公开(公告)号：US12080519B2

公开(公告)日：2024-09-03

申请号：US17843830

申请日：2022-06-17

Applicant: Applied Materials, Inc.

Inventor： Jie Yu ,  Yue Guo ,  Kartik Ramaswamy ,  Tao Zhang ,  Shahid Rauf ,  John Forster ,  Sidharth Bhatia ,  Rong Gang Zheng

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32926

Abstract: Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.

公开(公告)号：US20230195074A1

公开(公告)日：2023-06-22

申请号：US17558507

申请日：2021-12-21

Applicant: Applied Materials, Inc.

Inventor： Venkata Ravishankar Kasibhotla ,  Tao Zhang ,  Xiaoqun Zou ,  Bala Shyamala Balaji

IPC: G05B19/404 ,  G06N20/00

CPC classification number: G05B19/404 ,  G06N20/00 ,  G05B2219/37506

Abstract: A method includes receiving first sensor data, generated during a manufacturing process by sensors associated with a substrate manufacturing chamber. The method further includes receiving simulated sensor data generated by a trained physics-based model. The method further includes determining which one or more components of the manufacturing chamber contribute to a difference between the first sensor data and the simulated sensor data. The method further includes causing performance of a corrective action in view of the difference.

公开(公告)号：US20250037973A1

公开(公告)日：2025-01-30

申请号：US18912366

申请日：2024-10-10

Applicant: Applied Materials, Inc.

Inventor： David Coumou ,  Zhi Wang ,  Tao Zhang ,  David Peterson

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a process power controller for a plasma processing tool. In an embodiment, the process power controller includes a process power source optimizer, a source predictor, and a process uniformity controller. In an embodiment, the source predictor is communicatively coupled to the process power source optimizer and the process uniformity controller.

公开(公告)号：US20240395505A1

公开(公告)日：2024-11-28

申请号：US18791193

申请日：2024-07-31

Applicant: Applied Materials, Inc.

Inventor： Jie Yu ,  Yue Guo ,  Kartik Ramaswamy ,  Tao Zhang ,  Shahid Rauf ,  John Forster ,  Sidharth Bhatia ,  Rong Gang Zheng

IPC: H01J37/32

Abstract: Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.

公开(公告)号：US20230411119A1

公开(公告)日：2023-12-21

申请号：US17843830

申请日：2022-06-17

Applicant: Applied Materials, Inc.

Inventor： Jie Yu ,  Yue Guo ,  Kartik Ramaswamy ,  Tao Zhang ,  Shahid Rauf ,  John Forster ,  Sidharth Bhatia ,  Rong Gang Zheng

IPC: H01J37/32

CPC classification number: H01J37/32183 ,  H01J37/32926

Abstract: Embodiments disclosed herein include a dynamic load simulator. In an embodiment, the dynamic load simulator comprises an impedance load, a reverse match network, and a smart RF controller. In an embodiment, the smart RF controller comprises a dynamic load generator, and a reverse match controller.

公开(公告)号：US12211670B2

公开(公告)日：2025-01-28

申请号：US18377918

申请日：2023-10-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Tao Zhang ,  Upendra Ummethala

IPC: H01J37/32 ,  H03H7/40 ,  H05H1/46

Abstract: A method includes receiving, from one or more sensors, sensor data associated with manufacturing equipment and updating one or more values of a digital replica associated with the manufacturing equipment based on the sensor data. The digital replica comprises a model reflecting a virtual representation of physical elements and dynamics of how the manufacturing equipment operates. One or more outputs indicative of predictive data is obtained from the digital replica and, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment is caused.

公开(公告)号：US20240393761A1

公开(公告)日：2024-11-28

申请号：US18324080

申请日：2023-05-25

Applicant: Applied Materials, Inc.

Inventor： Zhi Wang ,  Tao Zhang ,  Punyabrahma Panda ,  Michael Kutney

IPC: G05B19/402

Abstract: A method includes receiving, by a processing device, position error data from one or more motors of a process chamber. The method further includes performing preprocessing of the position error data. The method further includes transforming the position error data to a frequency domain. The method further includes determining, based on the frequency domain position error data, that a vibration fault has occurred in connection with the process chamber. The method further includes performing a corrective action in view of the vibration fault.

公开(公告)号：US12147212B2

公开(公告)日：2024-11-19

申请号：US17558507

申请日：2021-12-21

Applicant: Applied Materials, Inc.

Inventor： Venkata Ravishankar Kasibhotla ,  Tao Zhang ,  Xiaoqun Zou ,  Bala Shyamala Balaji

IPC: G05B19/404 ,  G06N20/00

Abstract: A method includes receiving first sensor data, generated during a manufacturing process by sensors associated with a substrate manufacturing chamber. The method further includes receiving simulated sensor data generated by a trained physics-based model. The method further includes determining which one or more components of the manufacturing chamber contribute to a difference between the first sensor data and the simulated sensor data. The method further includes causing performance of a corrective action in view of the difference.

公开(公告)号：US20240162009A1

公开(公告)日：2024-05-16

申请号：US18377918

申请日：2023-10-09

Applicant: APPLIED MATERIALS, INC.

Inventor： Tao Zhang ,  Upendra Ummethala

IPC: H01J37/32 ,  H03H7/40 ,  H05H1/46

CPC classification number: H01J37/32183 ,  H01J37/321 ,  H01J37/32926 ,  H01J37/32935 ,  H03H7/40 ,  H05H1/46 ,  H05H1/4652

Abstract: A method includes receiving, from one or more sensors, sensor data associated with manufacturing equipment and updating one or more values of a digital replica associated with the manufacturing equipment based on the sensor data. The digital replica comprises a model reflecting a virtual representation of physical elements and dynamics of how the manufacturing equipment operates. One or more outputs indicative of predictive data is obtained from the digital replica and, based on the predictive data, performance of one or more corrective actions associated with the manufacturing equipment is caused.

公开(公告)号：US20230195078A1

公开(公告)日：2023-06-22

申请号：US17557816

申请日：2021-12-21

Applicant: APPLIED MATERIALS, INC.

Inventor： Chunlei Zhang ,  Tao Zhang ,  Jairaj Payyapilly

IPC: G05B19/4155

CPC classification number: G05B19/4155 ,  G05B2219/45212

Abstract: An electronic device manufacturing system capable of obtaining metrology data generated using metrology equipment located within a process chamber that performs a deposition process on a substrate according to a process recipe, wherein the process recipe comprises a plurality of setting parameters, and wherein the deposition process generates a plurality of film layers on a surface of the substrate. The manufacturing system can further generate a correction profile based on the metrology data. The manufacturing system can further generate an updated process recipe by applying the correction profile to the process recipe. The manufacturing system can further cause an etch process to be performed on the substrate according to the updated process recipe.