Invention Grant
- Patent Title: Conductive fiber, manufacturing method therefor, apparatus, and application
- Patent Title (中): 导电纤维,其制造方法,装置和应用
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Application No.: US09708615Application Date: 2000-11-09
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Publication No.: US06703123B1Publication Date: 2004-03-09
- Inventor: Daisuke Shibuta , Hiroyuki Imai , Masahiro Yokomizo , Makoto Tsunashima , Yusuke Maeda , Nobuo Furuya
- Applicant: Daisuke Shibuta , Hiroyuki Imai , Masahiro Yokomizo , Makoto Tsunashima , Yusuke Maeda , Nobuo Furuya
- Priority: JP2000-040879 20000218; JP2000-122587 20000424
- Main IPC: D02G300
- IPC: D02G300

Abstract:
A white conductive fiber is manufactured at an inexpensive cost having superior conductivity and high degree of whiteness, in which a metal coating plated on the fiber has superior adhesiveness. A method for manufacturing the white conductive fiber comprises the steps of mounting a wound fiber body formed by winding a continuous fiber to the fixing shaft, a step of flowing a plating solution from the fixing shaft to a plating bath via the wound fiber body so as to infiltrate the plating solution into the wound fiber body, and a step of performing electroless plating of silver, platinum, or the like on the fiber material while the plating solution flows.
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