公开(公告)号：US09543486B1

公开(公告)日：2017-01-10

申请号：US14946110

申请日：2015-11-19

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

IPC: H01L33/60 ,  H01L33/50 ,  H01L33/48 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/60 ,  H01L33/486 ,  H01L33/50 ,  H01L33/505 ,  H01L33/507 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L2224/16245 ,  H01L2224/73253

Abstract: The present disclosure provides a light emitting diode package which includes a plurality of electrodes, an LED die, a reflecting cup, a reflecting layer, and a phosphor layer. The LED die are electrically connected with the electrodes. The reflecting cup is formed on the electrodes and surrounds the LED die. The reflecting cup includes an inner surface. The reflecting layer is formed between the inner surface and LED die, and the reflecting layer has a higher pyrogenation temperature than the reflecting cup. The phosphor layer covers the LED die.

Abstract translation: 本公开提供一种发光二极管封装，其包括多个电极，LED管芯，反射杯，反射层和荧光体层。 LED管芯与电极电连接。 反射杯形成在电极上并围绕LED管芯。 反射杯包括内表面。 反射层形成在内表面和LED管芯之间，反射层的热解温度高于反射杯。 磷光体层覆盖LED芯片。

公开(公告)号：USD763206S1

公开(公告)日：2016-08-09

申请号：US29522885

申请日：2015-04-03

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Designer： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

公开(公告)号：US09147809B1

公开(公告)日：2015-09-29

申请号：US14686114

申请日：2015-04-14

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/00 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54 ,  H01L33/62 ,  H01L33/64 ,  H01L33/40

CPC classification number: H01L33/38 ,  H01L33/40 ,  H01L33/507 ,  H01L33/54 ,  H01L33/62 ,  H01L33/647 ,  H01L2924/181 ,  H01L2924/00012

Abstract: A flip chip light emitting diode packaging structure includes a substrate and an LED located on the substrate. The LED includes a P electrode and a N electrode. The substrate includes a first electrode and a second electrode mounted on a top surface of the substrate. The first electrode and the second electrode have a first protrusion and a second protrusion. The P electrode and the N electrode are fixed on the top surface of the first protrusion and the second protrusion through the solder. The bottom edge of the P electrode and the N electrode is beyond the top edge of the first protrusion and the second protrusion.

Abstract translation: 倒装芯片发光二极管封装结构包括基板和位于基板上的LED。 LED包括P电极和N电极。 衬底包括安装在衬底顶表面上的第一电极和第二电极。 第一电极和第二电极具有第一突起和第二突起。 P电极和N电极通过焊料固定在第一突起的顶表面和第二突起上。 P电极和N电极的底部边缘超过第一突起和第二突起的顶部边缘。

公开(公告)号：US08900895B2

公开(公告)日：2014-12-02

申请号：US14014403

申请日：2013-08-30

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hou-Te Lin ,  Ming-Ta Tsai

IPC: H01L21/00 ,  H01L33/62 ,  H01L33/38 ,  H01L33/48 ,  H01L33/64

CPC classification number: H01L33/38 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16

Abstract: A method of manufacturing an LED package including steps: providing an electrode, the electrode including a first electrode, a second electrode, a channel defined between the first electrode and the second electrode, the first electrode and the second electrode arranged with intervals mutually, a cavity arranged on the first electrode, and the cavity communicating with the channel; arranging an LED chip electrically connecting with the first electrode and the second electrode and arranged inside the cavity; providing a shield covering the first electrode and the second electrode; injecting a transparent insulating material to the cavity via the channel, and the first electrode, the second electrode, and the shield being interconnected by the transparent insulating material; solidifying the transparent insulating material to obtain the LED package.

Abstract translation: 一种制造LED封装的方法，包括以下步骤：提供电极，所述电极包括第一电极，第二电极，限定在所述第一电极和所述第二电极之间的通道，所述第一电极和所述第二电极相互间隔开， 空腔布置在第一电极上，腔体与通道连通; 布置与第一电极和第二电极电连接并布置在腔内的LED芯片; 提供覆盖所述第一电极和所述第二电极的屏蔽; 通过所述通道向所述空腔注入透明绝缘材料，并且所述第一电极，所述第二电极和所述屏蔽件通过所述透明绝缘材料互连; 固化透明绝缘材料以获得LED封装。

公开(公告)号：US09786642B1

公开(公告)日：2017-10-10

申请号：US15252860

申请日：2016-08-31

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Wen-Liang Tseng ,  Lung-Hsin Chen ,  Pin-Chuan Chen ,  Hsin-Chiang Lin ,  Chao-Hsiung Chang

IPC: H01L25/16 ,  H01L33/50 ,  H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L27/02 ,  H01L29/866

CPC classification number: H01L25/167 ,  H01L25/165 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/486 ,  H01L33/505 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

Abstract: A miniaturized LED package substrate allowing for the better installation of an electrostatic protection device includes an upper substrate, a lower substrate, and a circuit layer. The circuit layer is positioned between the upper substrate and the lower substrate and electrically connected to the upper substrate and the lower substrate. At least one cavity is defined at the lower substrate, and each of the at least one cavity passes through the lower substrate to expose a portion of the circuit layer.

公开(公告)号：US09660144B2

公开(公告)日：2017-05-23

申请号：US14832692

申请日：2015-08-21

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Chao-Hsiung Chang ,  Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen ,  Wen-Liang Tseng

IPC: H01L33/38 ,  H01L33/44 ,  H01L33/48

CPC classification number: H01L33/382 ,  H01L33/387 ,  H01L33/44 ,  H01L33/486 ,  H01L2933/0016

Abstract: The present disclosure provides a light emitting diode die which includes a substrate; an N type semiconductor layer, an active layer, and a P type semiconductor layer formed on the substrate in sequence; at least one recess, and a pair of electrodes. The recess extends to the N type semiconductor layer. The insulating layer covers the all of side surfaces of the N type semiconductor layer, the active layer, the P type semiconductor layer, and covers top of the P type semiconductor layer except an opening on the P semiconductor layer. One of the electrodes is filled in the recess and electrically connected to the N type semiconductor layer, and the other one of the electrodes is connected to the P type semiconductor layer in the opening. The present disclosure further provides an LED package having the LED die and a method for manufacturing the same.

公开(公告)号：US09065028B2

公开(公告)日：2015-06-23

申请号：US14096031

申请日：2013-12-04

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/00 ,  H01L33/54 ,  H01L33/60 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L33/60 ,  H01L33/44 ,  H01L33/486 ,  H01L33/62 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An exemplary light emitting diode (LED) package includes a substrate, a first electrode penetrating downward through the substrate, a second electrode penetrating downward through the substrate and spaced from the first electrode, an LED die arranged on the substrate and mounted to the first and second electrodes by flip-chip technology, and an encapsulation layer formed on the substrate to encapsulate the LED die therein. The substrate includes a top surface and a bottom surface at opposite sides thereof. Top ends of the first and second electrodes are exposed at the top surface of the substrate, and bottom ends of the first and second electrodes are exposed at the bottom surface of the substrate. A moisture barrier layer is attached on the bottom of the LED package to cover a joint of the first and/or second electrode and the substrate.

Abstract translation: 示例性发光二极管（LED）封装包括衬底，穿过衬底向下穿过的第一电极，穿过衬底向下穿过并与第一电极间隔开的第二电极，布置在衬底上并安装到第一和 通过倒装芯片技术的第二电极，以及形成在基板上以将LED管芯封装在其中的封装层。 基板包括在其相对侧的顶表面和底表面。 第一电极和第二电极的顶端在基板的顶表面露出，第一和第二电极的底端在基板的底表面露出。 在LED封装的底部附着防潮层，以覆盖第一和/或第二电极和基板的接头。

公开(公告)号：US08985826B2

公开(公告)日：2015-03-24

申请号：US13714311

申请日：2012-12-13

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang

IPC: F21V7/04 ,  G02B7/02 ,  G05D25/00 ,  G02B26/02 ,  G02F1/1335

CPC classification number: G02B26/02 ,  G02F2001/133601

Abstract: A backlight module includes a back cover, a light source located on the back cover, an optical fiber located on the back cover and over the light source and having a light-incident hole facing the light source and a plurality of light-emergent windows opposite to the light-incident hole. A plurality of light shutters correspondingly covers the light-emergent windows. A controlling device is provided for controlling the open and close of the light shutters. Light emitted from the light source and entering the optical fiber is permitted to leave the optical fiber from the light-emergent windows whose light shutters are opened. The light is not permitted to leave the optical fiber from the light-emergent windows whose light shutters are closed.

Abstract translation: 背光源模块包括后盖，位于后盖上的光源，位于后盖上并在光源上并且具有面向光源的光入射孔的光纤和与光源相对的多个发光窗口 到光入射孔。 多个光闸相应地覆盖出光窗。 提供一种用于控制光闸的打开和关闭的控制装置。 允许从光源发射并进入光纤的光从光闸打开的出光窗口离开光纤。 光线不允许从光闸关闭的出光窗口离开光纤。

公开(公告)号：US08981447B2

公开(公告)日：2015-03-17

申请号：US14014424

申请日：2013-08-30

Applicant: Advanced Optoelectronic Technology, Inc.

Inventor： Hou-Te Lin ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/60 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  H01L33/52

CPC classification number: H01L33/486 ,  H01L33/48 ,  H01L33/483 ,  H01L33/52 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An LED package includes a first electrode, a second electrode, a reflecting cup connecting the first electrode and the second electrode, and an LED chip. The first electrode includes a first main portion and a first connecting portion extending outwardly from the first main portion. The first connecting portion has a first connecting face away from the first main portion. The second electrode includes a second main portion and a second connecting portion extending outwardly from the second main portion. The second connecting portion has a second connecting face away from the second main portion. The first main portion and the second main portion are embedded into the receiving cup, and the first connecting face of the first connecting portion and the second connecting face of the second connecting portion are exposed outside the receiving cup.

Abstract translation: LED封装包括第一电极，第二电极，连接第一电极和第二电极的反射杯以及LED芯片。 第一电极包括第一主要部分和从第一主要部分向外延伸的第一连接部分。 第一连接部分具有远离第一主要部分的第一连接面。 第二电极包括从第二主要部分向外延伸的第二主要部分和第二连接部分。 第二连接部分具有远离第二主要部分的第二连接面。 第一主要部分和第二主要部分嵌入到接收杯中，并且第一连接部分的第一连接面和第二连接部分的第二连接面暴露在接收杯的外部。

公开(公告)号：US09543482B2

公开(公告)日：2017-01-10

申请号：US14523425

申请日：2014-10-24

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： Hou-Te Lin ,  Chao-Hsiung Chang ,  Pin-Chuan Chen ,  Lung-Hsin Chen

IPC: H01L33/20 ,  H01L33/38 ,  H01L33/50 ,  H01L33/54

CPC classification number: H01L33/507 ,  H01L33/505

Abstract: The present invention is related to a light emitting diode (LED) package. The LED package includes a blue LED chip, a first electrode, a second electrode and a phosphor layer. The phosphor layer covers an outer periphery of the blue LED chip, except a bottom surface of the blue LED chip. The phosphor layer is mixed by yellow fluorescent powder and glue. The phosphor layer includes a main portion corresponding to a central portion of an emitting angle of the blue LED chip and an extending portion corresponding to a periphery of the emitting angle. An average thickness of the main portion is larger than the thickness of the extending portion.

Abstract translation: 本发明涉及一种发光二极管（LED）封装。 LED封装包括蓝色LED芯片，第一电极，第二电极和荧光体层。 除了蓝色LED芯片的底面之外，荧光体层覆盖蓝色LED芯片的外周。 荧光粉层由黄色荧光粉和胶水混合。 磷光体层包括对应于蓝色LED芯片的发光角的中心部分的主要部分和对应于发光角度的周边的延伸部分。 主要部分的平均厚度大于延伸部分的厚度。