公开(公告)号：US10890802B2

公开(公告)日：2021-01-12

申请号：US16680784

申请日：2019-11-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Chao-Hsiung Chang ,  Lung-Hsin Chen ,  Wen-Liang Tseng ,  Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Hou-Te Lin

IPC: G02F1/13357

Abstract: A backlight module capable of simple manufacture and a display device using the backlight module are provided. A reflective sheet to redirect the light from LEDs or other light source is located in position on the backlight module by means of optical lenses, which also spread the light for better uniformity of lighting. The optical lens includes inclined surfaces which form an opening with a circuit board that allows engagement of a reflective sheet. The reflective sheet is between the optical lens and the circuit board. The manufacturing step of fixing the reflective sheet to the circuit board is not required, and when any LED or other light emitting element, or the circuit board itself, fails, it is only necessary to disassemble the optical lens at the one position. Assembly and maintenance efficiency are improved, and the reliability of the backlight module and the display device is improved.

公开(公告)号：US08835198B2

公开(公告)日：2014-09-16

申请号：US14038767

申请日：2013-09-27

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Pin-Chuan Chen ,  Hsin-Chiang Lin

IPC: H01L21/00 ,  H01L33/54 ,  H01L33/48 ,  H01L33/56

CPC classification number: H01L33/56 ,  H01L33/486 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2933/005 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An LED (light emitting diode) includes a base, a pair of leads fixed on the base, a housing secured on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity to receive the chip. The cavity includes an upper chamber and a lower chamber communicating with the upper chamber. The lower chamber is gradually expanded along a top-to-bottom direction of the LED, and the upper chamber is gradually expanded along a bottom-to-top direction of the LED. The encapsulant substantially fills the lower chamber and the upper chamber. A method for manufacturing the LED is also disclosed.

Abstract translation: LED（发光二极管）包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体限定了一个容纳芯片的腔体。 空腔包括与上室连通的上室和下室。 下室沿着LED的顶部到底部的方向逐渐扩大，并且上部腔室沿着LED的底部到顶部的方向逐渐扩大。 密封剂基本上填充下腔室和上腔室。 还公开了一种制造LED的方法。

公开(公告)号：US09786642B1

公开(公告)日：2017-10-10

申请号：US15252860

申请日：2016-08-31

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Chao-Hsiung Chang

IPC: H01L25/16 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L27/02 ,  H01L29/866

CPC classification number: H01L25/167 ,  H01L25/165 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.

公开(公告)号：US08981419B2

公开(公告)日：2015-03-17

申请号：US13919003

申请日：2013-06-17

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/48

CPC classification number: H01L33/54 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED includes a base, a pair of leads fixed on the base, a housing fixed on the leads, a chip mounted on one lead and an encapsulant sealing the chip. The housing defines a cavity in a central area thereof and a chamber adjacent to a circumferential periphery thereof. Top faces of the leads are exposed in the chamber. A blocking wall is formed in the chamber to contact the exposed top faces of the leads. A bonding force between the blocking wall and the leads is larger than that between the leads and the housing.

Abstract translation: LED包括基座，固定在基座上的一对引线，固定在引线上的壳体，安装在一个引线上的芯片和密封芯片的密封剂。 壳体在其中心区域中限定空腔和邻近其周向周边的腔室。 引线的顶面暴露在腔室中。 在室中形成阻挡壁以接触引线的暴露的顶面。 阻挡壁和引线之间的接合力大于引线和外壳之间的结合力。

公开(公告)号：US10705376B2

公开(公告)日：2020-07-07

申请号：US15800165

申请日：2017-11-01

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hsin-Chiang Lin ,  Chien-Cheng Kuo ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

IPC: G02F1/1335 ,  G02F1/13357

Abstract: A liquid crystal display device comprises a backlight module and a liquid crystal display module in a light emitting path of the backlight module. The liquid crystal display module includes a first conductive substrate facing the backlight module, a second conductive substrate spaced apart from the first conductive substrate, and a liquid crystal layer sandwiched between the first conductive substrate and the second conductive substrate. The second conductive substrate includes a transparent substrate, a color filter layer formed on the transparent substrate, and a light converting layer formed on the color filter layer, and a transparent conductive layer formed on the light converting layer.

公开(公告)号：US08896009B2

公开(公告)日：2014-11-25

申请号：US13875296

申请日：2013-05-02

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hsin-Chiang Lin ,  Pin-Chuan Chen

IPC: H01L33/00 ,  H01L33/48 ,  H01L33/62 ,  H01L33/60

CPC classification number: H01L33/62 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An exemplary light-emitting diode (LED) includes a substrate, a first electrode and a second electrode sandwiching the substrate therebetween, an LED chip electrically connected to the first electrode and the second electrode, a reflector located on the first electrode and the second electrode and surrounding the LED chip, and a first retaining wall mounted on an edge of the first electrode and a second retaining wall mounted on an edge of the second electrode. The first retaining wall and the second retaining wall are made of conductive material. The first retaining wall and the second retaining wall are at a same side of the LED. Outer surfaces of the first retaining wall and the second retaining wall are exposed out of the reflector.

Abstract translation: 示例性发光二极管（LED）包括基板，第一电极和夹在其间的基板的第二电极，电连接到第一电极和第二电极的LED芯片，位于第一电极和第二电极上的反射器 并且围绕LED芯片，以及安装在第一电极的边缘上的第一挡土墙和安装在第二电极的边缘上的第二挡土墙。 第一挡土墙和第二挡土墙由导电材料制成。 第一挡土墙和第二挡土墙位于LED的同一侧。 第一挡土墙和第二挡土墙的外表面露出反射器。

公开(公告)号：US08816385B2

公开(公告)日：2014-08-26

申请号：US13912185

申请日：2013-06-06

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hsin-Chiang Lin

IPC: H01L33/62 ,  H01L33/48

CPC classification number: H01L33/08 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2933/0033 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An exemplary light-emitting diode (LED) package includes a first electrode, a second electrode spaced from the first electrode, an electrically insulating substrate sandwiched by and connecting with the first electrode and the second electrode, a first LED chip and a second LED chip mounted on top surfaces of the first and second electrodes respectively, and a reflector covering the top surfaces of the first and second electrodes. The first LED chip mounted on the top surface of the first electrode is above the second LED chip mounted on the top surface of the second surface. L-shaped retaining walls are formed on the top surfaces of the first and second electrodes. By the retaining walls, the LED package can also be used as a side-view LED package.

Abstract translation: 示例性发光二极管（LED）封装包括第一电极，与第一电极间隔开的第二电极，被第一电极和第二电极夹持并与之连接的电绝缘基板，第一LED芯片和第二LED芯片 分别安装在第一和第二电极的顶表面上，以及覆盖第一和第二电极的顶表面的反射器。 安装在第一电极的顶表面上的第一LED芯片在安装在第二表面的顶表面上的第二LED芯片的上方。 L形保持壁形成在第一和第二电极的顶表面上。 通过挡土墙，LED封装也可以用作侧视LED封装。

公开(公告)号：US10222024B2

公开(公告)日：2019-03-05

申请号：US15096277

申请日：2016-04-12

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hsin-Chiang Lin ,  Lung-Hsin Chen ,  Wen-Liang Tseng

IPC: F21V5/04 ,  G02B19/00 ,  F21Y115/10

Abstract: A light emitting device includes a light source and a lens. The lens includes a light emitting surface, a top surface, four edge surfaces, and a bottom surface. The light emitting surface includes a central recess and two convex regions connecting the central recess at opposite sides. The light emitting surface is symmetrical about the central recess. The lens further defines a receiving space in the bottom surface and four positioning pins on the bottom surface. The receiving space includes a light incident surface. The two convex regions of the light emitting surface and the light incident surface are non-spherical surfaces. A maximum distance, dn, between the light source and the light incident surface is larger than a maximum distance, Dm, between the light incident surface and the light emitting surface. The light emitting device provides a wide-angle light distribution.

公开(公告)号：US10133133B1

公开(公告)日：2018-11-20

申请号：US15636582

申请日：2017-06-28

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hsin-Chiang Lin ,  Chien-Cheng Kuo ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

IPC: G02F1/1345 ,  G02F1/1368 ,  H01L27/12

Abstract: A liquid crystal display base includes a liquid crystal module, both a power circuit and a integration circuit, a electric device mounted on the power circuit. The liquid crystal module includes a TFT array substrate and a color filter substrate mounted on the TFT array substrate. The power circuit board mounted on the TFT array substrate. The TFT array substrate has a first surface and a second surface opposite to the first surface, a plurality of through holes extend through the first surface and the second surface, each through hole has equal inner diameter from the first surface to the second surface. the TFT array substrate 11 is made of glass, sapphire, ceramic, a plurality of conductive layers are in the plurality of through holes, both the electric device, the integration circuit and the power circuit board are coupled with the liquid crystal module.

公开(公告)号：US08945959B2

公开(公告)日：2015-02-03

申请号：US13919721

申请日：2013-06-17

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Pin-Chuan Chen ,  Chao-Hsiung Chang ,  Hsin-Chiang Lin

IPC: H01L21/00 ,  H01L33/60 ,  H01L33/52 ,  H01L33/48 ,  H01L33/62 ,  H01L33/54

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/52 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A method for manufacturing an LED (light emitting diode) is disclosed wherein a metal substrate is provided. A chip fastening area with a depression and two wire fixing areas on the first metal substrate are defined on the metal substrate. The chip fastening area and the wire fixing areas are separated by a plurality of first grooves. An LED chip is provided in the depression of the chip fastening area and electrically connected to the wire fixing areas by wires. An encapsulant is formed to cover and connect the chip fastening area and the wire fixing areas. Portions of the metal substrate except the chip fastening area and the wire fixing areas are removed.

Abstract translation: 公开了一种制造LED（发光二极管）的方法，其中提供了金属基板。 在金属基板上限定具有凹陷的芯片固定区域和第一金属基板上的两个电线固定区域。 芯片紧固区域和线固定区域由多个第一凹槽分开。 LED芯片设置在芯片紧固区域的凹部中，并通过导线与导线固定区域电连接。 形成密封剂以覆盖和连接芯片紧固区域和电线固定区域。 除去芯片紧固区域和电线固定区域之外的金属基板的部分被去除。