公开(公告)号：US10510931B2

公开(公告)日：2019-12-17

申请号：US15972240

申请日：2018-05-07

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Yi-Sen Lin ,  Chin-Fu Cheng ,  Wen-Liang Tseng ,  Pin-Chuan Chen

IPC: H01L33/48 ,  H01L33/64 ,  H01L33/54 ,  H01L33/56 ,  F21V8/00 ,  H01L33/36

Abstract: A narrower LED package structure with sideways output of light suitable for a light guide plate includes two first electrodes, a package body, a cover layer, and two second electrodes. The LED chip is mounted on the first electrodes. The package body encapsulates the first electrodes, and surrounds the LED chip to define a light emitting region. The cover layer infills the light emitting region and covers the LED chip. The second electrodes are positioned outside the package body. Along a plane parallel to the first electrodes, a surface area of the two second electrodes is greater than a surface area of the portion of the two first electrodes positioned in the light emitting region.