LED package having recess in heat conducting part
    1.
    发明授权
    LED package having recess in heat conducting part 有权
    LED封装在导热部分具有凹槽

    公开(公告)号:US08169128B2

    公开(公告)日:2012-05-01

    申请号:US11500361

    申请日:2006-08-08

    IPC分类号: H01J1/02

    摘要: The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.

    摘要翻译: 本发明提供了一种包括LED芯片的LED封装。 在LED封装中,折叠的金属片的导热部分具有形成在其上的凹部,以将LED芯片置于其中。 包装体容纳导热部分,并将LED芯片产生的光向上引导。 此外,透明密封剂至少设置在导热部分的凹部上。 引线部分地由封装体容纳以向LED芯片供电。 根据本发明,折叠金属板以形成导热部分,并且在导热部分上形成凹部以将LED芯片置于其中。 这提高了反射效率并简化了整个过程。

    LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTURING THE SAME
    2.
    发明申请
    LIGHT EMITTING DIODE PACKAGE WITH DIFFUSER AND METHOD OF MANUFACTURING THE SAME 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号:US20090155938A1

    公开(公告)日:2009-06-18

    申请号:US12370194

    申请日:2009-02-12

    IPC分类号: H01L21/56

    摘要: The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译: 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂,其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开,实现来自LED芯片的均匀的扩散和发射,从而增加辐射角度并获得均匀的光源。

    Direct-type backlight unit having surface light source
    4.
    发明申请
    Direct-type backlight unit having surface light source 失效
    具有表面光源的直接型背光单元

    公开(公告)号:US20080007939A1

    公开(公告)日:2008-01-10

    申请号:US11822331

    申请日:2007-07-05

    IPC分类号: G09F13/04

    摘要: In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

    摘要翻译: 在直接型背光单元中,板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里,在各单位光源中,在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围,非导电侧壁的高度低于发光器件的高度。 此外,密封剂在侧壁内形成为圆顶形状。 以这种方式,发光器件通过板上芯片技术安装在板上。

    Flat panel display device
    5.
    发明授权
    Flat panel display device 失效
    平板显示设备

    公开(公告)号:US06525463B1

    公开(公告)日:2003-02-25

    申请号:US09323520

    申请日:1999-06-01

    IPC分类号: H01J150

    CPC分类号: H01J29/68 H01J31/127

    摘要: A flat panel display device comprises a cathode on a first substrate for emitting electrons, a magnetic plate including first region focusing electrons emitted from the cathode to display an image and second region for applying the uniform magnetic field into the holes in the first region, and a fluorescent layer on the second substrate, on which the electrons outputted from the holes are impacted. In the second region, there are holes having the same shape and pitch as the first region.

    摘要翻译: 平板显示装置包括用于发射电子的第一基板上的阴极,包括聚焦从阴极发射的电子以显示图像的第一区域的磁性板和用于将均匀磁场施加到第一区域中的孔的第二区域,以及 在第二基板上的从孔中输出的电子受到冲击的荧光层。 在第二区域中,具有与第一区域相同的形状和间距的孔。

    Light emitting diode package and fabrication method thereof
    7.
    发明授权
    Light emitting diode package and fabrication method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号:US08168453B2

    公开(公告)日:2012-05-01

    申请号:US12370802

    申请日:2009-02-13

    IPC分类号: H01L21/56

    摘要: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译: 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架,每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体,并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片,以及用于封装发光二极管芯片的透明密封剂。

    Light emitting diode package with diffuser and method of manufacturing the same
    8.
    发明授权
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号:US07790482B2

    公开(公告)日:2010-09-07

    申请号:US12370194

    申请日:2009-02-12

    IPC分类号: H01L21/00

    摘要: The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译: 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂,其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开,实现来自LED芯片的均匀的扩散和发射,从而增加辐射角度并获得均匀的光源。

    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF
    9.
    发明申请
    LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF 有权
    发光二极管封装及其制造方法

    公开(公告)号:US20090197360A1

    公开(公告)日:2009-08-06

    申请号:US12370802

    申请日:2009-02-13

    IPC分类号: H01L21/56

    摘要: An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译: 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架,每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体,并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片,以及用于封装发光二极管芯片的透明密封剂。