Abstract:
A memory circuit which uses multiple storage mechanisms in each of its memory cells. In one embodiment, the memory circuit includes an array of cells in which each cell has multiple storage elements. At least one of the storage elements performs its function in a different way than the rest of the storage elements. This use of multiple storage mechanisms allows for a greater freedom in memory cell design and allows for the simultaneous storage of multiple states in a single memory cell. Broadly speaking, the present invention contemplates a memory core comprising an address decoder, an array of cells, and a sense amplifier. The address decoder is configured to receive an address and responsively assert a selected word line. The array of cells includes a selected cell coupled to the selected word line, and each cell in the array of cells includes at least two storage elements. A first storage element is configured with a first state which is one of a first plurality of states, and a second storage element is configured with a second state which is one of a second, different plurality of states. The sense amplifier is coupled to the selected cell via a bit line and configured to detect the first and second states. Each cell may further include a third storage element configured with a third state which is one of a third plurality of states. In this case, the sense amplifier is also configured to detect the third state. Examples of candidate storage states include charges on a capacitance, conductivities of transistors, resistances between terminals, turn-on voltages of transistors, currents flowing in closed loops, and orientations of magnetized material.
Abstract:
A circuit and method which enables storage of more than two logic states in a memory cell by selectively setting threshold voltages of transistors in a memory array according to the present invention. In one embodiment, a memory circuit includes an array of storage transistors. Each storage transistor has a gate connected to an associated read line. When a read line is asserted, the current which flows through a selected storage transistor is indicative of the stored logic state. The current through each transistor is individually selected by setting the threshold voltage of each storage transistor during manufacture. Different transistors in the array are configured with differing threshold voltages to thereby represent different storage states. An analog-to-digital (A/D) converter is coupled to the selected storage transistor so as to sense the current and determine the state represented. Since each cell may represent one of more than two storage states, the memory circuit may advantageously allow an increased number of bits to be stored in each memory cell, thereby increasing the storage density and reducing the cost per bit.
Abstract:
A memory circuit which enables storage of more than two logic states in a memory cell. Since the additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit. The disclosed memory circuit comprises an analog-to-digital converter coupled to detect a current through a transistor in a memory cell. The current is determined by a charge stored on the transistor's gate. By enabling the current to be detected in discrete increments, it becomes possible to represent more than one bit of information with the charge stored in the memory cell. Usage of additional increments necessitates more precise storage and detection circuitry. In one embodiment, the storage circuitry uses feedback to obtain a greater logic state retrieval accuracy.
Abstract:
A multi-port semiconductor memory includes first and second data ports and a plurality of memory cells arranged in rows and columns. Each column comprises first and second pairs of complementary bit lines, which are coupled to each of the memory cells in that column. The first pair of bit lines cross one another between every N and N+1 of the memory cells the column, where N=2M and M is an integer variable greater than zero. A data inversion circuit is coupled between the first pair of bit lines and the first data port, which selectively inverts the first pair of bit lines as a function of the first port's (M+1)th row address input bit only, as measured from the least significant row address input bit.
Abstract:
A test method for a memory device wherein failures that may only occur under specified worst-case conditions are converted to hard functional failures. These locations are subsequently detected and remapped by built-in self test (BIST) and built-in self-repair (BISR) circuitry. First, a test suite is performed on a memory array which includes redundant row and column locations. Typically, this test suite is performed under conditions which are most likely to induce failure. Row and column locations that are determined to be malfunctioning are scanned out of the memory device, along with the number of available redundant rows and columns. If there are sufficient redundant locations, the failing rows and columns are permanently disabled by blowing each of the corresponding fuse links. When power is subsequently applied to the memory device, BIST will detect rows and columns, including those permanently disabled, with hard functional failures. Accesses to these locations may then be redirected by BISR circuitry. The test suite may then be re-executed, and the device deemed defective if additional errors are found. Rows and columns in the memory array that are prone to failure are thus never enabled. Additionally, the BIST and BISR circuitry provides the ability to verify basic memory functionality and remap failing addresses on each application of power to the device. Test coverage of the memory array is advantageously increased.
Abstract:
A memory circuit which uses multiple storage mechanisms in each of its memory cells. In one embodiment, the memory circuit comprises a memory cell array and a data sense module. Each cell of the array includes a first, second and third transistors, and a capacitance. The first transistor has a first gate coupled to a first word line, a floating gate which stores a first charge, a first source coupled to a first data line, and a first drain. The second transistor has a second gate coupled to the first drain, a second source coupled to a second word line, and a second drain. The third transistor has a third gate coupled to a third word line, a third source coupled to the second drain, and a third drain coupled to a second data line. The capacitance is coupled between ground and the third source. The capacitance stores a second charge when the second word line is asserted and the third word line is de-asserted. The second gate stores a third charge when the first word line is de-asserted. The data sense module is coupled to the first and second data lines, and configured to sense the second charge if the third word line is asserted while the second word line is asserted. The data sense module is further configured to sense the third charge by detecting a current through the second transistor if the second word line is de-asserted while the third word line is asserted. The data sense module is still further configured to detect the first charge by storing a fourth charge on said second gate if the first word line is asserted while the first data line is de-asserted, the first data line is then asserted, and the first word line is then de-asserted at a predetermined time period after the assertion of the first data line. The fourth charge is then sensed by detecting a current through the second transistor if the second word line is de-asserted while the third word line is asserted. The data sense module determines the state represented by the stored charge quantities. Since additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit.
Abstract:
A method for testing refresh operations of a memory array wherein subthreshold leakage current may be set to near worst-case conditions. The memory array includes a first row of memory cells having a first memory cell configured to store a first memory value, and a second row of memory cells having a second memory cell configured to store a second memory value. The method comprises storing a logic high value to the first memory cell as the first memory value, followed by storing a logic low value to the second memory cell as the second memory value. The method further comprises repeatedly driving a write bit line coupled to both the first and second memory cells at a logic low level for a period of a time equal to a refresh interval corresponding to the first memory cell. Additionally, the method includes subsequently reading the first memory value from the first memory cell. Finally, the method includes indicating that the first memory cell is operating correctly if the first memory value is still equal to a logic high value, or indicating that the first memory value is malfunctioning if the first memory value is equal to a logic low value. Driving the write bit line low may be accomplished by repetitively reading the second memory cell. The same effect may alternately be achieved by repetitively writing a logic low value to the second memory cell. By keeping the write bit line at a logic low level during testing of refresh operations, the subthreshold leakage current through the write transistor of the first memory cell may be increased. This accelerates the discharge of the first memory value, and insures testing is performed near worst-case conditions.
Abstract:
A memory circuit which enables storage of three logic states in a memory cell. Since the additional logic states may be used to represent additional information bits, this memory circuit increases the number of bits that may be stored per memory cell, thereby increasing the storage density and reducing the cost per bit. The disclosed memory circuit comprises an analog-to-digital converter coupled to detect a current through a transistor in a memory cell. The current is determined by the state of a tri-state flip-flop. By enabling the current to be detected as positive, negative, or zero, it becomes possible to represent more than one bit of information with the state of the flip-flop.
Abstract:
A memory circuit wherein subthreshold leakage current may be reduced. The memory circuit includes a memory array composed of one or more storage cells that are each configured to store a memory value on a storage transistor. The storage cells further include a write transistor coupled to the storage transistor that is configured to allow data driven on a write bit line to be stored to the storage transistor. The write bit line is coupled to a write control unit, which includes a buffer and a offset voltage element. The buffer is configured to establish an output voltage on the write bit line in response to an input voltage. The offset voltage element is coupled to the buffer, and is configured to offset the output voltage on the write bit line by a predetermined amount. In one implementation of the write control unit, the buffer is formed by an inverter that includes a p-channel and an n-channel transistor. The offset voltage element is a diode-connected transistor coupled between the inverter and ground. The diode-connected transistor has the effect of holding the write bit line at a level equal to its threshold voltage when the n-channel transistor of the inverter is active. In another implementation, the buffer is also an inverter that includes a p-channel and an n-channel transistor. The offset voltage element is a pullup transistor that is active when the n-channel transitor of the inverter is active. The pullup transistor forms a voltage divider with the n-channel transistor, such that the voltage between the write bit line and ground is offset by an amount determined by the voltage drop across the pullup transistor. The offset voltage established by the write control unit biases the write transistor such that subthreshold leakage current may be reduced when the write transistor is off.
Abstract:
An energy efficient logic gate circuit design that provides a substantially constant load to a clock source regardless of logic signal inputs to, or outputs from, the gate. The gate provides two complementary outputs and utilizes cross-coupled transistors to ensure that the outputs remain valid (complementary) after the logic inputs become invalid. Two blocks, each having a node coupling to the clock source and performing complementary logic functions, in combination with diodes for recharging the outputs of the gate, present the constant load to the clock source.