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1.
公开(公告)号:US11884818B2
公开(公告)日:2024-01-30
申请号:US17266612
申请日:2019-07-31
CPC分类号: C08L77/06 , C08J9/232 , C08J2201/034 , C08J2377/06
摘要: Polyamide pre-expanded particles of this disclosure have a peak temperature of a maximum endothermic peak of 150-275° C. on a DSC curve obtained while being heated from 30° C. to 280° C. at a heating rate of 10° C./min using a DSC. The width of the peak is 30-80° C. when a straight line approximating the DSC curve on a high-temperature side relative to the peak after an end of melting is used as a baseline. The width corresponds to a difference between an extrapolated melting start temperature which is a temperature at an intersection point between a tangent line at an inflection point of the peak on a low-temperature side and the baseline, and an extrapolated melting end temperature which is a temperature at an intersection point between a tangent line at an inflection point of the peak on a high-temperature side and the baseline.
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公开(公告)号:US11235553B2
公开(公告)日:2022-02-01
申请号:US16968160
申请日:2019-04-05
发明人: Yasuyuki Kawazu , Tetsuo Nakamoto
IPC分类号: B32B5/32 , B32B5/20 , B32B27/34 , B29C44/06 , B29C44/54 , B29C44/56 , B60R13/08 , F02B77/11 , B29K77/00 , B29K105/04 , B29L31/30
摘要: Provided are a foam molded product and a method of producing the same. The foam molded product is a molded product containing a resin and including a surface layer, a compressive deformation layer, and a foam layer. The thickness of the surface layer is 0.1 mm to 5.0 mm. The compressive deformation layer is located between the surface layer and the foam layer. Foam particles forming the compressive deformation layer have an average H/L of 0.5 or less (H: length in compression direction; L: length in perpendicular direction relative to compression direction). Foam particles forming the foam layer have an expansion ratio of not less than 3.0 times and less than 30 times.
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