公开(公告)号：US08475375B2

公开(公告)日：2013-07-02

申请号：US11639891

申请日：2006-12-15

Applicant: Lowell Scott Smith ,  Robert Stephen Lewandowski ,  Bruno Hans Haider ,  Charles Edward Baumgartner ,  George Charles Sogoian ,  Christopher Stephen Yetter ,  Douglas Glenn Wildes ,  Stephen Royal Kaiser ,  Svein Bergstoel ,  Reinhold Bruestle ,  Tunc Icoz ,  Steinar Bjaerum ,  Chester Frank Saj

Inventor： Lowell Scott Smith ,  Robert Stephen Lewandowski ,  Bruno Hans Haider ,  Charles Edward Baumgartner ,  George Charles Sogoian ,  Christopher Stephen Yetter ,  Douglas Glenn Wildes ,  Stephen Royal Kaiser ,  Svein Bergstoel ,  Reinhold Bruestle ,  Tunc Icoz ,  Steinar Bjaerum ,  Chester Frank Saj

IPC: A61B8/00

CPC classification number: G01S7/52079 ,  G01S7/52017 ,  G10K11/004

Abstract: An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.

Abstract translation: 提供用于对物体成像的超声系统。 超声波系统包括用于获取超声数据的超声波探头和用于主动地从超声波探头去除热量的冷却子系统。 冷却子系统包括设置在容纳冷却剂的储存器内的泵，并且构造成通过导管使冷却剂循环通过超声波探头。

公开(公告)号：US07812604B2

公开(公告)日：2010-10-12

申请号：US11939611

申请日：2007-11-14

Applicant: Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

Inventor： Tunc Icoz ,  Mehmet Arik ,  Yogen Vishwas Utturkar ,  Bruce Courtney Campbell Amm

IPC: G01V3/00 ,  A61B5/05

CPC classification number: G01R33/34 ,  G01R33/3403 ,  G01R33/3856

Abstract: A thermal management system for cooling a heat generating component of a Magnetic Resonance Imaging (MRI) apparatus includes at least one heat pipe having a portion disposed proximate the heat generating component, such as a gradient coil and/or RF coil. When heat is removed from the component, a working fluid in a relatively hotter end of the heat pipe vaporizes and travels toward a relatively colder end of the heat pipe. The colder end may be operatively coupled to a heat sink for removing the heat from the colder end and increase the overall efficiency of the system. The heat pipe may be disposed along a horizontal, a vertical direction and/or along a diagonal of the heat generating component.

Abstract translation: 用于冷却磁共振成像（MRI）装置的发热部件的热管理系统包括至少一个热管，其具有靠近发热部件设置的部分，例如梯度线圈和/或RF线圈。 当从组件中除去热量时，热管的相对较热端的工作流体向热管的相对较冷的端部蒸发并行进。 较冷的端部可以可操作地联接到散热器，以从较冷的端部移除热量并且增加系统的整体效率。 热管可以沿着水平，垂直方向和/或沿着发热部件的对角线布置。

公开(公告)号：US07902826B2

公开(公告)日：2011-03-08

申请号：US12333423

申请日：2008-12-12

Applicant: Weijun Yin ,  Bruce Campbell Amm ,  Kathleen Melanie Amm ,  Tunc Icoz ,  Yogen Vishwas Utturkar ,  Wensen Wang

Inventor： Weijun Yin ,  Bruce Campbell Amm ,  Kathleen Melanie Amm ,  Tunc Icoz ,  Yogen Vishwas Utturkar ,  Wensen Wang

IPC: G01V3/00

CPC classification number: G01R33/3858 ,  Y10T29/4902

Abstract: A transverse gradient coil for an MRI system is provided. The transverse gradient coil comprises a first coil layer; and an insulation layer made of thermoplastic insulation resin which has a thermal conductivity greater than 1.5 W/m·K, the insulation layer having one side bonded to the first coil layer. A method for manufacturing the transverse gradient coil by injection molding or compression molding is also provided.

Abstract translation: 提供了用于MRI系统的横向梯度线圈。 横向梯度线圈包括第一线圈层; 以及热传导率大于1.5W / m·K的由热塑性绝缘树脂制成的绝缘层，所述绝缘层具有与所述第一线圈层接合的一侧。 还提供了通过注射成型或压缩成型制造横向梯度线圈的方法。

公开(公告)号：US20070053168A1

公开(公告)日：2007-03-08

申请号：US11555681

申请日：2006-11-01

Applicant: Haluk Sayir ,  Arik Mehmet ,  Evan Cooper ,  Tunc Icoz ,  Marc Schaepkens ,  Xiang Liu

Inventor： Haluk Sayir ,  Arik Mehmet ,  Evan Cooper ,  Tunc Icoz ,  Marc Schaepkens ,  Xiang Liu

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  B32B18/00 ,  B32B2315/02 ,  C04B35/522 ,  C04B35/645 ,  C04B2235/9607 ,  C04B2237/086 ,  C04B2237/32 ,  C04B2237/363 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/82 ,  C04B2237/84 ,  F28F3/02 ,  F28F3/022 ,  F28F3/025 ,  F28F13/18 ,  F28F21/02 ,  G06F1/20 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/373 ,  H01L23/3735 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink assembly for an electronic device or a heat generating device(s) is constructed from an ultra-thin graphite layer. The ultra-thin graphite layer exhibits thermal conductivity which is anisotropic in nature and is greater than 500 W/m° C. in at least one plane and comprises at least a graphene layer. The ultra-thin graphite layer is structurally supported by a layer comprising at least one of a metal, a polymeric resin, a ceramic, and a mixture thereof, which is disposed on at least one surface of the graphite layer.

Abstract translation: 用于电子装置或发热装置的散热器组件由超薄石墨层构成。 超薄石墨层本质上具有各向异性的热导率，并且在至少一个平面中大于500W / m℃，并且至少包括石墨烯层。 超薄石墨层在结构上由包含金属，聚合物树脂，陶瓷及其混合物中的至少一种的层支撑，该层设置在石墨层的至少一个表面上。

公开(公告)号：US08695686B2

公开(公告)日：2014-04-15

申请号：US12683826

申请日：2010-01-07

Applicant: Rajdeep Sharma ,  Stanton Earl Weaver, Jr. ,  Charles Erklin Seeley ,  Mehmet Arik ,  Tunc Icoz ,  Charles Franklin Wolfe, Jr. ,  Yogen Vishwas Utturkar

Inventor： Rajdeep Sharma ,  Stanton Earl Weaver, Jr. ,  Charles Erklin Seeley ,  Mehmet Arik ,  Tunc Icoz ,  Charles Franklin Wolfe, Jr. ,  Yogen Vishwas Utturkar

IPC: F28F9/00 ,  F28F7/00

CPC classification number: H05K7/20154 ,  F21K9/23 ,  F21V29/507 ,  F21V29/63 ,  F21V29/83 ,  F21Y2115/10 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20172 ,  H05K7/20409 ,  Y10T29/4935 ,  H01L2924/00

Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Abstract translation: 一种用于去除热量的装置包括具有空腔的散热器和包括安装在该空腔内的至少一个合成射流的合成喷射叠层。 至少一个杆和至少一个接合结构，以提供至少一个合成射流相对于至少一个杆的刚性定位。 合成射流包括至少一个孔口，流体被喷射通过该孔口。

公开(公告)号：US20100148779A1

公开(公告)日：2010-06-17

申请号：US12333423

申请日：2008-12-12

Applicant: Weijun Yin ,  Bruce Campbell Amm ,  Kathleen Melanie Amm ,  Tunc Icoz ,  Yogen Vishwas Utturkar ,  Wensen Wang

Inventor： Weijun Yin ,  Bruce Campbell Amm ,  Kathleen Melanie Amm ,  Tunc Icoz ,  Yogen Vishwas Utturkar ,  Wensen Wang

IPC: G01R33/32 ,  G01R3/00

CPC classification number: G01R33/3858 ,  Y10T29/4902

Abstract: A transverse gradient coil for an MRI system is provided. The transverse gradient coil comprises a first coil layer; and an insulation layer made of thermoplastic insulation resin which has a thermal conductivity greater than 1.5 W/m·K, the insulation layer having one side bonded to the first coil layer. A method for manufacturing the transverse gradient coil by injection molding or compression molding is also provided.

Abstract translation: 提供了用于MRI系统的横向梯度线圈。 横向梯度线圈包括第一线圈层; 以及热传导率大于1.5W / m·K的由热塑性绝缘树脂制成的绝缘层，所述绝缘层具有与所述第一线圈层接合的一侧。 还提供了通过注射成型或压缩成型制造横向梯度线圈的方法。

公开(公告)号：US08496049B2

公开(公告)日：2013-07-30

申请号：US12421068

申请日：2009-04-09

Applicant: Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

Inventor： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

Abstract translation: 提供分布式喷射冷却的散热器。 散热器包括用于热连接到至少一个被加热物体的基座，热耦合到基座的翅片阵列，以及设置在翅片阵列侧面的至少一个多孔合成射流或多个单孔射流。 还提供了具有分布式和集成式射流冷却的散热器，并且包括底座和翅片阵列。 翅片的至少一个子集中的各个翼片包括配置成将周围流体喷射到翅片和底座的周围环境中的合成射流。 提供了具有分布式和集成的喷射式冷却的另一散热器，并且包括底座，翅片阵列和耦合到相应散热片的多个合成射流。 合成射流被提供用于鳍的至少一个子集。

公开(公告)号：US20110162823A1

公开(公告)日：2011-07-07

申请号：US12683826

申请日：2010-01-07

Applicant: Rajdeep Sharma ,  Stanton Earl Weaver, JR. ,  Charles Erklin Seeley ,  Mehmet Arik ,  Tunc Icoz ,  Charles Franklin Wolfe, JR. ,  Yogen Vishwas Utturkar

Inventor： Rajdeep Sharma ,  Stanton Earl Weaver, JR. ,  Charles Erklin Seeley ,  Mehmet Arik ,  Tunc Icoz ,  Charles Franklin Wolfe, JR. ,  Yogen Vishwas Utturkar

IPC: F28D15/00 ,  F28F7/00 ,  F28F13/12 ,  B21D53/02

CPC classification number: H05K7/20154 ,  F21K9/23 ,  F21V29/507 ,  F21V29/63 ,  F21V29/83 ,  F21Y2115/10 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20172 ,  H05K7/20409 ,  Y10T29/4935 ,  H01L2924/00

Abstract: An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

Abstract translation: 一种用于去除热量的装置包括具有空腔的散热器和包括安装在该空腔内的至少一个合成射流的合成喷射叠层。 至少一个杆和至少一个接合结构，以提供至少一个合成射流相对于至少一个杆的刚性定位。 合成射流包括至少一个孔口，流体被喷射通过该孔口。

公开(公告)号：US20100129639A1

公开(公告)日：2010-05-27

申请号：US12277802

申请日：2008-11-25

Applicant: Tunc Icoz ,  Anthony Yu-Chung Ku ,  James Anthony Ruud

Inventor： Tunc Icoz ,  Anthony Yu-Chung Ku ,  James Anthony Ruud

IPC: B32B5/16 ,  B32B5/18 ,  B05D5/00 ,  B05D1/00 ,  B05D1/06 ,  B05D1/18

CPC classification number: C23C24/00 ,  B01B1/06 ,  B01D1/30 ,  F28F13/185 ,  H01L23/44 ,  H01L2924/0002 ,  Y10T428/249953 ,  Y10T428/249986 ,  H01L2924/00

Abstract: Disclosed herein is an that includes a substrate; and a nanoporous coating disposed thereon; the nanoporous coating having a thickness of about 5 nanometers to about 10 micrometers; where an interface between the substrate and the nanoporous coating is disposed at an angle of about 60 degrees to about 120 degrees to a horizontal; the nanoporous coating being in contact with a liquid; the nanoporous coating being operative to improve the critical heat flux by an amount of about 20% to about 100% over a surface that does not have a nanoporous coating.

Abstract translation: 这里公开的是包括基板; 和设置在其上的纳米多孔涂层; 所述纳米多孔涂层具有约5纳米至约10微米的厚度; 其中衬底和纳米多孔涂层之间的界面以与水平面成约60度至约120度的角度设置; 所述纳米多孔涂层与液体接触; 纳米多孔涂层可操作以在不具有纳米多孔涂层的表面上改善约20％至约100％的临界热通量。

公开(公告)号：US07548064B1

公开(公告)日：2009-06-16

申请号：US12006118

申请日：2007-12-29

Applicant: Wensen Wang ,  Bruce Courtney Campbell Amm ,  Weijun Yin ,  Yogen Vishwas Utturkar ,  Tunc Icoz

Inventor： Wensen Wang ,  Bruce Courtney Campbell Amm ,  Weijun Yin ,  Yogen Vishwas Utturkar ,  Tunc Icoz

IPC: G01V3/00

CPC classification number: G01R33/3858 ,  G01R33/4215

Abstract: A folded gradient terminal board end connector includes a multi-layer terminal connection board having a plurality of connection paths and vias configured to provide intercrossing between a plurality of folded gradient coils and further to provide symmetry between the plurality of folded gradient coils without spatial interference between folded portions of the plurality of folded gradient coils to optimize the folded gradient coil efficiency.

Abstract translation: 折叠梯度端子板端连接器包括多层端子连接板，多层端子连接板具有多个连接路径和通孔，其构造成提供多个折叠梯度线圈之间的交叉，并进一步提供多个折叠梯度线圈之间的对称，而没有空间干涉 多个折叠梯度线圈的折叠部分以优化折叠的梯度线圈效率。