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    Optical lens, backlight module and display device using same
    1.
    发明授权
    Optical lens, backlight module and display device using same 有权

    公开(公告)号：US10890802B2

    公开(公告)日：2021-01-12

    申请号：US16680784

    申请日：2019-11-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Chao-Hsiung Chang ,  Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Hou-Te Lin

    IPC: G02F1/13357

    Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

    LED package with reflecting cup
    4.
    发明授权
    LED package with reflecting cup 有权
    LED包装与反光杯

    公开(公告)号：US09431591B1

    公开(公告)日：2016-08-30

    申请号：US14825618

    申请日：2015-08-13

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: H01L33/60 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50 ,  H01L33/54

    CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/505

    Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, and a phosphor layer. The LED die are electrically connected with the electrodes. The LED die includes a top light emitting surface and a plurality of lateral sides extending downward from the top light emitting surface. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The inner surface contacts with bottom portion of the LED die. A cavity is defined between the inner surface and other portion except the bottom portion of the LED die. The phosphor layer covers and seals the LED die.

    Abstract translation: 本公开提供一种发光二极管封装，其包括多个电极，LED管芯，反射杯和荧光体层。 LED管芯与电极电连接。 LED管芯包括顶部发光表面和从顶部发光表面向下延伸的多个侧向侧面。 反射杯形成在电极上并围绕LED管芯。 反射杯包括内表面。 内表面与LED管芯的底部接触。 在内表面和除了LED管芯的底部之外的其它部分之间限定空腔。 荧光体层覆盖并密封LED管芯。

    Light emitting diode package
    6.
    发明授权
    Light emitting diode package 有权
    发光二极管封装

    公开(公告)号：US09048408B2

    公开(公告)日：2015-06-02

    申请号：US14077219

    申请日：2013-11-12

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

    IPC: H01L33/62 ,  H01L33/48

    CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L2224/13 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A light emitting diode (LED) package includes a substrate, a first electrode and a second electrode embedded in the substrate and spaced from each other, an LED die mounted on a top surface of the substrate and electrically connected to the first and the second electrodes. Both the first and the second electrodes include a top face and a bottom face, with the top face and the bottom face of each of the first and the second electrodes being exposed at the top surface and a bottom surface of the substrate, respectively. The top face of the first electrode defines a first groove corresponding to a positive bonding pad (p-pad) of the LED die. The p-pad is partially inserted into the first groove. An oxidation-resistant metal coating layer is filled between an insertion portion of the p-pad and an inner surface of the first groove.

    Abstract translation: 发光二极管（LED）封装包括衬底，第一电极和嵌入在衬底中并彼此间隔开的第二电极，安装在衬底的顶表面上并电连接到第一和第二电极的LED管芯 。 第一和第二电极都包括顶面和底面，其中第一和第二电极中的每一个的顶面和底面分别暴露在基板的顶表面和底表面处。 第一电极的顶面限定对应于LED管芯的正焊盘（p焊盘）的第一槽。 p焊盘部分地插入第一凹槽中。 在p垫的插入部分和第一槽的内表面之间填充抗氧化金属涂层。

    LED package and LED die
    10.
    发明授权
    LED package and LED die 有权

    公开(公告)号：US09660144B2

    公开(公告)日：2017-05-23

    申请号：US14832692

    申请日：2015-08-21

    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

    Inventor： Chao-Hsiung Chang ,  Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

    IPC: H01L33/38 ,  H01L33/44 ,  H01L33/48

    CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/44 ,  H01L33/486 ,  H01L2933/0016

    Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

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