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公开(公告)号：US20120003429A1
公开(公告)日：2012-01-05
申请号：US13256138
申请日：2010-03-05
申请人： Takayuki Iwasaki , Tetsuo Fujimura , Akira Sasaki
发明人： Takayuki Iwasaki , Tetsuo Fujimura , Akira Sasaki
CPC分类号： B32B27/32 , B32B25/14 , B32B27/08 , B32B27/20 , B32B27/322 , B32B27/36 , B32B2250/24 , B32B2307/21 , B32B2307/31 , B32B2307/412 , B32B2307/518 , B32B2307/546 , B32B2307/5825 , B32B2307/72 , B32B2307/732 , B32B2457/00 , H01L23/293 , H01L2924/0002 , Y10T428/1352 , Y10T428/24355 , Y10T428/24612 , Y10T428/24942 , Y10T428/2826 , Y10T428/31 , Y10T428/31797 , Y10T428/31855 , Y10T428/31924 , Y10T428/31931 , H01L2924/00
摘要： A cover film comprising a substrate layer, an intermediate layer comprising a resin composition containing 50% by mass or more of a metallocene linear low-density polyethylene resin having a density of 0.900 to 0.940×103 kg/m3, and a sealant layer comprising an ethylene-type copolymerized resin containing 50 to 85% by mass of an olefin component.
摘要翻译： 一种覆盖膜，包括基材层，包含含有50质量％以上的密度为0.900〜0.940×10 3 kg / m 3的茂金属线性低密度聚乙烯树脂的树脂组合物的中间层，以及包含 含有50〜85质量％的烯烃成分的乙烯类共聚树脂。
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公开(公告)号：US20090246518A1
公开(公告)日：2009-10-01
申请号：US12298147
申请日：2007-04-24
IPC分类号： B32B27/08
CPC分类号： B32B27/36 , B29K2009/06 , B29K2023/12 , B29K2067/00 , B32B27/08 , B32B27/16 , B32B27/18 , B32B27/302 , B32B27/306 , B32B27/308 , B32B27/32 , B32B2250/24 , B32B2255/10 , B32B2255/24 , B32B2264/0214 , B32B2264/0235 , B32B2264/025 , B32B2264/10 , B32B2264/102 , B32B2307/202 , B32B2307/21 , B32B2307/31 , B32B2307/50 , B32B2307/518 , B32B2439/06 , B32B2439/46 , B32B2553/00 , Y10T428/269 , Y10T428/31797 , Y10T428/31917
摘要： To provide a cover film with which the temperature range of a sealing iron to obtain peel strength is wide and stability of peel strength is good at the time of peeling, and which is excellent in heat sealing properties to a carrier tape.A cover film comprising a substrate layer and a sealant layer, wherein the substrate layer is made of a biaxially oriented polyester and/or a biaxially oriented polypropylene, the sealant layer contains a hydrogenated resin (a) of a block copolymer of an aromatic vinyl compound and a conjugated diene type hydrocarbon compound, the amount of the aromatic vinyl compound in the resin (a) is at least 20 mass % and at most 45 mass %, and the flowability of the resin (a) is from 1 to 20 g/10 min at a temperature of 230° C. under a load of 2.16 kgf by a measurement method stipulated in JIS K 7210.
摘要翻译： 为了提供一种覆盖膜，其具有使剥离强度高的密封铁的温度范围宽，剥离强度的稳定性在剥离时良好，并且对载带的热封性优异。 一种覆盖膜，包括基材层和密封剂层，其中所述基材层由双轴取向聚酯和/或双轴取向聚丙烯制成，所述密封剂层含有芳族乙烯基化合物的嵌段共聚物的氢化树脂（a） 和共轭二烯烃类化合物，树脂（a）中芳香族乙烯基化合物的量为20质量％以上45质量％以下，树脂（a）的流动性为1〜20g / 通过JIS K 7210规定的测定方法，在2.16kgf的负荷下，在230℃的温度下10分钟。
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公开(公告)号：US07364778B2
公开(公告)日：2008-04-29
申请号：US10178021
申请日：2002-06-24
CPC分类号： H01L21/67356 , H01L21/67366 , H01L21/67396 , H01L23/06 , H01L2924/0002 , Y10T428/1352 , Y10T428/31855 , H01L2924/00
摘要： A container for an electronic component made of a resin, wherein when the container and an electronic component contained in the container are rubbed 20,000 times, a static electrification voltage of at most 2,000V by the absolute value on the surface of the electronic component is generated.
摘要翻译： 一种用于由树脂制成的电子部件的容器，其中当容器和包含在容器中的电子部件摩擦20,000次时，产生至多2,000V的静电充电电压由电子部件的表面上的绝对值产生 。
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公开(公告)号：US09338906B2
公开(公告)日：2016-05-10
申请号：US14112054
申请日：2011-04-18
IPC分类号： B32B27/34 , B32B27/08 , B32B7/06 , B32B27/20 , B32B27/30 , B32B27/32 , B65D43/02 , H05K5/03 , B32B7/12 , B32B27/36 , C09J7/02 , B65D75/32 , B65D75/42 , C08K3/04
CPC分类号： H05K5/03 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/205 , B32B27/302 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2255/10 , B32B2255/26 , B32B2264/102 , B32B2264/104 , B32B2307/202 , B32B2307/31 , B32B2307/518 , B32B2307/748 , B32B2457/00 , B65D75/325 , B65D75/42 , B65D2585/86 , C08K3/04 , C08K3/041 , C09J7/29 , C09J2201/602 , C09J2201/61 , C09J2205/102 , C09J2205/106 , C09J2205/114 , C09J2425/00 , C09J2433/00 , Y10T428/1405 , Y10T428/1462 , C08L53/025
摘要： Disclosed is a cover film, which includes at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that can be heat-sealed to a carrier tape, and wherein the heat seal layer contains, as a main component, a styrene-acrylic copolymer that has a mass average molecular weight of 5000 to 20000. This cover film is suppressed in variation in release strength when separated from the carrier tape, and is capable of reducing problems in the mounting process of electronic components such as rupture of the cover film during the separation.
摘要翻译： 公开了一种覆盖膜，其至少包括基材层，中间层，脱模层和可以热封到载带上的热封层，并且其中，热封层包含作为主要成分的热封层， 具有5000〜20000的质量平均分子量的苯乙烯 - 丙烯酸共聚物。当与载带分离时，这种覆盖膜的剥离强度的变化被抑制，并且能够减少诸如断裂的电子部件的安装过程中的问题 在分离期间的覆盖膜。
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公开(公告)号：US09327880B2
公开(公告)日：2016-05-03
申请号：US14123864
申请日：2012-05-29
IPC分类号： B32B27/34 , B32B27/08 , B32B7/06 , B32B27/20 , B32B27/30 , B32B27/32 , B65D43/02 , H05K13/00
CPC分类号： B65D43/02 , B32B7/06 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/327 , B32B27/34 , B32B2250/24 , B32B2264/102 , B32B2307/202 , B32B2307/31 , B32B2307/518 , B32B2307/5825 , B32B2307/748 , B32B2435/00 , B32B2435/02 , B32B2439/40 , B32B2553/00 , H05K13/0084 , Y10T428/1405 , Y10T428/1452 , Y10T428/2826
摘要： Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer, an intermediate layer, and a heat sealing layer having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109 ° C. according to JIS K7196, and the cover film in some instances having a release layer between the intermediate layer and the heat sealing layer.
摘要翻译： 公开了一种覆盖膜和电子部件封装，其使用覆盖膜作为热塑性树脂载带的盖材料，所述覆盖膜至少具有基材层，中间层和具有热塑性树脂的热封层， 可以热封到载带上，中间层包括茂金属直链低密度聚乙烯，根据JIS K7196的TMA软化温度为90〜109℃的茂金属直链低密度聚乙烯，以及 在一些情况下，在中间层和热密封层之间具有剥离层的覆盖膜。
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公开(公告)号：US20140116921A1
公开(公告)日：2014-05-01
申请号：US14123864
申请日：2012-05-29
CPC分类号： B65D43/02 , B32B7/06 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/327 , B32B27/34 , B32B2250/24 , B32B2264/102 , B32B2307/202 , B32B2307/31 , B32B2307/518 , B32B2307/5825 , B32B2307/748 , B32B2435/00 , B32B2435/02 , B32B2439/40 , B32B2553/00 , H05K13/0084 , Y10T428/1405 , Y10T428/1452 , Y10T428/2826
摘要： Disclosed is a cover film and an electronic component package that uses the cover film as a lid material for a thermoplastic resin carrier tape, the cover film having at least a substrate layer, an intermediate layer, and a heat sealing layer having a thermoplastic resin which can be heat-sealed to a carrier tape, the intermediate layer including a metallocene straight-chain low density polyethylene, the metallocene straight-chain low density polyethylene having a TMA softening temperature of 90 to 109° C. according to JIS K7196, and the cover film in some instances having a release layer between the intermediate layer and the heat sealing layer.
摘要翻译： 公开了一种覆盖膜和电子部件封装，其使用覆盖膜作为热塑性树脂载带的盖材料，所述覆盖膜至少具有基材层，中间层和具有热塑性树脂的热封层， 可以热封到载带上，中间层包括茂金属直链低密度聚乙烯，根据JIS K7196的TMA软化温度为90〜109℃的茂金属直链低密度聚乙烯，以及 在一些情况下，在中间层和热密封层之间具有剥离层的覆盖膜。
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公开(公告)号：US08652601B2
公开(公告)日：2014-02-18
申请号：US13256138
申请日：2010-03-05
申请人： Takayuki Iwasaki , Tetsuo Fujimura , Akira Sasaki
发明人： Takayuki Iwasaki , Tetsuo Fujimura , Akira Sasaki
CPC分类号： B32B27/32 , B32B25/14 , B32B27/08 , B32B27/20 , B32B27/322 , B32B27/36 , B32B2250/24 , B32B2307/21 , B32B2307/31 , B32B2307/412 , B32B2307/518 , B32B2307/546 , B32B2307/5825 , B32B2307/72 , B32B2307/732 , B32B2457/00 , H01L23/293 , H01L2924/0002 , Y10T428/1352 , Y10T428/24355 , Y10T428/24612 , Y10T428/24942 , Y10T428/2826 , Y10T428/31 , Y10T428/31797 , Y10T428/31855 , Y10T428/31924 , Y10T428/31931 , H01L2924/00
摘要： A cover film comprising a substrate layer, an intermediate layer comprising a resin composition containing 50% by mass or more of a metallocene linear low-density polyethylene resin having a density of 0.900 to 0.940×103 kg/m3, and a sealant layer comprising an ethylene-type copolymerized resin containing 50 to 85% by mass of an olefin component.
摘要翻译： 一种覆盖膜，包括基材层，包含含有50质量％以上的密度为0.900〜0.940×10 3 kg / m 3的茂金属线性低密度聚乙烯树脂的树脂组合物的中间层，以及包含 含有50〜85质量％的烯烃成分的乙烯类共聚树脂。
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公开(公告)号：US20130199961A1
公开(公告)日：2013-08-08
申请号：US13878507
申请日：2011-04-18
IPC分类号： B65D43/02
CPC分类号： B65D43/02 , B32B7/02 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/20 , B32B27/302 , B32B27/308 , B32B27/32 , B32B27/327 , B32B27/34 , B32B27/36 , B32B2250/24 , B32B2255/10 , B32B2255/26 , B32B2255/28 , B32B2307/202 , B32B2307/21 , B32B2307/31 , B32B2307/518 , B32B2307/54 , B32B2307/748 , B32B2457/00 , B32B2457/08 , B32B2553/00 , Y10T428/2826
摘要： Disclosed is a cover film which is used in combination with a carrier tape and comprises at least a base layer, an intermediate layer, a releasing layer and a heat seal layer that is capable of being heat sealed to the carrier tape. The intermediate layer contains, as a main component, a linear low density polyethylene that is polymerized using a metallocene catalyst and has a tensile modulus of 200 MPa or less. The releasing layer contains a conductive material and also contains, as a main component, a hydrogenated resin of an aromatic vinyl-conjugated diene copolymer having an aromatic vinyl group content of 15-35% by mass. This cover film is small in variation in peel strength when the cover film is released, and is thus capable of suppressing troubles during the releasing in a mounting process.
摘要翻译： 公开了一种与载带组合使用并且至少包括基层，中间层，释放层和能够被热密封到载带上的热封层的覆盖膜。 作为主要成分，中间层含有使用金属茂催化剂进行聚合并且拉伸弹性模量为200MPa以下的线性低密度聚乙烯。 脱模层含有导电性材料，作为主要成分，含有芳香族乙烯基含量为15〜35质量％的芳族乙烯基 - 共轭二烯共聚物的氢化树脂。 当覆盖膜被释放时，该覆盖膜的剥离强度的变化小，因此能够抑制在安装过程中的释放期间的麻烦。
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公开(公告)号：US20130089746A1
公开(公告)日：2013-04-11
申请号：US13703920
申请日：2011-04-18
CPC分类号： B32B27/28 , B32B27/08 , B32B27/30 , B32B27/308 , B32B27/32 , B32B27/36 , Y10T428/31504 , Y10T428/31786 , Y10T428/31855 , Y10T428/31935
摘要： Disclosed is a cover tape which comprises at least a base layer (A), an intermediate layer (B), a peeling layer (C), the primary component of which is a thermoplastic resin, and a heat seal layer (D), the primary component of which is a thermoplastic resin that can be heat sealed to a carrier tape. The tensile storage modulus (c) of the thermoplastic resin that constitutes the peeling layer (C) is within the range of 1×106 Pa to 1×108 Pa. The tensile storage modulus (d) of the thermoplastic resin that constitutes the heat seal layer (D) is within the range of 1×108 Pa to 1×1010 Pa. The ratio of (c) and (d) satisfies 1×104≧(d)/(c)≧1×10. This kind of cover tape has the appropriate peel strength and sufficiently low fluctuation in peel strength when heat sealed to a thermoplastic resin carrier tape. Therefore, the tape will not tear even under shock caused by high-speed peeling, and sticking of electronic parts does not occur even when set aside for a long period of time of 24 to 72 hours in a high-temperature environment of 60 to 80° C.
摘要翻译： 公开了一种覆盖带，其至少包括基底层（A），中间层（B），剥离层（C），其主要成分为热塑性树脂，以及热封层（D）， 其主要成分是能够热封到载带上的热塑性树脂。 构成剥离层（C）的热塑性树脂的拉伸储存模量（c）在1×106Pa〜1×108Pa的范围内，构成热封的热塑性树脂的拉伸储能模量（d） 层（D）在1×10 8 Pa〜1×10 10 Pa的范围内，（c）和（d）的比例满足1×104≥（d）/（c）≥1×10。 这种覆盖带具有合适的剥离强度，并且当热封到热塑性树脂载带上时剥离强度的波动足够低。 因此，即使在高速剥离引起的冲击下，胶带也不会撕裂，即使在60〜80℃的高温环境下长时间放置24〜72小时也不会发生电子部件的粘附 C。
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公开(公告)号：US07455896B2
公开(公告)日：2008-11-25
申请号：US10296937
申请日：2002-05-27
申请人： Tetsuo Fujimura , Takeshi Miyakawa , Mikio Shimizu , Satoshi Yokoyama , Masanori Higano , Masanori Ishii , Kazuhiro Kosugi , Takashi Tomizawa
发明人： Tetsuo Fujimura , Takeshi Miyakawa , Mikio Shimizu , Satoshi Yokoyama , Masanori Higano , Masanori Ishii , Kazuhiro Kosugi , Takashi Tomizawa
CPC分类号： H05K13/0084 , H01L2221/68313 , Y10T428/13 , Y10T428/1352 , Y10T428/1397 , Y10T428/239
摘要： A carrier tape body having an embossed tape continuously having pockets which contain an electronic component sealed with a cover tape, where the cover tape has a peeling static electrification amount of from −9 to +9 nC when the cover tape has a surface resistivity of at least 1011 Ω, and where the cover tape has a peeling static electrification amount of from −3 to +3 nC when the cover tape has a surface resistivity of less than 1011 Ω.
摘要翻译： 一种载带体，其具有连续具有包含用盖带密封的电子部件的凹坑的压花带，其中当胶带具有表面电阻率为at时，该胶带具有从-9至+9nC的剥离静电量 至少10±11Ω，当覆盖带的表面电阻率小于10-11时，覆盖带的剥离静电充电量为-3至+ 3nC >欧米茄。
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