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公开(公告)号：US5645974A
公开(公告)日：1997-07-08
申请号：US635814
申请日：1996-04-22
Applicant: Katsuyuki Ohta , Toshiya Takagi , Toshimi Aoyama
Inventor： Katsuyuki Ohta , Toshiya Takagi , Toshimi Aoyama
CPC classification number: G03F7/12 , G03F7/031 , Y10S430/117 , Y10S430/124
Abstract: Compositions comprising a linear base polymer, an ethylenically unsaturated addition-polymerizable compound and a combination of (A) a 1-benzoyl-1-amino-substituted-1-benzylalkane with (B) an .alpha.-phenyl-.alpha.,.alpha.-dialkoxyacetophenone as photopolymerization initiator are suitable for the production of thick-film printing plates.
Abstract translation: 包含线性基础聚合物，烯键式不饱和可加成聚合化合物和（A）1-苯甲酰基-1-氨基取代的-1-苄基链烷烃与（B）α-苯基-α，α-二烷氧基苯乙酮的组合 光聚合引发剂适用于生产厚膜印刷版。
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2.发明授权
公开(公告)号：US5368991A
公开(公告)日：1994-11-29
申请号：US94214
申请日：1993-07-21
Applicant: Kiyoshi Uchikawa , Hiroshi Komano , Toshimi Aoyama , Katsuyuki Ohta
Inventor： Kiyoshi Uchikawa , Hiroshi Komano , Toshimi Aoyama , Katsuyuki Ohta
CPC classification number: G03F7/0007 , G02F1/133512
Abstract: Disclosed is a photosensitive resin composition for use in a light-shielding film, comprising a photosensitive resin and a light-shielding coloring material, wherein light transmission properties after formation of the light-shielding film are controlled by the light-shielding coloring material so that (i) the light transmission through the light-shielding film is 1% or more in at least one wavelength of a light wavelength region of from 330 nm to less than 425 nm, and (ii) the light transmission through the light-shielding film is 2% or less in a light wavelength region of from 425 to 650 nm.
Abstract translation: 公开了一种用于遮光膜的感光性树脂组合物，其包含光敏树脂和遮光性着色材料，其中在形成遮光膜之后的透光性由遮光性着色材料控制，使得 （i）在330nm至小于425nm的光波长区域的至少一个波长中通过遮光膜的透光率为1％以上，（ii）通过遮光膜的透光率 在425〜650nm的光波长区域中为2％以下。
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公开(公告)号：US4384011A
公开(公告)日：1983-05-17
申请号：US302237
申请日：1981-09-14
Applicant: Toshimi Aoyama , Bonpei Kato , Hiroyuki Tohda , Eiichi Tachibana , Shinichi Hikosaka
Inventor： Toshimi Aoyama , Bonpei Kato , Hiroyuki Tohda , Eiichi Tachibana , Shinichi Hikosaka
CPC classification number: B41N1/12
Abstract: A process for producing novel resinous gravure printing plates comprises coating on a printing substrate such as a cylinder a radiation-curable resin coating composition containing in a specific ratio a soluble polyamide resin and a radiation-polymerizable monomer or the like dissolved in a solvent, curing the coated film by irradiation with actinic rays, and engraving the resulting cured film. As a result, a novel resinous gravure printing plate having excellent engraving property, printing durability, and solvent resistance is produced.
Abstract translation: 一种生产新型树脂凹版印刷版的方法，包括在诸如圆筒的印刷基材上涂布一种辐照固化树脂涂料组合物，该组合物以特定比例包含溶解在溶剂中的可溶性聚酰胺树脂和可辐射聚合单体等，固化 通过照射光化射线涂覆涂膜，并雕刻所得的固化膜。 结果，产生了具有优异的雕刻性能，印刷耐久性和耐溶剂性的新型树脂凹版印刷版。
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公开(公告)号：US5541038A
公开(公告)日：1996-07-30
申请号：US417186
申请日：1995-04-05
Applicant: Katsuyuki Ohta , Toshiya Takagi , Toshimi Aoyama
Inventor： Katsuyuki Ohta , Toshiya Takagi , Toshimi Aoyama
CPC classification number: G03F7/12 , G03F7/031 , Y10S430/117 , Y10S430/124
Abstract: Compositions comprising a linear base polymer, an ethylenically unsaturated addition-polymerizable compound and a combination of (A) a 1-benzoyl-1-amino-substituted-1-benzylalkane with (B) an .alpha.-phenyl-.alpha.,.alpha.-dialkoxyacetophenone as photopolymerization initiator are suitable for the production of thick-film printing plates.
Abstract translation: 包含线性基础聚合物，烯键式不饱和可加成聚合化合物和（A）1-苯甲酰基-1-氨基取代的-1-苄基链烷烃与（B）α-苯基-α，α-二烷氧基苯乙酮的组合 光聚合引发剂适用于生产厚膜印刷版。
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公开(公告)号：US5087552A
公开(公告)日：1992-02-11
申请号：US420961
申请日：1989-10-13
Applicant: Tomoki Horigome , Kenji Tazawa , Toshimi Aoyama
Inventor： Tomoki Horigome , Kenji Tazawa , Toshimi Aoyama
IPC: G03F7/027 , C08F8/14 , C08F290/00 , C08F290/12 , C08F299/00 , C08L63/10 , G03F7/033
CPC classification number: G03F7/033 , C08F290/126 , C08F8/14 , C08L63/10 , C08F2810/30
Abstract: The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound.
Abstract translation: 本发明提供了一种在印刷电路板的制造中用作阻焊剂，抗蚀剂或电镀抗蚀剂的光敏树脂组合物，以显示出优异的耐热和化学性能以及对基材表面的良好粘附性。 组合物基本上包含（a）α，β-不饱和二羧酸酐和烯键式不饱和可聚合化合物的共聚树脂，其中酸酐单元用不饱和醇和饱和醇部分酯化，和（b） 光聚合引发剂。 组合物还可以包含任选的成分，例如（c）可光聚合的单体化合物，（d）环氧基树脂和（e）芳族二胺化合物。
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Patent Agency Ranking
公开(公告)号：US4209581A
公开(公告)日：1980-06-24
申请号：US945341
申请日：1978-09-25
Applicant: Hiroshi Takanashi , Toshimi Aoyama , Hisashi Nakane
Inventor： Hiroshi Takanashi , Toshimi Aoyama , Hisashi Nakane
IPC: C08F299/00 , C08F290/00 , C08G12/00 , C08G12/10 , C08G12/12 , C08G12/22 , G03F7/032 , G03F7/038 , G03C1/68
Abstract: A photocurable soluble resin suitable for manufacturing photosensitive resin plates obtained by polycondensing an alkylol derivative or an alkylated alkylol derivative of urea or thiourea with an N-alkylolacrylamide or N-alkylolmethacrylamide in the presence of an acid or an ammonium salt thereof or by reacting urea or thiourea with formaldehyde to form a linear polycondensation product and then grafting an N-alkylolacrylamide or N-alkylolmethacrylamide on the linear polycondensation product in the presence of an acid or an ammonium salt thereof. This soluble resin is incorporated with known soluble resins such as soluble nylon, photosensitizers and thermal polymerization inhibitors and mixed thoroughly to obtain a soluble photosensitive resin composition.
Abstract translation: 适用于制造感光性树脂板的光固化性可溶性树脂，其通过在酸或其铵盐的存在下，使N-羟烷基丙烯酰胺或N-羟烷基甲基丙烯酰胺在其酸或其铵盐的存在下使羟烷基衍生物或脲或硫脲的烷基化羟烷基衍生物缩聚得到，或者使脲或 硫脲与甲醛形成线性缩聚产物，然后在酸或其铵盐的存在下将N-羟烷基丙烯酰胺或N-羟烷基甲基丙烯酰胺接枝在线性缩聚产物上。 该可溶性树脂与已知的可溶性树脂如可溶性尼龙，光敏剂和热聚合抑制剂混合并充分混合以获得可溶性光敏树脂组合物。
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7.发明授权Photosensitive resin composition containing a triazine compound and a pre-sensitized plate using the same, and photosensitive resin composition containing acridine and triazine compounds and a color filter and a pre-sensitized plate using the same 失效含有三嗪化合物的感光性树脂组合物和使用该三嗪化合物的预敏化板，以及含有吖啶和三嗪化合物的感光性树脂组合物和滤色器以及使用其的预敏化板
公开(公告)号：US06010824A
公开(公告)日：2000-01-04
申请号：US889566
申请日：1997-07-08
Applicant: Hiroshi Komano , Takeshi Iwai , Katsuyuki Ohta , Toshimi Aoyama , Kiyoshi Uchikawa
Inventor： Hiroshi Komano , Takeshi Iwai , Katsuyuki Ohta , Toshimi Aoyama , Kiyoshi Uchikawa
CPC classification number: G03F7/0295 , G03F7/029 , Y10S430/116 , Y10S430/121 , Y10S430/126
Abstract: A photosensitive resin composition comprising a polymeric binder, an ethylenically unsaturated monomer and a photopolymerization initiator is disclosed. Also, a PS plate using the same is disclosed. The photopolymerization initiator comprises at least one compound selected from specific triazine compounds having a bromine atom on the substituted phenyl nucleus thereof and specific trihalomethyl-containing triazine compounds. The composition has high photosensitivity sufficient for exposure with an argon laser light and satisfactory developability. Additionally disclosed is a photosensitive resin composition comprising a polymeric binder, a monomer having an ethylenically unsaturated double bond and photopolymerization initiators including an acridine compound and a specific triazine compound. This second photosensitive resin composition has high sensitivity, high resolution and a wide development margin. Using this photosensitive resin composition, color filters and PS plates can be produced that have high sensitivity and resolution even to low-energy visible light and which assure high pattern reproducibility.
Abstract translation: 公开了一种包含聚合物粘合剂，烯属不饱和单体和光聚合引发剂的感光性树脂组合物。 此外，公开了使用该PS板的PS板。 光聚合引发剂包括选自具有取代的苯基上的溴原子的特定的三嗪化合物和特定的含三卤甲基的三嗪化合物中的至少一种化合物。 该组合物具有足够高的用于用氩激光曝光的光敏性和令人满意的显影性。 另外公开了包含聚合物粘合剂，具有烯属不饱和双键的单体和包含吖啶化合物和特定三嗪化合物的光聚合引发剂的光敏树脂组合物。 该第二感光性树脂组合物具有高灵敏度，高分辨率和较宽的显影余量。 使用这种感光性树脂组合物，即使对低能量可见光也能产生具有高灵敏度和分辨率的滤色器和PS板，并且确保高图案再现性。
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8.发明授权Photosensitive resin composition used in a method for forming a light-shielding film 失效用于形成遮光膜的方法中的光敏树脂组合物
公开(公告)号：US5498498A
公开(公告)日：1996-03-12
申请号：US282464
申请日：1994-08-01
Applicant: Kiyoshi Uchikawa , Hiroshi Komano , Toshimi Aoyama , Katsuyuki Ohta
Inventor： Kiyoshi Uchikawa , Hiroshi Komano , Toshimi Aoyama , Katsuyuki Ohta
IPC: G02B5/20 , G02F1/1335 , G03F7/00 , G03F7/004 , G03F7/105 , G03F7/11 , G03F7/38 , G03F7/008 , G03F7/022
CPC classification number: G03F7/0007 , G02F1/133512
Abstract: Disclosed is a photosensitive resin composition for use in a light-shielding film, comprising a photosensitive resin and a light-shielding coloring material, wherein light transmission properties after formation of the light-shielding film are controlled by the light-shielding coloring material so that (i) the light transmission through the light-shielding film is 1% or more in at least one wavelength of a light wavelength region of from 330 nm to less than 425 nm, and (ii) the light transmission through the light-shielding film is 2% or less in a light wavelength region of from 425 to 650 nm.
Abstract translation: 公开了一种用于遮光膜的感光性树脂组合物，其包含光敏树脂和遮光性着色材料，其中在形成遮光膜之后的透光性由遮光性着色材料控制，使得 （i）在330nm至小于425nm的光波长区域的至少一个波长中通过遮光膜的透光率为1％以上，（ii）通过遮光膜的透光率 在425〜650nm的光波长区域中为2％以下。
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公开(公告)号：US5318651A
公开(公告)日：1994-06-07
申请号：US978720
申请日：1992-11-19
Applicant: Koji Matsui , Mitsuru Kimura , Kazuaki Utsumi , Eiichi Ogawa , Hiroshi Komano , Toshimi Aoyama
Inventor： Koji Matsui , Mitsuru Kimura , Kazuaki Utsumi , Eiichi Ogawa , Hiroshi Komano , Toshimi Aoyama
CPC classification number: H05K3/4617 , H01L24/81 , H01L25/50 , H01L2224/13111 , H01L2224/13144 , H01L2224/16 , H01L2224/2929 , H01L2224/293 , H01L2224/81193 , H01L2224/81801 , H01L2224/83101 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/3025 , H05K2203/0278 , H05K3/0023 , H05K3/28 , H05K3/328 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144
Abstract: A method of bonding first and second circuit boards includes applying a light-sensitive adhesive over the first electrodes on a first circuit board and the areas where the first electrodes are not formed, and drying the applied adhesive to form a light-sensitive adhesive layer having the light-sensitive adhesive layer exposed selectively to active rays of light and performing development to remove only the light-sensitive adhesive layer on the first electrodes, and then performing a heat treatment to impart bonding quality to the light-sensitive adhesive layer remaining between adjacent first electrodes, placing the first and second circuit boards one on top of the other and thermocompressing the two circuit boards to have the first electrodes connected electrically to the second electrodes to form a single circuit board; and performing a heat treatment and/or exposure to active rays of light on the formed single circuit board.
Abstract translation: 接合第一和第二电路板的方法包括在第一电路板上的第一电极上和不形成第一电极的区域上施加光敏粘合剂，并干燥所施加的粘合剂以形成具有 光敏粘合剂层选择性地暴露于活性光线并进行显影以除去第一电极上的光敏粘合剂层，然后进行热处理以赋予残留在相邻的粘合剂层之间的粘合剂层的粘合质量 第一电极，将第一和第二电路板放置在另一个之上，并且热压两个电路板，以使第一电极与第二电极电连接以形成单个电路板; 并且对所形成的单电路板进行热处理和/或对活性光线的曝光。
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10.发明授权Method for providing a pattern-wise photoresist layer on a substrate plate and a surface-protected substrate plate therefor 失效在基板上提供图案化的光致抗蚀剂层的方法和用于其的表面保护的基板
公开(公告)号：US4557996A
公开(公告)日：1985-12-10
申请号：US614655
申请日：1984-05-29
Applicant: Toshimi Aoyama , Hiroyuki Tohda , Kazuo Kato , Hisashi Nakane
Inventor： Toshimi Aoyama , Hiroyuki Tohda , Kazuo Kato , Hisashi Nakane
CPC classification number: G03F7/095 , G03F7/091 , H05K3/064 , H05K2203/0577 , H05K2203/066
Abstract: The invention provides an improved method for the so-called dry-film process for forming a pattern-wise photoresist layer on the substrate surface in which a substrate is overlaid and laminated with a preformed film of a photosensitive composition called a dry film and photolithographically processed. In the inventive method, different from conventional dry-film processes, the substrate plate is first provided with a protecting layer of a photosensitive composition containing a halation inhibitor and the lamination with a dry film is performed without removing the protecting layer. After pattern-wise exposure to light, development of the photosensitive layer is undertaken by use of a developer solvent capable of dissolving both of the protecting layer and the pattern-forming layer. Despite the intervention of the protecting layer, the resolving power and image reproducibility are excellent.
Abstract translation: 本发明提供了一种用于在衬底表面上形成图案化光致抗蚀剂层的所谓干膜工艺的改进方法，其中衬底被覆盖并与预先形成的称为干膜的感光组合物的膜层压并且光刻加工 。 在本发明的方法中，与传统的干膜工艺不同，首先提供含有防晕抑制剂的感光组合物的保护层，并且在不除去保护层的情况下进行与干膜的层压。 在图案曝光之后，通过使用能够溶解保护层和图案形成层两者的显影剂溶剂进行感光层的显影。 尽管保护层的干预，分辨率和图像再现性都很好。
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