Substrate processing apparatus
    1.
    发明授权
    Substrate processing apparatus 有权
    基板加工装置

    公开(公告)号:US09245785B2

    公开(公告)日:2016-01-26

    申请号:US13344663

    申请日:2012-01-06

    IPC分类号: H01L21/677 H01L21/67

    摘要: The present invention provides an in-line type multi-chamber substrate processing apparatus which, with a simple configuration, can decrease influence of particles due to film peeling and enables installation of a number of processing chambers. In one embodiment of the present invention, a jointless arm of a transfer robot that has a substrate holding part 4a and performs rotational movement while maintaining a predetermined length of the arm is disposed inside a first process chamber capable of being evacuated. The first process chamber is configured to be able to transfer substrates from an adjacent second process chamber through an opening by the arm of the transfer robot. A holder as an arm retreating position and a substrate mounting position is positioned so as to overlap with a trajectory of the substrate holding part when the arm of the transfer robot rotates about a rotation axis.

    摘要翻译: 本发明提供了一种在线型多室基板处理装置,其具有简单的结构,可以减少由于膜剥离引起的颗粒的影响,并且能够安装多个处理室。 在本发明的一个实施例中,具有基板保持部4a并且在保持臂的预定长度的同时进行旋转运动的传送机器人的无接头臂设置在能够被抽真空的第一处理室的内部。 第一处理室被配置为能够通过传送机器人的臂从相邻的第二处理室传送基板通过开口。 作为臂退避位置的保持器和基板安装位置被定位成当传送机器人的臂围绕旋转轴旋转时与基板保持部的轨迹重叠。

    Vacuum Processing Apparatus, Method for Manufacturing Semiconductor Device, and System For Manufacturing Semiconductor Device
    3.
    发明申请
    Vacuum Processing Apparatus, Method for Manufacturing Semiconductor Device, and System For Manufacturing Semiconductor Device 审中-公开
    真空处理装置,半导体装置的制造方法以及制造半导体装置的系统

    公开(公告)号:US20080171435A1

    公开(公告)日:2008-07-17

    申请号:US11989319

    申请日:2006-07-25

    IPC分类号: H01L21/44 C23C16/00

    摘要: A vacuum processing apparatus including at least three transfer chambers that have transfer robot arms for transferring a substrate, one or more processing chambers connected to each of the transfer chambers; one or more substrate mounts disposed in the interior thereof; a single common vacuum chamber in which the transfer robot arms of the at least three transfer chambers are disposed in positions that allow the arms to reach the substrate mount, and which is used for handing off the substrate by the transfer robot arms between at least two transfer chambers and at least one substrate mount; and load-lock chambers connected to at least one transfer chamber.

    摘要翻译: 一种真空处理装置,包括至少三个传送室,所述传送室具有用于传送基板的传送机器人臂,连接到每个传送室的一个或多个处理室; 设置在其内部的一个或多个衬底安装件; 单个公共真空室,其中至少三个传送室的传送机械手臂设置在允许臂到达衬底安装件的位置,并且其用于通过传送机器人手臂将至少两个 传送室和至少一个基板安装座; 以及与至少一个传送室连接的装载室。

    SUBSTRATE PROCESSING APPARATUS
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号:US20120148375A1

    公开(公告)日:2012-06-14

    申请号:US13344663

    申请日:2012-01-06

    IPC分类号: B65G49/00

    摘要: The present invention provides an in-line type multi-chamber substrate processing apparatus which, with a simple configuration, can decrease influence of particles due to film peeling and enables installation of a number of processing chambers. In one embodiment of the present invention, a jointless arm of a transfer robot that has a substrate holding part 4a and performs rotational movement while maintaining a predetermined length of the arm is disposed inside a first process chamber capable of being evacuated. The first process chamber is configured to be able to transfer substrates from an adjacent second process chamber through an opening by the arm of the transfer robot. A holder as an arm retreating position and a substrate mounting position is positioned so as to overlap with a trajectory of the substrate holding part when the arm of the transfer robot rotates about a rotation axis.

    摘要翻译: 本发明提供了一种在线型多室基板处理装置,其具有简单的结构,可以减少由于膜剥离引起的颗粒的影响,并且能够安装多个处理室。 在本发明的一个实施例中,具有基板保持部4a并且在保持臂的预定长度的同时进行旋转运动的传送机器人的无接头臂设置在能够被抽真空的第一处理室的内部。 第一处理室被配置为能够通过传送机器人的臂从相邻的第二处理室传送基板通过开口。 作为臂退避位置的保持器和基板安装位置被定位成当传送机器人的臂围绕旋转轴旋转时与基板保持部的轨迹重叠。

    SUBSTRATE CONVEYANCE APPARATUS, ELECTRONIC DEVICE MANUFACTURING SYSTEM, AND ELECTRONIC DEVICE MANUFACTURING METHOD
    6.
    发明申请
    SUBSTRATE CONVEYANCE APPARATUS, ELECTRONIC DEVICE MANUFACTURING SYSTEM, AND ELECTRONIC DEVICE MANUFACTURING METHOD 审中-公开
    基板输送装置,电子装置制造系统及电子装置制造方法

    公开(公告)号:US20120014770A1

    公开(公告)日:2012-01-19

    申请号:US13182578

    申请日:2011-07-14

    CPC分类号: H01L21/67742

    摘要: A substrate conveyance apparatus includes a first driving shaft, an arm portion having one end connected to the first driving shaft, a substrate holding unit capable of holding a substrate, and a connecting portion that connects the other end of the arm portion and the substrate holding unit. The connecting portion includes a rotating support portion that supports the substrate holding unit rotatably with respect to the arm portion, and a moving unit that moves the substrate holding unit upward or downward with respect to the arm portion in the direction of the rotating shaft about which the substrate holding unit is rotated by the rotating support portion.

    摘要翻译: 一种基板输送装置,包括:第一驱动轴,具有与第一驱动轴连接的一端的臂部;能够保持基板的基板保持单元;连接臂部的另一端与基板保持用的连接部; 单元。 连接部分包括相对于臂部分可旋转地支撑基板保持单元的旋转支撑部分和移动单元,该移动单元使基板保持单元相对于臂部沿着旋转轴的方向向上或向下移动, 基板保持单元通过旋转支撑部旋转。