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公开(公告)号：US20210086323A1
公开(公告)日：2021-03-25
申请号：US16918617
申请日：2020-07-01
Inventor： Yong KANG
Abstract: A polishing device includes a bearing mechanism including a bearing plate configured to carry wafers and drive the wafer to rotate and a first polishing mechanism including at least one group of rotatable first polishing wheels. Each first polishing wheel is formed with a first polishing groove extending along a circumferential direction. Each group includes two first polishing wheels. The two first polishing wheels in each group are arranged symmetrically with respect to the bearing plate and rotation axes of the two first polishing wheels are coplanar with a rotation axis of the bearing plate. The two first polishing wheels in each group are capable of moving close to or away from the wafer, so that an inner sidewall of the first polishing groove is pressed against or moves away from the wafer.
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2.发明申请公开(公告)号：US20220356598A1
公开(公告)日：2022-11-10
申请号：US17627717
申请日：2021-06-23
Applicant: Xi'an ESWIN Material Technology Co., Ltd. , Xi'an ESWIN Silicon Wafer Technology Co., Ltd.
Inventor： Wenwu YANG , Bokcheol SIM
Abstract: An assembly sleeve of a single crystal pulling apparatus, and the single crystal pulling apparatus are provided. The assembly sleeve includes inner and outer cylinders and a bottom cylinder. The outer cylinder is provided with openings at both ends and sleeved onto the inner cylinder. The bottom cylinder is arranged at the opening at a lower end of the outer cylinder, and includes an annular plate and a lower cylinder. Each of the inner lower cylinders is of an inverted-cone shape, an upper end of the inner cylinder is connected to an upper end of the outer cylinder, an outer edge of the annular plate is hermetically connected to the lower end of the outer cylinder, an inner edge of the annular plate is connected to an upper end of the lower cylinder, and a lower end of the inner cylinder is fixedly connected to an upper surface of the annular plate.
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3.发明申请公开(公告)号：US20210114165A1
公开(公告)日：2021-04-22
申请号：US16918041
申请日：2020-07-01
Inventor： Yuxuan Guo , Sungwoo Cho
Abstract: A method for preparing a polishing pad includes: preparing a polishing pad transition structure formed with a plurality of grooves, openings of the plurality of grooves being all located on a same side surface of the polishing pad transition structure; filling the plurality of grooves of the polishing pad transition structure with inorganic nanoparticles; pouring a mixture of a liquid polymer and a curing agent on the polishing pad transition structure, and evacuating air in the liquid polymer and the plurality of grooves; and placing the polishing pad transition structure in an environment at a temperature higher than or equal to a first temperature threshold, and the cured liquid polymer and the polishing pad transition structure constituting the polishing pad.
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4.发明授权公开(公告)号：US11932961B2
公开(公告)日：2024-03-19
申请号：US17627717
申请日：2021-06-23
Applicant: Xi'an ESWIN Material Technology Co., Ltd. , Xi'an ESWIN Silicon Wafer Technology Co., Ltd.
Inventor： Wenwu Yang , Bokcheol Sim
Abstract: An assembly sleeve of a single crystal pulling apparatus, and the single crystal pulling apparatus are provided. The assembly sleeve includes inner and outer cylinders and a bottom cylinder. The outer cylinder is provided with openings at both ends and sleeved onto the inner cylinder. The bottom cylinder is arranged at the opening at a lower end of the outer cylinder, and includes an annular plate and a lower cylinder. Each of the inner lower cylinders is of an inverted-cone shape, an upper end of the inner cylinder is connected to an upper end of the outer cylinder, an outer edge of the annular plate is hermetically connected to the lower end of the outer cylinder, an inner edge of the annular plate is connected to an upper end of the lower cylinder, and a lower end of the inner cylinder is fixedly connected to an upper surface of the annular plate.
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公开(公告)号：US12209326B2
公开(公告)日：2025-01-28
申请号：US18571398
申请日：2022-09-30
Applicant: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. , XI'AN ESWIN SILICON WAFER TECHNOLOGY CO., LTD.
Inventor： Fan Chen , Pengju Zhang , Chaochao Guo
Abstract: A silicon material processing apparatus includes a feed assembly, a scanning assembly, a controller, and a loading assembly. The feed assembly is used for conveying a silicon material and includes a feeding area, a scanning area, and a loading area sequentially arranged along the conveying direction. The silicon material to be conveyed is added to the feeding assembly in the feeding area. The scanning assembly is arranged correspondingly to the scanning area and is used for collecting silicon material information of a silicon material that is located in the scanning area. The silicon material information includes one or more of a shape characteristics and a size characteristics of the silicon material. The controller is connected with the scanning assembly and is used for generating a loading strategy according to the silicon material information.
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Patent Agency Ranking
公开(公告)号：US12138743B2
公开(公告)日：2024-11-12
申请号：US16918617
申请日：2020-07-01
Applicant: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. , XI'AN ESWIN SILICON WAFER TECHNOLOGY CO., LTD.
Inventor： Yong Kang
Abstract: A polishing device includes a bearing mechanism including a bearing plate configured to carry wafers and drive the wafer to rotate and a first polishing mechanism including at least one group of rotatable first polishing wheels. Each first polishing wheel is formed with a first polishing groove extending along a circumferential direction. Each group includes two first polishing wheels. The two first polishing wheels in each group are arranged symmetrically with respect to the bearing plate and rotation axes of the two first polishing wheels are coplanar with a rotation axis of the bearing plate. The two first polishing wheels in each group are capable of moving close to or away from the wafer, so that an inner sidewall of the first polishing groove is pressed against or moves away from the wafer.
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公开(公告)号：US11629985B2
公开(公告)日：2023-04-18
申请号：US16912885
申请日：2020-06-26
Applicant: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. , XI'AN ESWIN SILICON WAFER TECHNOLOGY CO., LTD.
Inventor： Hao Pan , Hyunguk Jeon
Abstract: The present disclosure provides a method for regulating an inert gas flow in a crystal pulling furnace, a method for preparing monocrystalline silicon, and monocrystalline silicon. The method for regulating an inert gas flow includes introducing the inert gas into a main furnace chamber of the crystal pulling furnace from an auxiliary furnace chamber of the crystal pulling furnace, and regulating a flow direction of the inert gas flow introduced into the auxiliary furnace chamber of the crystal pulling furnace.
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8.发明申请公开(公告)号：US20230013467A1
公开(公告)日：2023-01-19
申请号：US17786794
申请日：2021-07-23
Applicant: Xi'an ESWIN Material Technology Co., Ltd. , Xi'an ESWIN Silicon Wafer Technology Co., Ltd.
Inventor： Wenwu YANG , Bokcheol SIM
IPC: C30B15/14
Abstract: A cylinder assembly of a single crystal pulling apparatus and a single crystal pulling apparatus are provided in the present disclosure. The cylinder assembly includes an inner cylinder, an outer cylinder, an annular plate and a sleeve. The inner cylinder has a shape of inverted conical. An upper end of the inner cylinder is connected to an upper end of the outer cylinder. A lower end of the outer cylinder is hermetically connected to an outer edge of the annular plate. A lower end of the inner cylinder is fixedly connected to an upper surface of the annular plate. The sleeve passes through and is fixed in an annular opening of the annular plate.
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9.发明授权公开(公告)号：US12183616B2
公开(公告)日：2024-12-31
申请号：US18568629
申请日：2022-10-21
Applicant: XI'AN ESWIN MATERIAL TECHNOLOGY CO., LTD. , XI'AN ESWIN SILICON WAFER TECHNOLOGY CO., LTD.
Inventor： Leilei Wang , Xun Lan , Housheng Li
IPC: G01B11/27 , H01L21/68 , H01L21/683
Abstract: A method is for positioning a center of a V-type notch of a wafer. The method includes: determining, based on collected edge data of a V-type notch of a wafer, a center of a concentric circle corresponding to edges of the V-type notch; and judging, based on a position relation between the center and a set reference scale line, whether the V-type notch is at a preset target center position. The method also includes determining, based on the position relation between the center and the set reference scale line, a rotation direction and rotation angle of the wafer when the V-type notch is out of the preset target center position; and driving, according to the rotation direction and rotation angle of the wafer, the wafer to rotate until the V-type notch is rotated to the preset target center position.
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公开(公告)号：US12116693B2
公开(公告)日：2024-10-15
申请号：US17786794
申请日：2021-07-23
Applicant: Xi'an ESWIN Material Technology Co., Ltd. , Xi'an ESWIN Silicon Wafer Technology Co., Ltd.
Inventor： Wenwu Yang , Bokcheol Sim
Abstract: A cylinder assembly of a single crystal pulling apparatus and a single crystal pulling apparatus are provided in the present disclosure. The cylinder assembly includes an inner cylinder, an outer cylinder, an annular plate and a sleeve. The inner cylinder has a shape of inverted conical. An upper end of the inner cylinder is connected to an upper end of the outer cylinder. A lower end of the outer cylinder is hermetically connected to an outer edge of the annular plate. A lower end of the inner cylinder is fixedly connected to an upper surface of the annular plate. The sleeve passes through and is fixed in an annular opening of the annular plate.
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