公开(公告)号：US10510931B2

公开(公告)日：2019-12-17

申请号：US15972240

申请日：2018-05-07

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Yi-Sen Lin ,  Chin-Fu Cheng ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/54 ,  H01L33/56 ,  F21V8/00 ,  H01L33/36

Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.

公开(公告)号：US09899359B1

公开(公告)日：2018-02-20

申请号：US15627560

申请日：2017-06-20

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Chin-Fu Cheng ,  Chih-Hsun Ke

IPC: H01L33/20 ,  H01L25/13 ,  H01L33/60 ,  H01L33/62

CPC classification number: H01L25/13 ,  H01L33/20 ,  H01L33/60 ,  H01L33/62 ,  H01L2933/0033 ,  H01L2933/0058 ,  H01L2933/0066

Abstract: A vertically shallow LED package structure includes at least one LED chip, a package layer, and a first cover layer. Each LED chip includes a first bottom surface. The package layer covers and wraps around each LED chip, and can absorb light emitted by each LED chip and emit light with a different preset wavelength. The package layer includes a second bottom surface facing the first bottom surface, a first side surface perpendicular to the second bottom surface, and a convex surface interconnecting the second bottom surface and the first side surface. The convex surface protrudes away from the LED chip. The convex surface can reflect the light with the preset wavelength towards the first side surface. The first cover layer covers the package layer and exposes the first side surface.