影响，例如设备外壳处或设备外壳处的密封。
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公开(公告)号：US20160090326A1
公开(公告)日：2016-03-31
申请号：US14864618
申请日：2015-09-24
申请人： APPLE INC.
CPC分类号： B32B18/00 , B28B1/002 , B28B1/008 , B28B7/0088 , C04B35/645 , C04B2235/602 , C04B2235/6022 , C04B2235/6023 , C04B2235/9615 , C04B2237/343 , C04B2237/348 , H04M1/0202 , H04M1/0266
摘要： A ceramic structure and methods for making the ceramic structure are disclosed. Multiple parts may be molded; the parts may be molded from the same or different ceramic materials. The parts may be formed in the same mold and may be adjacent to and/or attached to one another as a result of molding. The parts may be placed in a sintering furnace and sintered simultaneously. Simultaneously sintering the parts forms a unitary structure from the parts.
摘要翻译： 公开了一种用于制造陶瓷结构的陶瓷结构和方法。 多个部件可以模制; 这些部件可以由相同或不同的陶瓷材料模制。 这些部件可以形成在相同的模具中，并且可以通过模制而相邻和/或附接到彼此。 这些部件可以放置在烧结炉中并同时烧结。 同时烧结部件形成一体的结构。
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公开(公告)号：US20160066448A1
公开(公告)日：2016-03-03
申请号：US14472230
申请日：2014-08-28
申请人： Apple Inc.
CPC分类号： H04M1/0264
摘要： Interlocking first member and optical members and methods of their manufacture. A component formed from an interlocking first member and optical member, where the first member includes a recess formed within a surface and the optical member is disposed in the recess. The recess of the first member may include a recess geometry and the optical member may include a member geometry that may correspond to the recess geometry. Additionally, the interlocking component formed from the first member and optical member may be formed by a coupling process. The coupling process may include sintering the first member and the optical member, bonding the optical member to the first member or providing a compression-load or fit between the first member and the optical member.
摘要翻译： 联锁第一成员和光学构件及其制造方法。 由互锁的第一构件和光学构件形成的构件，其中所述第一构件包括形成在表面内的凹部，并且所述光学构件设置在所述凹部中。 第一构件的凹部可以包括凹槽几何形状，并且光学构件可以包括可对应于凹部几何形状的构件几何形状。 此外，由第一构件和光学构件形成的互锁构件可以通过联接工艺形成。 耦合过程可以包括烧结第一构件和光学构件，将光学构件结合到第一构件或者在第一构件和光学构件之间提供压缩载荷或配合。
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公开(公告)号：US20180364162A1
公开(公告)日：2018-12-20
申请号：US16114003
申请日：2018-08-27
申请人： Apple Inc.
发明人： Trevor J. Ness , Chin San Han , David I. Nazzaro , Marcelo M. Lamego , Naoto Matsuyuki , Wolf Oetting
CPC分类号： G01N21/55 , A61B5/00 , A61B5/0002 , A61B5/0059 , A61B5/021 , A61B5/024 , A61B5/0816 , A61B5/14532 , A61B5/14542 , A61B5/681 , A61B5/7203 , G01N21/4738 , G01N2201/0221 , G01N2201/0625
摘要： An electronic device includes one or more light emitters for emitting light toward an object and one or more light detectors for collecting light exiting the object. A reflective coating, surface, or surface finish can be applied adjacent to the area to which light is emitted and/or through which light exits in order to increase the light collected by the light detector. The reflective coating can be oriented so as to reflect light back into the object.
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公开(公告)号：US09781984B2
公开(公告)日：2017-10-10
申请号：US14691217
申请日：2015-04-20
申请人： Apple Inc.
发明人： Andrzej T. Baranski , Serhan O. Isikman , Tyler S. Bushnell , Steven J. Martisauskas , David I. Nazzaro
CPC分类号： A44C5/2071 , A44C5/0053 , A44C5/0069 , A44C5/08 , A44C5/20 , A45F2005/008 , A61B5/681
摘要： Systems and methods for dynamically adjusting the fit of a wearable electronic device are disclosed. In many embodiments, a tensioner associated with a wearable electronic device can control one or more actuators that are mechanically coupled to either the housing or to a band attached to the wearable electronic device. In one example, in response to a signal to increase the tightness of the band, the tensioner can cause the actuator(s) to increase the tension within the band.
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公开(公告)号：US09750322B2
公开(公告)日：2017-09-05
申请号：US14816277
申请日：2015-08-03
申请人： Apple Inc.
IPC分类号： A45C11/00 , B29C45/14 , B29K709/02 , B29K101/12 , B29L31/34 , B29K101/10
CPC分类号： A45C11/00 , A45C2011/002 , B29C45/14311 , B29C2045/14327 , B29C2045/14868 , B29K2101/10 , B29K2101/12 , B29K2709/02 , B29K2995/0026 , B29L2031/3481
摘要： A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.
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公开(公告)号：US20160255944A1
公开(公告)日：2016-09-08
申请号：US14691217
申请日：2015-04-20
申请人： Apple Inc.
发明人： Andrzej T. Baranski , Serhan O. Isikman , Tyler S. Bushnell , Steven J. Martisauskas , David I. Nazzaro
IPC分类号： A45F5/00
CPC分类号： A44C5/2071 , A44C5/0053 , A44C5/0069 , A44C5/08 , A44C5/20 , A45F2005/008 , A61B5/681
摘要： Systems and methods for dynamically adjusting the fit of a wearable electronic device are disclosed. In many embodiments, a tensioner associated with a wearable electronic device can control one or more actuators that are mechanically coupled to either the housing or to a band attached to the wearable electronic device. In one example, in response to a signal to increase the tightness of the band, the tensioner can cause the actuator(s) to increase the tension within the band.
摘要翻译： 公开了用于动态调节可穿戴式电子设备的配合的系统和方法。 在许多实施例中，与可穿戴电子设备相关联的张紧器可以控制一个或多个机械耦合到壳体或连接到可穿戴电子设备的带的致动器。 在一个示例中，响应于增加带的紧密度的信号，张紧器可以使致动器增加带内的张力。
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公开(公告)号：US09331422B2
公开(公告)日：2016-05-03
申请号：US14299921
申请日：2014-06-09
申请人： APPLE INC.
发明人： David I. Nazzaro , Tyler S. Bushnell , Ibuki Kamei
CPC分类号： H01R13/5216 , H01R13/44 , H01R13/453 , H01R13/46 , H01R13/52 , H01R24/58
摘要： An electronic device has a self-healing elastomer applied over one or more external electronic connectors. The self-healing elastomer may obscure the electronic connectors from the user as well as provide environmental protection for the connector and the electronic device. Electronic probes may temporarily penetrate the self-healing elastomer to mate with the electronic connector. After removal of the probes the self-healing elastomer may elastically reform and self-heal.
摘要翻译： 电子设备具有应用于一个或多个外部电子连接器上的自愈弹性体。 自愈弹性体可能使用户的电子连接器变得模糊，并且为连接器和电子设备提供环境保护。 电子探针可以临时穿透自愈弹性体以与电子连接器配合。 在去除探针之后，自愈弹性体可以弹性改造并自愈。
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