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公开(公告)号:US11508558B2
公开(公告)日:2022-11-22
申请号:US16834814
申请日:2020-03-30
摘要: Embodiments described herein generally related to a substrate processing apparatus, and more specifically to an improved showerhead assembly for a substrate processing apparatus. The showerhead assembly includes a chill plate, a gas plate, and a gas distribution plate having a top surface and a bottom surface. A plurality of protruded features contacts the top surface of the gas distribution plate. A fastener and an energy storage structure is provided on the protruded features. The energy storage structure is compressed by the fastener and axially loads at least one of the protruded features to compress the chill plate, the gas plate and the gas distribution plate.
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公开(公告)号:US10410900B2
公开(公告)日:2019-09-10
申请号:US15667281
申请日:2017-08-02
IPC分类号: H05K3/12 , B41F15/42 , H01L21/683 , H01L21/687 , H01L21/67 , H05B3/28 , H05K1/02 , H05K1/16 , H05K1/18 , H05K3/00 , H05K1/03
摘要: Precision screen printing is described that is capable of sub-micron uniformity of the metallization materials that are printed on green sheet ceramic. In some examples, puck is formed with electrical traces by screen printing a paste that contains metal on a ceramic green sheet in a pattern of electrical traces and processing the printed green sheet to form a puck of a workpiece carrier. In some example, the printing includes applying a squeegee of a screen printer to the printed green sheet in a squeegeeing direction while the green sheet is on a printer bed of the screen printer. The method further includes mapping the printer bed at multiple locations along the squeegeeing direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printer to compensate for mapped non-uniformities in the printer bed.
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公开(公告)号:US20160345384A1
公开(公告)日:2016-11-24
申请号:US14997842
申请日:2016-01-18
IPC分类号: H05B1/02 , H01L21/67 , H01L21/66 , H01L21/683
CPC分类号: H05B1/0233 , H01L21/67103 , H01L21/67248 , H01L21/6831 , H01L22/20
摘要: Implementations described herein provide a method for processing a substrate on a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a substrate. The method includes processing a first substrate using a first temperature profile on the ESC having primary heaters and spatially tunable heaters. A deviation profile is determined from a result of processing the first substrate from a target result profile. The first temperature profile is adjusted to a second temperature profile on the ESC based on the deviation profile. Adjusting to the second temperature profile includes incrementing the power to one or more spatially tunable heaters in one or more discrete locations corresponding to the deviations profile. A second substrate is then processed on the ESC using the second temperature profile.
摘要翻译: 本文所述的实施方案提供了一种用于处理衬底支撑组件上的衬底的方法,该衬底支撑组件能够实现静电卡盘和衬底之间的热传递的侧向和方位调节。 该方法包括使用具有初级加热器和空间可调谐加热器的ESC上的第一温度曲线来处理第一基板。 从目标结果轮廓处理第一基底的结果确定偏差分布。 基于偏差曲线,第一温度曲线被调整到ESC上的第二温度曲线。 调整到第二温度曲线包括在对应于偏差轮廓的一个或多个离散位置中增加对一个或多个空间可调谐加热器的功率。 然后使用第二温度曲线在ESC上处理第二衬底。
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公开(公告)号:US11622419B2
公开(公告)日:2023-04-04
申请号:US16595801
申请日:2019-10-08
IPC分类号: H05B3/68 , H05B1/02 , H01L21/67 , H01L21/683 , H01L21/66
摘要: Implementations described herein provide a method for processing a substrate on a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a substrate. The method includes processing a first substrate using a first temperature profile on a substrate support assembly having primary heaters and spatially tunable heaters. A deviation profile is determined from a result of processing the first substrate. The spatially tunable heaters are controlled in response to the deviation profile to enable discrete lateral and azimuthal tuning of local hot or cold spots on the substrate support assembly in forming a second temperature profile. A second substrate is then processed using the second temperature profile.
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公开(公告)号:US20210335631A1
公开(公告)日:2021-10-28
申请号:US17365931
申请日:2021-07-01
摘要: A substrate carrier is described with an array of independently controllable heater elements. In one example an apparatus includes a substrate carrier to carry a substrate for processing, a plurality of resistive heating elements in the carrier to heat the substrate by heating the carrier, a power supply to supply power to the heating elements, a power controller to provide a control signal, the control signal to control an amount of current applied to each of the heating elements, and a plurality of power interfaces in the carrier each coupled to a heating element to receive the power from the power supply and the control signal from the controller and to modulate the power applied to a respective coupled heating element in response to the control signal.
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6.
公开(公告)号:US20190273008A1
公开(公告)日:2019-09-05
申请号:US16414642
申请日:2019-05-16
IPC分类号: H01L21/683 , H05K1/16 , H05K3/12 , H05K3/00 , H05K1/02 , H05K1/18 , H01L21/67 , B41F15/42 , H01L21/687 , H05B3/28
摘要: Precision screen printing is described that is capable of sub-micron uniformity of the metallization materials that are printed on green sheet ceramic. In some examples, puck is formed with electrical traces by screen printing a paste that contains metal on a ceramic green sheet in a pattern of electrical traces and processing the printed green sheet to form a puck of a workpiece carrier. In some example, the printing includes applying a squeegee of a screen printer to the printed green sheet in a squeegeeing direction while the green sheet is on a printer bed of the screen printer. The method further includes mapping the printer bed at multiple locations along the squeegeeing direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printer to compensate for mapped non-uniformities in the printer bed.
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公开(公告)号:US09472435B2
公开(公告)日:2016-10-18
申请号:US14717676
申请日:2015-05-20
发明人: Vijay D. Parkhe , Steven E. Babayan , Konstantin Makhratchev , Zhiqiang Guo , Phillip R. Sommer , Dan A. Marohl
IPC分类号: F27B5/14 , H01L21/683 , H05B3/02 , H01L21/67 , H05B1/02
CPC分类号: H01L21/6833 , H01L21/67103 , H01L21/67248 , H01L21/6831 , H05B1/023 , H05B1/0233 , H05B3/02
摘要: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.
摘要翻译: 本文所述的实施方案提供了一种基板支撑组件,其能够实现静电卡盘和加热组件之间的热传递的侧向和方位调节。 基板支撑组件包括具有基板支撑表面和下表面的主体,设置在主体中的一个或多个主电阻加热器,设置在主体中的多个可空调的加热器,以及耦合到多个 空间可调谐加热器,空间可调加热器控制器被配置为相对于多个空间可调谐加热器中的另一个来独立地控制多个空间可调加热器中的输出一个。
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公开(公告)号:US12094752B2
公开(公告)日:2024-09-17
申请号:US17843652
申请日:2022-06-17
发明人: Michael R. Rice , Yogananda Sarode Vishwanath , Sunil Srinivasan , Rajinder Dhindsa , Steven E. Babayan , Olivier Luere , Denis M. Koosau , Imad Yousif
IPC分类号: H01J37/32 , H01L21/67 , H01L21/683 , H01L21/687
CPC分类号: H01L21/68735 , H01J37/32082 , H01J37/32091 , H01J37/32715 , H01L21/67017 , H01L21/6719 , H01L21/6831 , H01L21/68742 , H01J2237/334
摘要: Apparatuses including a height-adjustable edge ring, and methods for use thereof are described herein. In one example, a process kit for processing a substrate is provided. The process kit has a support ring comprising an upper surface having an inner edge disposed at a first height and an outward edge disposed at a second height less than the first height, the inner edge having a greater thickness than the outward edge. An edge ring is disposed on the support ring, an inner surface of the edge ring interfaced with the inner edge of the support ring. A cover ring is disposed outward of the edge ring, the edge ring independently moveable relative to the support ring and the cover ring. Push pins are disposed inward of the cover ring, the push pins operable to elevate the edge ring while constraining radial movement of the support ring.
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公开(公告)号:US12009244B2
公开(公告)日:2024-06-11
申请号:US16741330
申请日:2020-01-13
发明人: Vijay D. Parkhe , Steven E. Babayan , Konstantin Makhratchev , Zhiqiang Guo , Phillip R. Sommer , Dan A. Marohl
IPC分类号: H01L21/683 , H01L21/67 , H05B1/02 , H05B3/02
CPC分类号: H01L21/6833 , H01L21/67103 , H01L21/67248 , H01L21/6831 , H05B1/023 , H05B1/0233 , H05B3/02
摘要: Implementations described herein provide a substrate support assembly which enables both lateral and azimuthal tuning of the heat transfer between an electrostatic chuck and a heating assembly. The substrate support assembly comprises a body having a substrate support surface and a lower surface, one or more main resistive heaters disposed in the body, a plurality of spatially tunable heaters disposed in the body, and a spatially tunable heater controller coupled to the plurality of spatially tunable heaters, the spatially tunable heater controller configured to independently control an output one of the plurality of spatially tunable heaters relative to another of the plurality of spatially tunable heaters.
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公开(公告)号:US11569114B2
公开(公告)日:2023-01-31
申请号:US17174591
申请日:2021-02-12
发明人: Yogananda Sarode Vishwanath , Steven E. Babayan , Andreas Schmid , Stephen Donald Prouty , Andrew Antoine Noujaim
摘要: Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.
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