Abstract:
The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue. This may result in an enhancement of ultrasound transmission efficiency between the lens of an ultrasound probe comprising such a composition and the patient.
Abstract:
The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue. This may result in an enhancement of ultrasound transmission efficiency between the lens of an ultrasound probe comprising such a composition and the patient.
Abstract:
An ultrasound imaging and therapy system is provided that includes an ultrasound probe and a diagnostic module to control the probe to obtain diagnostic ultrasound signals from a region of interest (ROI) of the patient. The ROI includes adipose tissue and the diagnostic module generates a diagnostic image of the ROI based on the ultrasound signals obtained. The system also includes a display to display the image of the ROI and a user interface to accept user inputs to designate a treatment space within the ROI that corresponds to the adipose tissue. The display displays the treatment space on the image. The system also includes a therapy module to control the probe to deliver, during a therapy session, a therapy to a treatment location based on a therapy parameter. The treatment location is within the treatment space defined by the user inputs.
Abstract:
The present invention provides novel filled silicone compositions comprising a nano-particulate metal oxide filler selected from nano-particulate monoclinic alpha-phase bismuth oxide, nano-particulate erbium oxide, and mixtures thereof. The new composite compositions exhibit a combination of outstanding performance characteristics in both the cured and uncured states. Thus, the uncured formulations are typically free flowing liquids which are self-leveling, which de-gas readily under vacuum, are readily colorable through the addition of pigments, and which cure at temperatures of about 60° C. The cured compositions possess outstanding acoustic characteristics which make them ideally suited for use in applications such as acoustic lenses for medical imaging and therapy. For example, the acoustic impedance of compositions provided by the present invention is closely matched to the acoustic impedance of human tissue. This may result in an enhancement of ultrasound transmission efficiency between the lens of an ultrasound probe comprising such a composition and the patient.
Abstract:
A reconfigurable linear array of sensors (e.g., optical, thermal, pressure, ultrasonic). The reconfigurability allows the size and spacing of the sensor elements to be a function of the distance from the beam center. This feature improves performance for imaging systems having a limited channel count. The improved performance, for applications in which multiple transmit focal zones are employed, arises from the ability to adjust the aperture for a particular depth.
Abstract:
An ultrasonic transducer device comprising: an ultrasonic transducer array micromachined on a substrate; flexible electrical connections connected to the transducer array; and a body of acoustically attenuative material that supports the substrate and the flexible electrical connections. The acoustic backing material may contain additional features, such as tabs or notches, for use in positioning the transducer on fixtures during manufacturing or positioning the transducer within a housing during final assembly. Tabs or other features that are used only during manufacturing may be subsequently removed from the device. The MUT device itself may also be thinned so as to provide flexibility as desired. The backing material is preferably matched in acoustic impedance to the silicon wafer so as to prevent reflection at the interface of any acoustic energy propagating rearward, i.e., in the direction away from the device front surface. The backing material may also possess a high thermal conductivity to assist in removal of heat from the device.
Abstract:
An ultrasound system is provided for imaging an object. The ultrasound system includes an ultrasound probe for acquiring ultrasound data and a cooling subsystem for actively removing heat from the ultrasound probe. The cooling subsystem includes a pump disposed within a reservoir containing a coolant and configured to circulate the coolant through the ultrasound probe via a conduit.
Abstract:
A capacitive micromachined ultrasound transducer (cMUT) cell is presented. The cMUT cell includes a lower electrode. Furthermore, the cMUT cell includes a diaphragm disposed adjacent to the lower electrode such that a gap having a first gap width is formed between the diaphragm and the lower electrode, wherein the diaphragm comprises one of a first epitaxial layer or a first polysilicon layer. In addition, a stress reducing material is disposed in the first epitaxial layer.
Abstract:
The present invention discloses an ultrasonic phased array transducer with an ultralow backfill and a method for making. The ultrasonic phased array includes a low density backfill material having an ultralow acoustic impedance. The backfill material is either an aerogel, a carbon aerogel, an xerogel, or a carbon xerogel. A piezoelectric ceramic material and two matching layers are bonded to the backfill material. In one embodiment, a plurality of interconnect vias are formed in the backfill material with conducting material deposited in the vias. A portion of the bonded matching layers, the piezoelectric ceramic material, and the backfill material have isolation cuts therethrough to form an array of electrically and acoustically isolated individual elements. In a second embodiment, the backfill material is bonded to an electronic layer at a face opposite to the piezoelectric ceramic material and the matching layers. Then isolation cuts are made through the matching layers, the piezoelectric ceramic material, and the backfill material, to form an array of electrically and acoustically isolated individual elements.
Abstract:
The present invention discloses a high density interconnect for an ultrasonic phased array and method for making. The high density interconnect includes a backfill material having grooves formed therein. Each of the grooves are separated a predetermined distance from each other and have a predetermined groove depth. A conducting material is deposited in each of the grooves. The grooved backfill is cut or formed into sections having different lengths. The sections are then reconsolidated into an unitary structure, wherein one end of the structure is electrically conductive in one direction. One surface of the high density interconnect is metallized for bonding with an ultrasonic phased array transducer while the other side is patterned with solder bumps for connection to integrated circuit boards or flexible circuit boards.