发明申请
US20080171435A1 Vacuum Processing Apparatus, Method for Manufacturing Semiconductor Device, and System For Manufacturing Semiconductor Device
审中-公开
真空处理装置，半导体装置的制造方法以及制造半导体装置的系统
- 专利标题： Vacuum Processing Apparatus, Method for Manufacturing Semiconductor Device, and System For Manufacturing Semiconductor Device
- 专利标题（中）： 真空处理装置，半导体装置的制造方法以及制造半导体装置的系统
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申请号： US11989319申请日： 2006-07-25
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公开(公告)号： US20080171435A1公开(公告)日： 2008-07-17
- 发明人: Takahiro Fujii , Yukihito Tashiro , Seiji Itani , Motozo Kurita
- 申请人： Takahiro Fujii , Yukihito Tashiro , Seiji Itani , Motozo Kurita
- 申请人地址： JP Kawasaki-shi
- 专利权人： Canon ANELVA Corporation
- 当前专利权人： Canon ANELVA Corporation
- 当前专利权人地址： JP Kawasaki-shi
- 优先权： JP2005-214550 20050725
- 国际申请： PCT/JP2006/314619 WO 20060725
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; C23C16/00
摘要：
A vacuum processing apparatus including at least three transfer chambers that have transfer robot arms for transferring a substrate, one or more processing chambers connected to each of the transfer chambers; one or more substrate mounts disposed in the interior thereof; a single common vacuum chamber in which the transfer robot arms of the at least three transfer chambers are disposed in positions that allow the arms to reach the substrate mount, and which is used for handing off the substrate by the transfer robot arms between at least two transfer chambers and at least one substrate mount; and load-lock chambers connected to at least one transfer chamber.
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