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1.发明授权公开(公告)号：US06703123B1
公开(公告)日：2004-03-09
申请号：US09708615
申请日：2000-11-09
Applicant: Daisuke Shibuta , Hiroyuki Imai , Masahiro Yokomizo , Makoto Tsunashima , Yusuke Maeda , Nobuo Furuya
Inventor： Daisuke Shibuta , Hiroyuki Imai , Masahiro Yokomizo , Makoto Tsunashima , Yusuke Maeda , Nobuo Furuya
IPC: D02G300
CPC classification number: D06M16/00 , D06B5/16 , D06M11/83 , D06M2200/00 , H01B1/22 , Y10T428/2933 , Y10T428/2938 , Y10T428/294 , Y10T428/2944 , Y10T428/2958 , Y10T428/2967 , Y10T428/2969
Abstract: A white conductive fiber is manufactured at an inexpensive cost having superior conductivity and high degree of whiteness, in which a metal coating plated on the fiber has superior adhesiveness. A method for manufacturing the white conductive fiber comprises the steps of mounting a wound fiber body formed by winding a continuous fiber to the fixing shaft, a step of flowing a plating solution from the fixing shaft to a plating bath via the wound fiber body so as to infiltrate the plating solution into the wound fiber body, and a step of performing electroless plating of silver, platinum, or the like on the fiber material while the plating solution flows.
Abstract translation: 以廉价的成本制造白色导电纤维，其具有优异的导电性和高白度，其中涂覆在纤维上的金属涂层具有优异的粘合性。 一种制造白色导电纤维的方法包括以下步骤：将通过将连续纤维缠绕而形成的卷绕的纤维体安装到固定轴上;将电镀液从固定轴经由卷绕的纤维体流动到电镀槽的步骤，以便 将电镀溶液浸入卷绕的纤维体中，以及在电镀液流动的同时在纤维材料上进行银，铂等的无电镀的工序。
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2.发明申请COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND CIRCUIT BOARD 有权铜颗粒分散体，导电膜形成方法和电路板公开(公告)号：US20140370310A1
公开(公告)日：2014-12-18
申请号：US14346519
申请日：2012-01-04
Applicant: Yuichi Kawato , Yusuke Maeda , Tomio Kudo
Inventor： Yuichi Kawato , Yusuke Maeda , Tomio Kudo
CPC classification number: H05K1/097 , C09D11/52 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K3/00 , H05K3/1283 , H05K2203/107 , Y10T428/31678 , H01L2924/00
Abstract: An object is to provide the formulation of a copper particulate dispersion in which copper particulates are dispersed.The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.
Abstract translation: 目的是提供其中分散有铜颗粒的铜颗粒分散体的配方。 铜颗粒分散体包括铜微粒，至少一种含有铜颗粒的分散载体，以及允许铜颗粒分散在分散载体中的至少一种分散剂。 铜颗粒的中心粒径为1nm以上且小于100nm。 分散载体是极性分散载体。 分散剂是具有至少一种酸性官能团的化合物，其分子量为200以上且100,000以下，或其盐。 由此，分散剂与分散载体具有相容性，并且用分散剂分子涂覆铜颗粒的表面，因此将铜微粒分散在分散载体中。
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Patent Agency Ranking
3.发明申请CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND CIRCUIT BOARD 审中-公开导电膜形成方法，铜颗粒分散和电路板公开(公告)号：US20140216799A1
公开(公告)日：2014-08-07
申请号：US14346544
申请日：2012-08-13
Applicant: Yuichi Kawato , Tomohiro Mito , Yusuke Maeda , Tomio Kudo
Inventor： Yuichi Kawato , Tomohiro Mito , Yusuke Maeda , Tomio Kudo
CPC classification number: H05K1/092 , C09D11/52 , H05K1/0306 , H05K1/032 , H05K1/0346 , H05K1/0366 , H05K1/05 , H05K1/097 , H05K3/108 , H05K3/1283 , H05K3/185 , H05K3/241 , H05K3/246 , H05K3/381 , H05K2201/0129 , H05K2201/0145 , H05K2201/2072 , H05K2203/1105
Abstract: An object is to provide a conductive film forming method which can form a conductive film having low electric resistance on a base material by utilizing photo sintering even when the base material has low heat resistance. A conductive film forming method is a method in which a conductive film is formed on a base material, and the method includes the steps of forming a film composed of copper particulates on a base material, subjecting the film to photo sintering, and applying plating to the photo-sintered film. Whereby, it is possible to form a conductive film on a base material by lowering irradiation energy of light in photo sintering even when the base material has low heat resistance. Since the conductive film includes a plated layer, electric resistance decreases.
Abstract translation: 本发明的目的是提供一种导电膜形成方法，其可以通过利用光烧结在基材上形成具有低电阻的导电膜，即使当基材具有低耐热性时也是如此。 导电膜形成方法是在基材上形成导电膜的方法，该方法包括以下步骤：在基材上形成由铜微粒构成的膜，对该膜进行光烧结，并将电镀施加到 光烧结膜。 由此，即使当基材具有低耐热性时，也可以通过降低光烧结中的光的照射能量而在基材上形成导电膜。 由于导电膜包括镀层，所以电阻降低。
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4.发明申请COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND CIRCUIT BOARD 有权铜颗粒分散体，导电膜形成方法和电路板公开(公告)号：US20140216798A1
公开(公告)日：2014-08-07
申请号：US14346534
申请日：2012-01-04
Applicant: Yuichi Kawato , Yusuke Maeda , Tomio Kudo
Inventor： Yuichi Kawato , Yusuke Maeda , Tomio Kudo
CPC classification number: C09D11/52 , C09D11/03 , C09D11/38 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K1/092 , H05K1/095 , H05K1/097 , H05K2203/0514 , H01L2924/00
Abstract: An object is to provide a copper particulate dispersion which is suited to discharge in the form of droplets.The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle having a boiling point within a range from 150° C. to 250° C. Whereby, when the copper particulate dispersion is discharged in the form of droplets, clogging at the discharge portion caused by drying of the dispersion vehicle is prevented and the viscosity is low for its high boiling point, and thus the copper particulate dispersion is suited to discharge in the form of droplets.
Abstract translation: 目的是提供适于以液滴形式排出的铜微粒分散体。 铜颗粒分散体包括铜微粒，至少一种含有铜颗粒的分散载体，以及允许铜颗粒分散在分散载体中的至少一种分散剂。 铜颗粒的中心粒径为1nm以上且小于100nm。 分散载体是沸点在150℃至250℃范围内的极性分散载体。因此，当铜颗粒分散体以液滴的形式排出时，由排出部分堵塞而引起的 防止分散载体并且其高沸点的粘度低，因此铜颗粒分散体适于以液滴的形式排出。
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公开(公告)号：US4078970A
公开(公告)日：1978-03-14
申请号：US722109
申请日：1976-09-10
Applicant: Yoshimasa Fujita , Akiyoshi Matsumoto , Isao Kawakami , Tadashi Hishida , Akira Kamata , Yusuke Maeda
Inventor： Yoshimasa Fujita , Akiyoshi Matsumoto , Isao Kawakami , Tadashi Hishida , Akira Kamata , Yusuke Maeda
Abstract: There is disclosed a process for producing an insolubilized glucose isomerase useful for converting glucose into fructose comprising contacting a macroporous anion exchange resin with glucose isomerase to effect absorption of the isomerase on the resin, said resin having high porosity and high ion exchange capacity, whereby the resulted insolubilized glucose isomerase has high degree of adsorption, high activity retention and high activity yield.
Abstract translation: 公开了一种生产用于将葡萄糖转化为果糖的不溶葡萄糖异构酶的方法，包括使大孔阴离子交换树脂与葡萄糖异构酶接触，以使树脂上的异构酶吸收，所述树脂具有高孔隙率和高离子交换能力， 产生的不溶葡萄糖异构酶具有高吸附度，高活性保持率和高活性产率。
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公开(公告)号：US09615455B2
公开(公告)日：2017-04-04
申请号：US14346519
申请日：2012-01-04
Applicant: Yuichi Kawato , Yusuke Maeda , Tomio Kudo
Inventor： Yuichi Kawato , Yusuke Maeda , Tomio Kudo
CPC classification number: H05K1/097 , C09D11/52 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K3/00 , H05K3/1283 , H05K2203/107 , Y10T428/31678 , H01L2924/00
Abstract: The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.
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7.发明授权Copper particulate dispersion, conductive film forming method and circuit board 有权铜颗粒分散体，导电膜形成方法和电路板公开(公告)号：US09120944B2
公开(公告)日：2015-09-01
申请号：US14346534
申请日：2012-01-04
Applicant: Yuichi Kawato , Yusuke Maeda , Tomio Kudo
Inventor： Yuichi Kawato , Yusuke Maeda , Tomio Kudo
CPC classification number: C09D11/52 , C09D11/03 , C09D11/38 , H01B1/026 , H01B1/22 , H01L23/49883 , H01L2924/0002 , H05K1/092 , H05K1/095 , H05K1/097 , H05K2203/0514 , H01L2924/00
Abstract: An object is to provide a copper particulate dispersion which is suited to discharge in the form of droplets.The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle having a boiling point within a range from 150° C. to 250° C. Whereby, when the copper particulate dispersion is discharged in the form of droplets, clogging at the discharge portion caused by drying of the dispersion vehicle is prevented and the viscosity is low for its high boiling point, and thus the copper particulate dispersion is suited to discharge in the form of droplets.
Abstract translation: 目的是提供适于以液滴形式排出的铜微粒分散体。 铜颗粒分散体包括铜微粒，至少一种含有铜颗粒的分散载体，以及允许铜颗粒分散在分散载体中的至少一种分散剂。 铜颗粒的中心粒径为1nm以上且小于100nm。 分散载体是沸点在150℃至250℃范围内的极性分散载体。因此，当铜颗粒分散体以液滴的形式排出时，由排出部分堵塞而引起的 防止分散载体并且其高沸点的粘度低，因此铜颗粒分散体适于以液滴的形式排出。
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