公开(公告)号：US11373893B2

公开(公告)日：2022-06-28

申请号：US16997300

申请日：2020-08-19

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Stephen Donald Prouty ,  Alvaro Garcia De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC: H01L21/683 ,  H01J37/32

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a base channel disposed therein, and a facility plate having a facility channel disposed therein. The facility plate includes a plate portion and a wall portion. The plate portion is coupled to the ESC base assembly and the wall portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the wall portion of the facility plate, and the seal assembly.

公开(公告)号：US20240408712A1

公开(公告)日：2024-12-12

申请号：US18206332

申请日：2023-06-06

Applicant: Applied Materials, Inc.

Inventor： Andreas Schmid ,  Stephen Prouty ,  Alvaro Garcia de Gorordo ,  Andrew Antoine Noujaim

IPC: B23Q11/10 ,  B23Q3/15 ,  F28F13/00 ,  H02N13/00

Abstract: Substrate supports and related components including additive manufacturing processes are disclosed. One substrate support assembly includes an electrostatic chuck; and a cooling base having a first surface that is bonded to a first surface of the electrostatic chuck with a metallic bonding material, the cooling base comprising: a ceramic body having a coefficient of thermal expansion substantially the same as the electrostatic chuck; one or more cooling channels formed within the ceramic body; and one or more conductive zones extending through the ceramic body from the first surface to a second surface on an opposite side of the cooling base.

公开(公告)号：US11646183B2

公开(公告)日：2023-05-09

申请号：US16825466

申请日：2020-03-20

Applicant: Applied Materials, Inc.

Inventor： Stephen Donald Prouty ,  Alvaro Garcia De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01J37/32798 ,  H01J37/3244 ,  H01J37/32715 ,  H01J37/32724 ,  H01L21/67069 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/2007 ,  H01J2237/334

Abstract: Semiconductor chamber components are described herein that includes one or more conduits for carrying a fluid between powered and grounded portions of the chamber component, the conduit configure to be less prone to arcing as compared to conventional components. In one example, a semiconductor chamber component is provided that includes a powered region, a grounded region, and a fluid conduit. The fluid conduit is disposed within the semiconductor chamber component and passes through the powered and grounded regions. The fluid conduit has an end to end electrical resistance of between 0.1 to 100 MΩ.

公开(公告)号：US11569114B2

公开(公告)日：2023-01-31

申请号：US17174591

申请日：2021-02-12

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Andreas Schmid ,  Stephen Donald Prouty ,  Andrew Antoine Noujaim

IPC: B29C65/00 ,  H01L21/683 ,  H05K7/20 ,  B29C65/56 ,  B29C65/02 ,  B29C65/48

Abstract: Embodiments described herein relate to a substrate support assembly. The substrate support assembly includes an ESC base assembly having a base channel disposed therein, a facility plate, the facility plate coupled to the ESC base assembly with a vacuum region therebetween, and a seal assembly. The seal assembly includes an upper flange coupled to the base channel of the ESC base assembly, the upper flange disposed in the facility plate, a lower flange coupled to the upper flange, the lower flange disposed in the facility plate, a gasket disposed between the upper flange and the lower flange, and an insulator tube coupled to the lower flange. A passage is connected to the base channel, the passage is defined by connected openings of the upper flange, the gasket, the lower flange, the insulator tube, and the base assembly.

公开(公告)号：US11764041B2

公开(公告)日：2023-09-19

申请号：US16901797

申请日：2020-06-15

Applicant: Applied Materials, Inc.

Inventor： Alvaro Garcia De Gorordo ,  Daniel Sang Byun ,  Andreas Schmid ,  Stephen Donald Prouty ,  Andrew Antoine Noujaim

IPC: H01J37/32 ,  H01L21/683 ,  C23C16/46 ,  C23C16/458

CPC classification number: H01J37/32724 ,  C23C16/4581 ,  C23C16/466 ,  H01J37/321 ,  H01L21/6833 ,  H01J2237/002 ,  H01J2237/3341

Abstract: Embodiments described herein relate to a substrate support assembly which enables adjustment of the thermal conductivity therein. The substrate support assembly has heater and cooling channel. An adjustable thermal break disposed between the heater and the cooling channel. The adjustable thermal break has one or more fluid conduits coupled thereto and configured to flow a fluid into and out of the adjustable thermal break for variant the thermal conductivity between the heater and the cooling channel.

公开(公告)号：US11437261B2

公开(公告)日：2022-09-06

申请号：US16217036

申请日：2018-12-11

Applicant: Applied Materials, Inc.

Inventor： Yogananda Sarode Vishwanath ,  Steven E. Babayan ,  Stephen Donald Prouty ,  Álvaro García De Gorordo ,  Andreas Schmid ,  Andrew Antoine Noujaim

IPC: H05B3/68 ,  H01L21/683 ,  H01L21/67

Abstract: Embodiments described herein relate to a substrate support assembly which enables a cryogenic temperature operation of an electrostatic chuck (ESC) so that a substrate disposed thereon is maintained at a cryogenic processing temperature suitable for processing while other surfaces of a processing chamber are maintained at a different temperature. The substrate support assembly includes an electrostatic chuck (ESC), an ESC base assembly coupled to the ESC having a refrigerant channel disposed therein, and a facility plate having a coolant channel disposed therein. The facility plate includes a plate portion and a flange portion. The plate portion is coupled to the ESC base assembly and the flange portion coupled to the ESC with a seal assembly. A vacuum region is defined by the ESC, the ESC base assembly, the plate portion of the facility plate, the flange portion of the facility plate, and the seal assembly.