知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

59 records (took 0.033 seconds)

    3D SHAPED INDUCTIVE CHARGING COIL AND METHOD OF MAKING THE SAME
    5.
    发明申请
    3D SHAPED INDUCTIVE CHARGING COIL AND METHOD OF MAKING THE SAME 审中-公开
    3D形状电感充电线圈及其制造方法

    公开(公告)号：US20170054318A1

    公开(公告)日：2017-02-23

    申请号：US15082935

    申请日：2016-03-28

    Applicant: APPLE INC.

    Inventor： Naoto Matsuyuki ,  Christopher S. Graham ,  Makiko K. Brzezinski

    IPC: H02J7/02 ,  H01L23/522

    CPC classification number: H02J7/025 ,  H01F27/2871 ,  H01F27/327 ,  H01F38/14 ,  H01F41/127 ,  H01F2027/2809 ,  H01L23/5226 ,  H01L23/5227 ,  H02J5/005 ,  H02J50/10

    Abstract: A three-dimensional inductive charging coil assembly and a method of making the same. The method can include patterning a first conductive layer affixed to a first surface of an insulating layer to form a coil configured to transmit or receive power, patterning a second conductive layer affixed to a second surface of the insulating layer opposite the first surface to form a conductive trace element, and electrically coupling the coil and the conductive trace element. The coil, insulating layer, and conductive trace element can be molded (e.g., simultaneously) into a three dimensional shape. In some embodiment, the molding can include a thermoforming process such as compression molding, vacuum forming, or the like.

    Abstract translation: 一种三维感应充电线圈组件及其制造方法。 该方法可以包括图案化固定到绝缘层的第一表面的第一导电层，以形成被配置为传递或接收电力的线圈，图案化固定到与第一表面相对的绝缘层的第二表面的第二导电层，以形成 导电微量元件，并且电耦合线圈和导电微量元件。 线圈，绝缘层和导电微量元件可以模制（例如，同时）成三维形状。 在一些实施例中，模制件可以包括热成型工艺，例如压塑，真空成型等。

    WATERPROOF BOARD-TO-BOARD CONNECTORS
    6.
    发明申请
    WATERPROOF BOARD-TO-BOARD CONNECTORS 有权
    防水板到板连接器

    公开(公告)号：US20160190719A1

    公开(公告)日：2016-06-30

    申请号：US14843905

    申请日：2015-09-02

    Applicant: APPLE INC.

    Inventor： Makiko K. Brzezinski ,  Tyler S. Bushnell ,  David I. Nazzaro

    IPC: H01R12/71 ,  H01R43/20

    CPC classification number: H01R12/716 ,  H01R12/73 ,  H01R13/5216 ,  H01R13/5219 ,  H01R43/005 ,  H01R43/205

    Abstract: Board-to-board connectors that may provide durable and reliable connections, may save board space, and may be easy to manufacture. One example may provide board-to-board connectors that provide durable connections by providing a seal between board-to-board plugs and receptacles. The seal may be an O-ring, gasket, or other seal. The seal may protect contacts on the board-to-board connectors from exposure to fluids, such as water or other corrosive fluids. This seal may provide a level of redundancy with one or more seals protecting a device from external fluids, such as a seal at or in the device enclosure.

    Abstract translation: 可提供持久可靠连接的板对板连接器可节省电路板空间，并且可以容易地制造。 一个示例可以提供板对板连接器，其通过在板对板插头和插座之间提供密封来提供耐用的连接。 密封件可以是O形圈，垫圈或其他密封件。 密封可以保护板对板连接器上的触点暴露于流体，如水或其他腐蚀性液体。 该密封件可以提供一种冗余度，其中一个或多个密封件可保护设备免受外部流体的影响，例如设备外壳处或设备外壳处的密封。

Patent Agency Ranking