摘要:
Provided a salt production automation system utilizing three-dimensionally structured evaporation fields. The salt production automation system utilizing three-dimensionally structured evaporation fields includes: evaporation fields which have collection pools (SWT) and are installed in at least two separate places; a plurality of evaporation members which are three-dimensionally arranged in the evaporation fields to make seawater flow downwards; and a seawater supply unit which supplies seawater to the evaporation members so that seawater can flow downwards from the evaporation members, wherein among the evaporation fields, the number of evaporation members gradually decreases from the first stage evaporation field to the final stage evaporation field.
摘要:
High efficiency seawater evaporation apparatus comprises showering unit installed at the saltpan; and evaporation rope module wherein multiple evaporation ropes are collected in group by the holder and the respective evaporation modules are extended along the upper and lower direction in the state each other separated in a predetermined interval and wherein, when the seawater is supplied to the respective evaporation ropes by the showering unit, the seawater may flow down along the surface of the respective evaporation ropes and the evaporation of the seawater may be accelerated.
摘要:
Design rules for circuit patterns of a semiconductor device are identified, and schematic layouts of the circuit patterns are generated according to the design rules. Lithography friendly layout (LFL) circuit patterns are generated from the schematic layouts. Target layout circuit patterns are generated from the LFL circuit patterns. Optical proximity effect correction (OPC) is performed on the target layout circuit patterns to generate OPC circuit patterns. A mask is fabricated from the OPC circuit patterns, and may be used fabricate a semiconductor device.
摘要:
A product layout testing method includes testing and correcting one or more patterns of a product layout, detecting and correcting electrical characteristic changes of transistors of the product layout, and testing whether a product characteristic predicted from the product layout is equal to that predicted from a designed circuit view. Weak points with respect to the pattern may be detected and corrected, electrical characteristic changes depending on layout parameters may be detected and corrected, and whether a circuit operation depending on parasitic components is normal may be checked.
摘要:
A product layout testing method includes testing and correcting one or more patterns of a product layout, detecting and correcting electrical characteristic changes of transistors of the product layout, and testing whether a product characteristic predicted from the product layout is equal to that predicted from a designed circuit view. Weak points with respect to the pattern may be detected and corrected, electrical characteristic changes depending on layout parameters may be detected and corrected, and whether a circuit operation depending on parasitic components is normal may be checked.
摘要:
Design rules for circuit patterns of a semiconductor device are identified, and schematic layouts of the circuit patterns are generated according to the design rules. Lithography friendly layout (LFL) circuit patterns are generated from the schematic layouts. Target layout circuit patterns are generated from the LFL circuit patterns. Optical proximity effect correction (OPC) is performed on the target layout circuit patterns to generate OPC circuit patterns. A mask is fabricated from the OPC circuit patterns, and may be used fabricate a semiconductor device.
摘要:
A method of correcting a design pattern of a mask takes into account the overlay margin between adjacent one of actual patterns that are stacked on a substrate. First, a pattern of a photomask for forming a first one of the actual patterns on a substrate is conceived. Also, information representing the image of a second one of the actual patterns is produced. Then, optical proximity correction (OPC) is performed on the first pattern based on the information. The information may be obtained by simulating the transcription of a photomask having a second pattern designed to form the second actual pattern, or by forming the second actual pattern and then capturing the image of the second actual pattern. Accordingly, a sufficient margin is provided between the second actual pattern and the first pattern on which the optical proximity correction has been performed.
摘要:
High efficiency seawater evaporation apparatus comprises showering unit installed at the saltpan; and evaporation rope module wherein multiple evaporation ropes are collected in group by the holder and the respective evaporation modules are extended along the upper and lower direction in the state each other separated in a predetermined interval and wherein, when the seawater is supplied to the respective evaporation ropes by the showering unit, the seawater may flow down along the surface of the respective evaporation ropes and the evaporation of the seawater may be accelerated.
摘要:
Provided a salt production automation system utilizing three-dimensionally structured evaporation fields. The salt production automation system utilizing three-dimensionally structured evaporation fields includes: evaporation fields which have collection pools (SWT) and are installed in at least two separate places; a plurality of evaporation members which are three-dimensionally arranged in the evaporation fields to make seawater flow downwards; and a seawater supply unit which supplies seawater to the evaporation members so that seawater can flow downwards from the evaporation members, wherein among the evaporation fields, the number of evaporation members gradually decreases from the first stage evaporation field to the final stage evaporation field.
摘要:
An IC device includes a substrate including a device region having a fin-type active region and a deep trench region; a gate line that extends in a direction intersecting the fin-type active region; and an inter-device isolation layer that fills the deep trench region. The gate line includes a first gate portion that extends on the device region to cover the fin-type active region and has a flat upper surface at a first level and a second gate portion that extends on the deep trench region to cover the inter-device isolation layer while being integrally connected to the first gate portion and has an upper surface at a second level that is closer to the substrate than the first level.