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公开(公告)号：US20240047246A1
公开(公告)日：2024-02-08
申请号：US18381565
申请日：2023-10-18
CPC分类号： H01L21/67248 , H01L21/67017 , H01J37/3299 , H01J37/32715 , H01J37/32724 , H01L21/67109 , C23C16/505 , C23C16/52 , C23C16/46 , C23C16/50 , C23C16/56 , H01L21/67103
摘要： An advanced temperature control system and method are described for a wafer carrier in a plasma processing chamber. In one example a heat exchanger provides a temperature controlled thermal fluid to a fluid channel of a workpiece carrier and receives the thermal fluid from the fluid channel. A proportional valve is between the heat exchanger and the fluid channel to control the rate of flow of thermal fluid from the heat exchanger to the fluid channel. A pneumatic valve is also between the heat exchanger and the fluid channel also to control the rate of flow of thermal fluid from the heat exchanger and the fluid channel. A temperature controller receives a measured temperature from a thermal sensor of the carrier and controls the proportional valve and the pneumatic valve in response to the measured temperature to adjust the rate of flow of the thermal fluid.
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公开(公告)号：US10366867B2
公开(公告)日：2019-07-30
申请号：US15241379
申请日：2016-08-19
发明人： Phillip Criminale , Zhiqiang Guo
摘要： Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.
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3.发明申请公开(公告)号：US20180040498A1
公开(公告)日：2018-02-08
申请号：US15667281
申请日：2017-08-02
CPC分类号： H01L21/6833 , B41F15/423 , B41P2200/40 , H01L21/67103 , H01L21/6831 , H01L21/68785 , H05B3/283 , H05B2203/017 , H05K1/0201 , H05K1/0212 , H05K1/0306 , H05K1/165 , H05K1/167 , H05K1/181 , H05K3/0097 , H05K3/1233 , H05K3/1291 , H05K2203/0139 , H05K2203/162 , H05K2203/163 , H05K2203/166
摘要： Precision screen printing is described that is capable of sub-micron uniformity of the metallization materials that are printed on green sheet ceramic. In some examples, puck is formed with electrical traces by screen printing a paste that contains metal on a ceramic green sheet in a pattern of electrical traces and processing the printed green sheet to form a puck of a workpiece carrier. In some example, the printing includes applying a squeegee of a screen printer to the printed green sheet in a squeegeeing direction while the green sheet is on a printer bed of the screen printer. The method further includes mapping the printer bed at multiple locations along the squeegeeing direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printer to compensate for mapped non-uniformities in the printer bed.
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公开(公告)号：US20230089982A1
公开(公告)日：2023-03-23
申请号：US17903581
申请日：2022-09-06
IPC分类号： H01L21/687 , H01L21/67 , B65G47/90 , G06N3/08
摘要： An electronic device manufacturing system includes a transfer chamber, a tool station situated within the transfer chamber, a process chamber coupled to the transfer chamber, and a transfer chamber robot. The transfer chamber robot is configured to transfer substrates to and from the process chamber. The transfer chamber robot is further configured to be coupled to a sensor tool comprising one or more sensors configured to take measurements inside the process chamber. The sensor tool is retrievable from the tool station by an end effector of the transfer chamber robot.
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公开(公告)号：US11361948B2
公开(公告)日：2022-06-14
申请号：US16440632
申请日：2019-06-13
发明人： Phillip Criminale , Zhiqiang Guo
摘要： Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.
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公开(公告)号：US20210059018A1
公开(公告)日：2021-02-25
申请号：US17080579
申请日：2020-10-26
发明人： Phillip Criminale , Steve E. Babayan , Scott Edmonson , Phillip R. Sommer , Dan A. Marohl , Chris Blank
摘要： A method includes generating, external to a radio frequency (RF) environment and based on a process recipe, a first signal and a second signal. The method further includes converting the first signal into an alternative signal and transmitting, over a non-conductive communication link, the alternative signal to a converter within the RF environment within a processing chamber of a substrate processing system. The method further includes converting the alternative signal into a third signal by the converter inside the RF environment within the processing chamber. The method further includes controlling a first plurality of elements disposed within the RF environment within the processing chamber via one or more first devices disposed within the RF environment within the processing chamber using the third signal and controlling a second plurality of elements of the substrate processing system via one or more second devices of the substrate processing system using the second signal.
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公开(公告)号：US20180160475A1
公开(公告)日：2018-06-07
申请号：US15870488
申请日：2018-01-12
发明人： Phillip Criminale , Steve E. Babayan , Scott Edmonson , Phillip R. Sommer , Dan A. Marohl , Chris Blank
摘要： A method includes generating, based on a process recipe, a first electrical control signal by a processing device external to a particular radio frequency (RF) environment. The method further includes converting the first electrical control signal into an alternative control signal, transmitting the alternative control signal to a converter within the particular RF environment over a non-conductive communication link, and converting the alternative control signal into a second electrical control signal by the converter. The method further includes controlling a first plurality of elements via one or more switching devices using the second electrical control signal. The method further includes generating, based on the process recipe, a third signal by the processing device and controlling a second plurality of elements disposed outside of the RF environment using the third signal. The first plurality of elements and the second plurality of elements are controlled substantially simultaneously based on the process recipe.
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公开(公告)号：US11870252B2
公开(公告)日：2024-01-09
申请号：US17080579
申请日：2020-10-26
发明人： Phillip Criminale , Steve E. Babayan , Scott Edmonson , Phillip R. Sommer , Dan A. Marohl , Chris Blank
CPC分类号： H02J13/00017 , H02J3/14 , H02J13/00004 , H02J13/00022 , H02J13/00026 , H02M5/2576 , H05B1/0233 , H05B3/0047 , H02J2310/14 , H02M1/092 , Y02B70/3225 , Y02B90/20 , Y04S20/222 , Y04S40/126
摘要： A method includes generating, external to a radio frequency (RF) environment and based on a process recipe, a first signal and a second signal. The method further includes converting the first signal into an alternative signal and transmitting, over a non-conductive communication link, the alternative signal to a converter within the RF environment within a processing chamber of a substrate processing system. The method further includes converting the alternative signal into a third signal by the converter inside the RF environment within the processing chamber. The method further includes controlling a first plurality of elements disposed within the RF environment within the processing chamber via one or more first devices disposed within the RF environment within the processing chamber using the third signal and controlling a second plurality of elements of the substrate processing system via one or more second devices of the substrate processing system using the second signal.
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公开(公告)号：US20190295824A1
公开(公告)日：2019-09-26
申请号：US16440632
申请日：2019-06-13
发明人： Phillip Criminale , Zhiqiang Guo
摘要： Temperature measurement is described for a substrate carrier using a heater element array. In one example a method includes measuring a first combined current load of each of a plurality of heating elements in the electrostatic chuck, changing a power status of a first heating element of the plurality of heating elements, measuring a second combined current load of each of the plurality of heating elements after changing the power status of the first heating element, determining the difference between the first and second combined current loads, determining a temperature of the first heating element using the difference, and reverting the power status of the first heating element to that before the change and repeating changing power, measuring a current load, determining a difference, and determining a temperature for each of the other heating elements of the plurality to determine a temperature at each of the heating elements of the plurality.
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10.发明授权公开(公告)号：US10410900B2
公开(公告)日：2019-09-10
申请号：US15667281
申请日：2017-08-02
IPC分类号： H05K3/12 , B41F15/42 , H01L21/683 , H01L21/687 , H01L21/67 , H05B3/28 , H05K1/02 , H05K1/16 , H05K1/18 , H05K3/00 , H05K1/03
摘要： Precision screen printing is described that is capable of sub-micron uniformity of the metallization materials that are printed on green sheet ceramic. In some examples, puck is formed with electrical traces by screen printing a paste that contains metal on a ceramic green sheet in a pattern of electrical traces and processing the printed green sheet to form a puck of a workpiece carrier. In some example, the printing includes applying a squeegee of a screen printer to the printed green sheet in a squeegeeing direction while the green sheet is on a printer bed of the screen printer. The method further includes mapping the printer bed at multiple locations along the squeegeeing direction, identifying non-uniformities in the printer bed mapping, and modifying a printer controller of the screen printer to compensate for mapped non-uniformities in the printer bed.
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