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137 条记录 (耗时 0.039 秒)

    Thermoelectric device and method for fabricating the same
    4.
    发明授权
    Thermoelectric device and method for fabricating the same 有权
    热电装置及其制造方法

    公开(公告)号：US08940995B2

    公开(公告)日：2015-01-27

    申请号：US12632403

    申请日：2009-12-07

    申请人： Young-Sam Park ,  Moon-Gyu Jang ,  Taehyoung Zyung ,  Younghoon Hyun ,  Myungsim Jun

    发明人： Young-Sam Park ,  Moon-Gyu Jang ,  Taehyoung Zyung ,  Younghoon Hyun ,  Myungsim Jun

    IPC分类号： H01L35/12 ,  H01L35/32

    CPC分类号： H01L35/32 ,  H01L35/26 ,  H01L35/34

    摘要： A thermoelectric device is provided. The thermoelectric device includes first and second electrodes, a first leg, a second leg, and a common electrode. The first leg is disposed on the first electrode and includes one or more first semiconductor pattern and one or more first barrier patterns. The second leg is disposed on the second electrode and includes one or more second semiconductor pattern and one or more second barrier patterns. The common electrode is disposed on the first leg and the second leg. Herein, the first barrier pattern has a lower thermal conductivity than the first semiconductor pattern, and the second barrier pattern has a lower thermal conductivity than the second semiconductor pattern. The first/second barrier pattern has a higher electric conductivity than the first/second semiconductor pattern. The first/second barrier pattern forms an ohmic contact with the first/second semiconductor pattern.

    摘要翻译： 提供了一种热电装置。 热电装置包括第一和第二电极，第一支腿，第二支腿和公共电极。 第一支腿设置在第一电极上并且包括一个或多个第一半导体图案和一个或多个第一屏障图案。 第二腿设置在第二电极上，并且包括一个或多个第二半导体图案和一个或多个第二屏障图案。 公共电极设置在第一腿部和第二腿部上。 这里，第一阻挡图案的热导率比第一半导体图案低，第二阻挡图案的热导率比第二半导体图案低。 第一/第二阻挡图案具有比第一/第二半导体图案更高的导电性。 第一/第二屏障图案与第一/第二半导体图案形成欧姆接触。

    Light emitting diode package and fabrication method thereof
    5.
    发明授权
    Light emitting diode package and fabrication method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08735931B2

    公开(公告)日：2014-05-27

    申请号：US12907348

    申请日：2010-10-19

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    Plane light source and LCD backlight unit having the same
    6.
    发明授权
    Plane light source and LCD backlight unit having the same 有权
    平面光源和具有相同的LCD背光单元

    公开(公告)号：US08488081B2

    公开(公告)日：2013-07-16

    申请号：US12839945

    申请日：2010-07-20

    申请人： Seong Yeon Han ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Young June Jeong ,  Young Sam Park ,  Chul Hee Yoo

    发明人： Seong Yeon Han ,  Hun Joo Hahm ,  Hyung Suk Kim ,  Young June Jeong ,  Young Sam Park ,  Chul Hee Yoo

    IPC分类号： G02F1/1335

    CPC分类号： G02F1/133603

    摘要： There are provided a plane light source and an LCD backlight unit having the same. A plane light source including light emitting device matrixes each having a plurality of light emitting devices arranged in rows and columns on a substrate according to an aspect of the invention includes: a first matrix having a plurality of light emitting devices arranged in rows and columns; and a second matrix having a plurality of light emitting devices arranged in rows and columns, the light emitting devices each located within a rectangle formed by four adjacent light emitting devices included in the first matrix, and forming angles θ satisfying the condition of 45°≦θ≦55° therebetween on the basis of a horizontal direction, wherein among pitches between one light emitting devices included in the light emitting device matrixes and another lighting light emitting device adjacent to the light emitting device, a pitch P1 between the light emitting device and the light emitting device diagonally across from the light emitting device satisfies the condition of 25 mm≦P1≦29 mm, and a pitch P2 between the light emitting device and another light emitting device located in a horizontal direction satisfies the condition of 34 mm≦P2≦38 mm.

    摘要翻译： 提供有平面光源和具有该平面光​​源的LCD背光单元。 根据本发明的一个方面的包括发光器件矩阵的平面光源包括：具有排列成行和列的多个发光器件的发光器件矩阵，包括：具有排列成行和列的多个发光器件的第一矩阵; 以及具有排列成行和列的多个发光器件的第二矩阵，所述发光器件各自位于由包括在所述第一矩阵中的四个相邻的发光器件形成的矩形内，并且形成满足条件为45°@ 其中基于水平方向的θ@ 55°，其中在包括在发光器件矩阵中的一个发光器件和与发光器件相邻的另一个照明发光器件之间的间距中，发光器件与 发光器件对角地穿过发光器件的发光器件满足25mm @ P1 @ 29mm的条件，并且发光器件和位于水平方向的另一个发光器件之间的间距P2满足条件为34mm @ P2 @ 38毫米。

    Direct-type backlight unit having surface light source
    10.
    发明授权
    Direct-type backlight unit having surface light source 失效
    具有表面光源的直接型背光单元

    公开(公告)号：US07887225B2

    公开(公告)日：2011-02-15

    申请号：US11822331

    申请日：2007-07-05

    申请人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

    发明人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

    IPC分类号： F21V8/00

    CPC分类号： G02F1/133603 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2933/005 ,  H01L2224/0401

    摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

    摘要翻译： 在直接型背光单元中，板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里，在各单位光源中，在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。 此外，密封剂在侧壁内形成为圆顶形状。 以这种方式，发光器件通过板上芯片技术安装在板上。