Adaptive processes for improving integrity of surfaces

    公开(公告)号:US10162343B2

    公开(公告)日:2018-12-25

    申请号:US14339125

    申请日:2014-07-23

    申请人: Apple Inc.

    摘要: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

    ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES
    3.
    发明申请
    ADAPTIVE PROCESSES FOR IMPROVING INTEGRITY OF SURFACES 审中-公开
    改善表面完整性的自适应方法

    公开(公告)号:US20160026176A1

    公开(公告)日:2016-01-28

    申请号:US14339125

    申请日:2014-07-23

    申请人: Apple Inc.

    IPC分类号: G05B19/418 H05K13/00

    摘要: A process for performing localized corrective actions to structure of an electronic device is described. The structure may include a mating surface configured to receive another structure such that the two structures may be, for example, adhesively bonded together. The localized corrective actions are configured not to improve the mating surface but to also prevent light within the electronic device from escaping in undesired areas of the electronic device. In some embodiments, the corrective action includes using a removal tool to remove identified portions of the surface. In other embodiments, the corrective action includes using a different tool to add material identified portions of the surface. The identified means may include an automated inspection system.

    摘要翻译: 描述用于执行电子设备结构的局部校正动作的处理。 结构可以包括配置为接收另一结构的配合表面,使得两个结构可以例如粘合在一起。 局部校正动作被配置为不改善配合表面,而且还防止电子设备内的光逸出在电子设备的不期望的区域中。 在一些实施例中,校正动作包括使用移除工具去除表面的识别部分。 在其他实施例中,校正动作包括使用不同的工具来添加表面的材料识别部分。 所识别的装置可以包括自动检查系统。

    Unibody magnet
    4.
    发明授权
    Unibody magnet 有权
    单体磁铁

    公开(公告)号:US08717132B2

    公开(公告)日:2014-05-06

    申请号:US13626881

    申请日:2012-09-26

    申请人: Apple Inc.

    IPC分类号: H01F7/02

    摘要: A method for plating magnets with metal is disclosed. In one embodiment, the metal is aluminum and the aluminum plating provides a number of aesthetic and structural advantages, over brittle magnetic materials, which are only plated with a thin, anti-corrosive metallic layer. More specifically, methods for creating multi-pole bar magnets and structural elements primarily with aluminum coated magnetic material are disclosed.

    摘要翻译: 公开了一种用金属电镀磁铁的方法。 在一个实施例中,金属是铝,并且铝电镀提供了比脆性磁性材料多的美观和结构优点,它们仅镀有薄的防腐蚀金属层。 更具体地,公开了用于主要用铝涂覆的磁性材料制造多极棒磁体和结构元件的方法。

    METHOD FOR SMOOTHING SUBSTRATE SURFACE
    5.
    发明申请

    公开(公告)号:US20190291133A1

    公开(公告)日:2019-09-26

    申请号:US16440883

    申请日:2019-06-13

    申请人: Apple Inc.

    摘要: Methods for modifying contours of substrate surfaces are disclosed. Methods include depositing filler material on a critical mating surface of a substrate so as to render the mating surface more mateable with a matching substrate. The filler material can be deposited within or around features or defects on the mating surface such that a final desired surface contour is achieved. In some cases, the final surface contour of the mating surface is planar. This can prevent gaps associated with the features or defects from forming between the substrate and the matching substrate when they are joined together. The final surface contour of the mating surface can be determined by comparing dimensions of the mating surface to dimensions of a reference surface. In some cases, ink jet printing techniques are used to deposit the filler material accurately in prescribed locations and with precise thickness control.

    ENCLOSURE STIFFENER FOR ELECTRONIC DEVICE
    10.
    发明申请
    ENCLOSURE STIFFENER FOR ELECTRONIC DEVICE 有权
    用于电子设备的外壳加强器

    公开(公告)号:US20160054762A1

    公开(公告)日:2016-02-25

    申请号:US14641199

    申请日:2015-03-06

    申请人: Apple Inc.

    IPC分类号: G06F1/16 H05K5/00 H05K5/02

    CPC分类号: G06F1/1656 G06F1/1637

    摘要: An electronic device can include a processor, output device(s) coupled thereto, and an outer housing or enclosure containing these and other electronic and/or optical items. The enclosure can include a substantially thin contoured component having an external surface exposed to a user and an internal surface. A stiffening plate situated with respect to the internal surface provides a substantial increase in the torsional stiffness and/or bending stiffness of the enclosure. The stiffening plate and contoured component can form a cavity therebetween, and one or more ridges, fins, plates, foam structures and/or other structural items can be located within the cavity. In various embodiments, the device can be a laptop computer and the contoured component can be a dome shaped outer housing behind the display portion thereof.

    摘要翻译: 电子设备可以包括处理器,耦合到其的输出设备,以及容纳这些和其它电子和/或光学物品的外壳或外壳。 外壳可以包括具有暴露于使用者的外表面和内表面的基本上薄的轮廓部件。 相对于内表面设置的加强板提供了外壳的扭转刚度和/或弯曲刚度的显着增加。 加强板和轮廓部件可以在其间形成空腔,并且一个或多个脊,翅片,板,泡沫结构和/或其它结构物品可以位于空腔内。 在各种实施例中,设备可以是膝上型计算机,并且轮廓部件可以是其显示部分后面的圆顶形外壳。