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公开(公告)号：US11868542B2
公开(公告)日：2024-01-09
申请号：US17806118
申请日：2022-06-09
申请人： Apple Inc.
发明人： Michelle R. Goldberg , Kathleen A. Bergeron , Paul X. Wang , Alex J. Lehmann , William P. Yarak, III , Kevin C. Armendariz , Zheng Gao
IPC分类号： H01H13/14 , G06F3/02 , H01H13/83 , H01H13/705 , H01H11/00 , H01H3/12 , H01H13/7065 , H01H13/88
CPC分类号： G06F3/0202 , H01H3/122 , H01H11/00 , H01H13/14 , H01H13/705 , H01H13/7065 , H01H13/83 , H01H3/12 , H01H13/88 , H01H2203/02 , H01H2219/044 , H01H2219/056 , H01H2219/062 , H01H2229/048
摘要： Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
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公开(公告)号：US10086484B2
公开(公告)日：2018-10-02
申请号：US13651000
申请日：2012-10-12
申请人： Apple Inc.
发明人： David J. Morgenstern , Laura M. DeForest , Michelle R. Goldberg , Nicholas Alan Rundle , Yuna Hu , Michael K. Morishita , Jacek M. Kolodziejski
IPC分类号： B23P17/00 , B21D24/04 , B21D22/20 , B21D19/08 , B21D22/26 , B23P11/00 , B23C3/00 , B21K23/00
摘要： Examples of tooling fixtures and methods for manufacturing computing devices are described. According to some examples, a computer component may be shaped using successive steps of forging after deep drawing. In some examples, certain components may be assembled to form sub-assemblies of computer components and the sub-assembly may then be machined to drive closer tolerances. According to other examples, a work holding tool is described which may include a first plurality of individually movable pins for supporting a first surface of a work piece, the tool also having a second plurality of individually movable pins for applying a restraining force over a second opposite surface of the work piece to retain the work piece in position while maintaining it in its natural state.
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公开(公告)号：US11379049B2
公开(公告)日：2022-07-05
申请号：US16353915
申请日：2019-03-14
申请人： Apple Inc.
发明人： Michelle R. Goldberg , Kathleen A. Bergeron , Paul X. Wang , Alex J. Lehmann , William P. Yarak, III , Kevin C. Armendariz , Zheng Gao
IPC分类号： H01H3/12 , G06F3/02 , H01H13/14 , H01H13/83 , H01H13/705 , H01H11/00 , H01H13/7065 , H01H13/88
摘要： Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
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公开(公告)号：US20190056794A1
公开(公告)日：2019-02-21
申请号：US15681322
申请日：2017-08-18
申请人： Apple Inc.
发明人： Michelle R. Goldberg , Kathleen A. Bergeron , Paul X. Wang , Alex J. Lehmann , William P. Yarak, III , Kevin C. Armendariz , Zheng Gao
IPC分类号： G06F3/02 , H01H13/14 , H01H13/83 , H01H13/705 , H01H11/00
摘要： Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
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公开(公告)号：US09497529B2
公开(公告)日：2016-11-15
申请号：US14183306
申请日：2014-02-18
申请人： Apple Inc.
CPC分类号： H04R1/086 , H04R19/005 , H04R19/04 , H04R2499/11
摘要： An electronic device may be provided with a microphone in a microphone port. A shield may cover a microelectromechanical systems microphone device on a microphone substrate. An opening in the microphone substrate may form a sound port for the microphone. The microphone port may be formed by perforations in the microphone substrate or other layers such as a flexible printed circuit layer, a sheet metal layer, a layer of adhesive, a flexible polymer carrier layer in an adhesive tape, or an electronic device housing. The perforations may be sufficiently small to help resist the intrusions of foreign material such as liquid and dirt into the sound port of the microphone. Larger openings may be formed in other structures such as an electronic device housing. The larger openings may serve as sound passageways for the microphone port while being sufficiently large to resist clogging.
摘要翻译： 电子设备可以在麦克风端口中设置有麦克风。 屏蔽可覆盖麦克风基板上的微机电系统麦克风装置。 麦克风基板上的开口可以形成麦克风的声音端口。 麦克风端口可以由麦克风基板或其它层中的穿孔形成，例如柔性印刷电路层，金属薄片层，粘合剂层，胶带中的柔性聚合物载体层或电子设备外壳。 穿孔可以足够小以帮助抵抗诸如液体和污物的异物侵入到麦克风的声音口中。 可以在诸如电子设备外壳的其它结构中形成更大的开口。 较大的开口可以用作麦克风端口的声音通道，同时足够大以抵抗堵塞。
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公开(公告)号：US20150246394A1
公开(公告)日：2015-09-03
申请号：US14577723
申请日：2014-12-19
申请人： Apple Inc.
发明人： Simon Regis Louis Lancaster-Larocque , Ari P. Miller , Laura M. DeForest , Michelle R. Goldberg , William F. Leggett , Adam T. Garelli
摘要： The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.
摘要翻译： 所描述的实施例一般涉及通过固态沉积工艺形成结构的方法。 更具体地，公开了一种在可移除体上沉积冷喷雾的方法。 还公开了将操作和结构部件固定到具有冷喷雾的装置壳体的表面的方法。
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公开(公告)号：US20150237431A1
公开(公告)日：2015-08-20
申请号：US14183306
申请日：2014-02-18
申请人： Apple Inc.
IPC分类号： H04R1/04
CPC分类号： H04R1/086 , H04R19/005 , H04R19/04 , H04R2499/11
摘要： An electronic device may be provided with a microphone in a microphone port. A shield may cover a microelectromechanical systems microphone device on a microphone substrate. An opening in the microphone substrate may form a sound port for the microphone. The microphone port may be formed by perforations in the microphone substrate or other layers such as a flexible printed circuit layer, a sheet metal layer, a layer of adhesive, a flexible polymer carrier layer in an adhesive tape, or an electronic device housing. The perforations may be sufficiently small to help resist the intrusions of foreign material such as liquid and dirt into the sound port of the microphone. Larger openings may be formed in other structures such as an electronic device housing. The larger openings may serve as sound passageways for the microphone port while being sufficiently large to resist clogging.
摘要翻译： 电子设备可以在麦克风端口中设置有麦克风。 屏蔽可覆盖麦克风基板上的微机电系统麦克风装置。 麦克风基板上的开口可以形成麦克风的声音端口。 麦克风端口可以由麦克风基板或其它层中的穿孔形成，例如柔性印刷电路层，金属薄片层，粘合剂层，胶带中的柔性聚合物载体层或电子设备外壳。 穿孔可以足够小以帮助抵抗诸如液体和污物的异物侵入到麦克风的声音口中。 可以在诸如电子设备外壳的其它结构中形成更大的开口。 较大的开口可以用作麦克风端口的声音通道，同时足够大以抵抗堵塞。
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公开(公告)号：US20190212831A1
公开(公告)日：2019-07-11
申请号：US16353915
申请日：2019-03-14
申请人： Apple Inc.
发明人： Michelle R. Goldberg , Kathleen A. Bergeron , Paul X. Wang , Alex J. Lehmann , William P. Yarak, III , Kevin C. Armendariz , Zheng Gao
IPC分类号： G06F3/02 , H01H11/00 , H01H13/83 , H01H13/14 , H01H13/705
CPC分类号： G06F3/0202 , H01H3/12 , H01H11/00 , H01H13/14 , H01H13/705 , H01H13/83 , H01H13/88
摘要： Embodiments are directed to a low profile key for a keyboard having an overmolded support structure. In one aspect, an embodiment includes a key cap having an illuminable symbol. A support structure having a pair of overmolded wings may pivotally couple to the key cap. A switch housing may surround the support structure and connect each of the first and second wings. A tactile dome may be at least partially positioned within the switch housing and configured to bias the key cap upward. A sensing membrane may be positioned along an underside surface of the tactile dome and configured to trigger a switch event in response to a collapsing of the tactile dome caused by a depression of the key cap. A feature plate may be positioned below the sensing membrane. A light guide panel may define at least one light extraction feature that may be configured to propagate light toward the key cap and cause illumination of the illuminable symbol.
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公开(公告)号：US10016933B2
公开(公告)日：2018-07-10
申请号：US14183253
申请日：2014-02-18
申请人： Apple Inc.
发明人： Fabio T. Campos , Keith J. Hendren , Laura M. DeForest , Michelle R. Goldberg , Kelsey J. MacMillan , Bryan J. Licata
CPC分类号： B29C65/4825 , B23B31/14 , F16B11/006 , G06F1/1626 , Y10T29/49947 , Y10T29/4995 , Y10T29/49952 , Y10T29/49954 , Y10T29/53974 , Y10T279/24 , Y10T279/247
摘要： The described embodiments relate generally to methods of assembly of electronic devices. In particular, a rotationally induced pressure is used to activate a securing mechanism positioned between a component and an enclosure. The component and the securing mechanism may be located in an inaccessible region of the enclosure such that traditional, direct, assembly processes may not be feasible. The securing mechanism may take the form of a layer of pressure sensitive adhesive or a fastener between the component and an interior surface of the enclosure.
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公开(公告)号：US09884369B2
公开(公告)日：2018-02-06
申请号：US14577723
申请日：2014-12-19
申请人： Apple Inc.
发明人： Simon Regis Louis Lancaster-Larocque , Ari P. Miller , Laura M. DeForest , Michelle R. Goldberg , William F. Leggett , Adam T. Garelli
摘要： The described embodiments relate generally to methods for forming structures by solid state deposition processes. More specifically a method for depositing cold spray over a removable body is disclosed. Methods are also disclosed for affixing operational and structural components to a surface of a device housing with cold spray.
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