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Patent Agency Ranking
公开(公告)号：US20160256979A1
公开(公告)日：2016-09-08
申请号：US14714876
申请日：2015-05-18
Applicant: Apple Inc.
Inventor： Naoto Matsuyuki , Bin Yi , Dezheng Qu , Jairam Manjunathaiah , Scott M. Nathanson , Trevor J. Ness , David I. Nazzaro , Raul A. Molina
CPC classification number: B24B37/042 , B24B37/02 , B24B37/025 , B29C70/745 , B29C70/88 , C03C25/005 , F16B11/006
Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.
Abstract translation: 一种用于共整理表面的方法将由第一材料形成的第一结构粘结在具有由第二材料形成的第二结构中限定的孔中的第一表面，并且具有第二表面，使得在第一表面和第二表面之间存在偏移 第二个表面。 共同研磨第一表面和第二表面以减少偏移。 第一表面和第二表面被共抛光以进一步减少偏移。 然后第一表面和第二表面可以是齐平的。 可以将第一表面的边缘倒角以减轻在共研磨和/或共抛光期间的损伤。 填充材料可以位于第一和第二结构之间的间隙中，以减轻在共研磨和/或共抛光期间的损伤。
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公开(公告)号：US20190389193A1
公开(公告)日：2019-12-26
申请号：US16145448
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Scott M. Nathanson
Abstract: Methods of laminating a multilayer substrate may utilize particular lamination systems to perform the methods. The methods may include providing the multilayer substrate, which may include a base, in a feed direction through a laminating system. The base may support segments of a material, each segment characterized by a height past the base in a direction normal to the feed direction. Each segment may define a leading edge at an intersection of a second surface and a third surface, and the segments may be separated from one another along the base by a spacing length. The methods may include contacting a first segment with a set of pinch rollers. The contacting may limit interaction with the third surface at the leading edge of the first segment. The methods may include compressing the first segment against the base in a direction normal to the feed direction.
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公开(公告)号：US10773504B2
公开(公告)日：2020-09-15
申请号：US16145448
申请日：2018-09-28
Applicant: Apple Inc.
Inventor： Scott M. Nathanson
Abstract: Methods of laminating a multilayer substrate may utilize particular lamination systems to perform the methods. The methods may include providing the multilayer substrate, which may include a base, in a feed direction through a laminating system. The base may support segments of a material, each segment characterized by a height past the base in a direction normal to the feed direction. Each segment may define a leading edge at an intersection of a second surface and a third surface, and the segments may be separated from one another along the base by a spacing length. The methods may include contacting a first segment with a set of pinch rollers. The contacting may limit interaction with the third surface at the leading edge of the first segment. The methods may include compressing the first segment against the base in a direction normal to the feed direction.
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公开(公告)号：US10207387B2
公开(公告)日：2019-02-19
申请号：US14714876
申请日：2015-05-18
Applicant: Apple Inc.
Inventor： Naoto Matsuyuki , Bin Yi , Dezheng Qu , Jairam Manjunathaiah , Scott M. Nathanson , Trevor J. Ness , David I. Nazzaro , Raul A. Molina
IPC: B24B37/04 , B29C70/74 , C03C25/005 , B29C70/88 , B24B37/025 , B24B37/02
Abstract: A method for co-finishing surfaces bonds a first structure formed of a first material and having a first surface in an aperture defined in a second structure formed of a second material and having a second surface such that there is an offset between the first surface and the second surface. The first surface and the second surface are co-lapped to reduce the offset. The first surface and second surface are co-polished to further reduce the offset. The first surface and second surfaces may then be flush. Edges of the first surface may be chamfered to mitigate damage during co-lapping and/or co-polishing. Fill material may be positioned in gaps between the first and second structures to mitigate damage during co-lapping and/or co-polishing.
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公开(公告)号：US09120257B2
公开(公告)日：2015-09-01
申请号：US13740089
申请日：2013-01-11
Applicant: Apple Inc.
Inventor： Scott M. Nathanson
CPC classification number: B29C45/14065 , B29C45/14008 , B29C45/14016 , B29C45/14655 , B29L2031/3481 , G06F1/1626 , Y10T29/49
Abstract: Methods and devices for forming a composite carrier frame assembly used in an injection molding process are described. Methods and devices described herein are well suited for insert molding multiple small pieces into a single injection molded part. The composite carrier frame assembly can include a number of insert attached thereto that are positioned in a pre-determined arrangement such during an injection molding process the inserts are molded in a molded part in the pre-determined arrangement. Each insert can include an anchor portion arranged to be molded in the single injection molded part and an exterior portion arranged to be positioned exterior to the single injection molded part.
Abstract translation: 描述了在注射成型工艺中使用的用于形成复合载体框架组件的方法和装置。 本文所述的方法和装置非常适用于将多个小件嵌入成型为单个注模部件。 复合载体框架组件可以包括附接到其上的多个插入件，其以预定布置定位，例如在注塑成型过程中，插入件以预定布置模制在模制部件中。 每个插入件可以包括布置成模制在单个注塑部件中的锚定部分和布置成位于单个注射成型部件外部的外部部分。
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