The present invention discloses a high density interconnect for an ultrasonic phased array and method for making. The high density interconnect includes a backfill material having grooves formed therein. Each of the grooves are separated a predetermined distance from each other and have a predetermined groove depth. A conducting material is deposited in each of the grooves. The grooved backfill is cut or formed into sections having different lengths. The sections are then reconsolidated into an unitary structure, wherein one end of the structure is electrically conductive in one direction. One surface of the high density interconnect is metallized for bonding with an ultrasonic phased array transducer while the other side is patterned with solder bumps for connection to integrated circuit boards or flexible circuit boards.