公开(公告)号：US10699842B2

公开(公告)日：2020-06-30

申请号：US14843687

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Christopher S. Graham ,  Karl Ruben K. Larsson ,  Paul J. Thompson ,  Eric S. Jol ,  John S. Mosy ,  Albert J. Golko ,  Stephen E. Yao ,  Makiko K. Brzezinski

IPC: H01F38/12 ,  H01F27/36 ,  H01F27/24 ,  H01F1/26 ,  H01F1/37 ,  H01F38/14

Abstract: In some embodiments, an electronic device includes an electronic component that is at least partially encapsulated by an adhesive doped with soft magnetic material that functions as an EMI shield for the electronic component. In various embodiments, an electronic device includes a first magnetic component separated from a second magnetic component by a gap within which is positioned an adhesive doped with soft magnetic material. The doped adhesive is positioned in a magnetic path between the first and second magnetic components and aids in magnetically coupling the first and second magnetic components and/or guides magnetic flux between the first and second magnetic components.

公开(公告)号：US20160064141A1

公开(公告)日：2016-03-03

申请号：US14843687

申请日：2015-09-02

Applicant: Apple Inc.

Inventor： Christopher S. Graham ,  Karl Ruben F. Larsson ,  Paul J. Thompson ,  Eric S. Jol ,  John S. Mosy ,  Albert J. Golko ,  Stephen E. Yao ,  Makiko K. Brzezinski

IPC: H01F27/36 ,  H01F27/24 ,  H01F1/147 ,  H01F1/153

CPC classification number: H01F27/365 ,  H01F1/26 ,  H01F1/37 ,  H01F27/24 ,  H01F38/14

Abstract: In some embodiments, an electronic device includes an electronic component that is at least partially encapsulated by an adhesive doped with soft magnetic material that functions as an EMI shield for the electronic component. In various embodiments, an electronic device includes a first magnetic component separated from a second magnetic component by a gap within which is positioned an adhesive doped with soft magnetic material. The doped adhesive is positioned in a magnetic path between the first and second magnetic components and aids in magnetically coupling the first and second magnetic components and/or guides magnetic flux between the first and second magnetic components.

Abstract translation: 在一些实施例中，电子设备包括电子部件，该电子部件至少部分地被掺杂有用作电子部件的EMI屏蔽的软磁材料的粘合剂封装。 在各种实施例中，电子设备包括通过间隙与第二磁性部件分离的第一磁性部件，其中定位有掺杂有软磁性材料的粘合剂。 掺杂的粘合剂位于第一和第二磁性部件之间的磁路中，并且有助于磁耦合第一和第二磁性部件和/或引导第一和第二磁性部件之间的磁通量。