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    LED package and LED die
    2.
    发明授权
    LED package and LED die 有权

    公开(公告)号：US09660144B2

    公开(公告)日：2017-05-23

    申请号：US14832692

    申请日：2015-08-21

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Chao-Hsiung Chang ,  Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: H01L33/38 ,  H01L33/44 ,  H01L33/48

    CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/44 ,  H01L33/486 ,  H01L2933/0016

    Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

    Flip-chip light emitting diode package with moisture barrier layer
    3.
    发明授权
    Flip-chip light emitting diode package with moisture barrier layer 有权
    倒装芯片发光二极管封装，带防潮层

    公开(公告)号：US09065028B2

    公开(公告)日：2015-06-23

    申请号：US14096031

    申请日：2013-12-04

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

    IPC: H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.

    Abstract translation: 示例性发光二极管（LED）封装包括衬底，穿过衬底向下穿过的第一电极，穿过衬底向下穿过并与第一电极间隔开的第二电极，布置在衬底上并安装到第一和 通过倒装芯片技术的第二电极，以及形成在基板上以将LED管芯封装在其中的封装层。 基板包括在其相对侧的顶表面和底表面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在LED封装的底部附着防潮层，以覆盖第一和/或第二电极和基板的接头。

    Light emitting diode package and method for manufacturing the same
    4.
    发明授权
    Light emitting diode package and method for manufacturing the same 有权
    发光二极管封装及其制造方法

    公开(公告)号：US09041022B2

    公开(公告)日：2015-05-26

    申请号：US14011682

    申请日：2013-08-27

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Che-Hsang Huang ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng ,  Yu-Liang Huang

    IPC: H01L33/36 ,  H01L25/075 ,  H01L23/00 ,  H01L33/62

    CPC classification number: H01L33/36 ,  H01L24/97 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2924/12041 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.

    Abstract translation: 示例性发光二极管（LED）封装包括电绝缘基板，嵌入绝缘基板中的电极结构以及分别与电极结构的电极电连接的多个LED芯片。 电极结构包括位于第一和第二电极之间的第一电极，第二电极和第三电极。 第一，第二和第三电极的顶表面露出绝缘衬底的顶表面以支撑LED芯片。 第一和第二电极的前侧面和后侧面从基板的前侧面和后侧面露出，由此第一和第二电极的前侧面和后侧面可与印刷电路板的焊盘连接 板。 第三电极的周向侧面被封装在基板中。

    Backlight module with light-guiding portions
    5.
    发明授权
    Backlight module with light-guiding portions 有权
    带光导部分的背光模组

    公开(公告)号：US09039222B2

    公开(公告)日：2015-05-26

    申请号：US13926084

    申请日：2013-06-25

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Li-Hsiang Chen

    IPC: G09F13/08 ,  F21V8/00 ,  F21V5/00

    CPC classification number: G02B6/0011 ,  F21V5/00 ,  G02B19/0061 ,  G02F1/133603 ,  G02F1/133606

    Abstract: A backlight module includes a substrate, a plurality of LED packages mounted on the substrate and a light diffusion board located above the LED packages. The light diffusion board includes a light incident surface facing toward the LED packages and a light output surface. A plurality of light-guiding portions is configured extending from the incident surface of the light diffusion board toward the LED package. Each light-guiding portion comprises a concave surface at an outer periphery thereof. A diameter of each light-guiding portion decreases gradually from light diffusion board toward the LED packages. The concave surface of each light-guiding portion is recessed inwardly from the outer periphery of the light-guiding portion. Light from the LED packages and emitting into the light-guiding potions is divergently and uniformly adjusted into the light diffusion board by the concave surfaces of the light-guiding portions.

    Abstract translation: 背光模块包括基板，安装在基板上的多个LED封装以及位于LED封装之上的光漫射板。 光漫射板包括面向LED封装的光入射表面和光输出表面。 多个导光部被配置为从光扩散板的入射面向LED封装延伸。 每个导光部分在其外周边包括凹面。 每个导光部分的直径从光扩散板朝向LED封装逐渐减小。 每个导光部分的凹面从导光部分的外周向内凹入。 来自LED封装并发射到导光部分的光通过导光部分的凹面发散均匀地调整到光扩散板中。

    Light emitting diode package
    6.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US08981447B2

    公开(公告)日：2015-03-17

    申请号：US14014424

    申请日：2013-08-30

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

    IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/52

    CPC classification number: H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.

    Abstract translation: LED封装包括第一电极，第二电极，连接第一电极和第二电极的反射杯以及LED芯片。 第一电极包括第一主要部分和从第一主要部分向外延伸的第一连接部分。 第一连接部分具有远离第一主要部分的第一连接面。 第二电极包括从第二主要部分向外延伸的第二主要部分和第二连接部分。 第二连接部分具有远离第二主要部分的第二连接面。 第一主要部分和第二主要部分嵌入到接收杯中，并且第一连接部分的第一连接面和第二连接部分的第二连接面暴露在接收杯的外部。

    LED
    7.
    发明授权
    LED 有权

    公开(公告)号：US08981419B2

    公开(公告)日：2015-03-17

    申请号：US13919003

    申请日：2013-06-17

    Applicant: Advanced Optoelectronic Technology, Inc.

    Inventor： Hsin-Chiang Lin ,  Pin-Chuan Chen

    IPC: H01L33/00 ,  H01L33/54 ,  H01L33/48

    CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

    Abstract translation: LED包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体在其中心区域中限定空腔和邻近其周向周边的腔室。 引线的顶面暴露在腔室中。 在室中形成阻挡壁以接触引线的暴露的顶面。 阻挡壁和引线之间的接合力大于引线和外壳之间的结合力。

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