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    Plastic-packaged semiconductor device having a heat sink matched with a plastic package
    1.
    发明授权
    Plastic-packaged semiconductor device having a heat sink matched with a plastic package 失效
    具有与塑料封装相匹配的散热器的塑料封装半导体器件

    公开(公告)号：US5493153A

    公开(公告)日：1996-02-20

    申请号：US157295

    申请日：1993-11-26

    申请人： Tadashi Arikawa ,  Mitsuru Tsuchiya ,  Akira Ichida ,  Tadashi Igarashi

    发明人： Tadashi Arikawa ,  Mitsuru Tsuchiya ,  Akira Ichida ,  Tadashi Igarashi

    IPC分类号： H01L23/373 ,  H01L23/433 ,  H01L23/34 ,  H01L23/28 ,  H05K7/20

    CPC分类号： H01L23/3733 ,  H01L23/4334 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/181

    摘要： In a plastic-packaged semiconductor device molded by a synthetic resin, a heat sink is formed by a sheet which has a thermal expansion coefficient between 9.0.times.10.sup.-6 /K and 23.times.10.sup.-6 /K and a thermal conductivity greater than 200 W/m.multidot.K, which are selected in relation to those of the synthetic resin. The sheet is manufactured by mixing a first metal of a high melting point with a second metal of a low melting point lower than the first metal and by pressing and sintering the mixture. The first and the second metal may be molybdenum and copper, respectively. Alternatively, the sheet may be a composite sheet composed of a molybdenum mesh interposed between a pair of aluminum layers or a stacked sheet composed of a sintered layer of a mixture of molybdenum and copper and a coated layer of either molybdenum or copper.

    摘要翻译： 在由合成树脂模制的塑料封装半导体器件中，散热器由热膨胀系数为9.0×10 -6 / K至23×10 -6 / K，热导率大于200W / m×K的片形成 ，其相对于合成树脂的那些选择。 通过将高熔点的第一金属与低于第一金属的低熔点的第二金属混合并通过压制和烧结混合物来制造片。 第一和第二金属可以分别是钼和铜。 或者，片材可以是由插入在一对铝层之间的钼网或由钼和铜的混合物的烧结层构成的堆叠片和钼或铜的涂层组成的复合片。

    Semiconductor package and method for producing heat-radiating substrate for it
    5.
    发明授权
    Semiconductor package and method for producing heat-radiating substrate for it 有权
    半导体封装及其制造用散热基板的方法

    公开(公告)号：US06926861B2

    公开(公告)日：2005-08-09

    申请号：US10671712

    申请日：2003-09-29

    申请人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    发明人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    IPC分类号： B21B3/00 ,  B22F3/02 ,  B22F3/04 ,  B22F3/26 ,  C04B37/02 ,  H01L21/48 ,  H01L23/02 ,  H01L23/06 ,  H01L23/08 ,  H01L23/373 ,  B22F3/14

    CPC分类号： B22F3/045 ,  B22F3/02 ,  B22F2998/10 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3733 ,  H01L2924/0002 ,  B22F3/26 ,  H01L2924/00

    摘要： A package to be mounted with semiconductor chips has a heat-radiating substrate having a thickness of smaller than 0.4 mm of a Cu—Mo composite as prepared by impregnating from 30 to 40% by mass of copper (Cu) melt into a green compact of molybdenum. The heat-radiating substrate is produced by preparing an Mo green compact through isostatic molding, mounting Cu on the Mo green compact, heating it to thereby impregnate copper into the Mo green compact to give a Cu—Mo composite, and rolling the Cu—Mo composite into a sheet substrate. In the isostatic molding process, at least two or more plates 27, 29, 31, 33, 35 and 37 are disposed adjacent to the inner surface of a side wall as divided into at least two portions, Mo powder is filled into the space as formed by those plates 27, 29, 31, 33, 35 and 37 with covering the Mo powder compact with a flexible cover, such as a rubber medium 39 or the like, to prepare a composite, then the resulting composite is put into a pressure tank, an external isostatic pressure is applied thereto against the flexible cover, and the plates are slid via the cover along the side wall thereby compressing the composite between the thus-slid plates into an Mo green compact.

    摘要翻译： 用半导体芯片安装的封装具有厚度小于0.4mm的Cu-Mo复合材料的散热基板，其通过将铜（Cu）熔体的30〜40质量％浸渍成为 钼。 散热基板是通过等静压成型制成Mo压坯，在Mo生坯上安装Cu加热，将铜浸渍到Mo生坯中得到Cu-Mo复合体，将Cu-Mo 复合成片状基材。 在等静压成型工艺中，至少两个或更多个板27,29,31,33,35和37与侧壁的内表面相邻设置，分为至少两部分，Mo粉末被填充到空间中 由这些板27,29,31,33,35和37形成，并用柔性覆盖物（例如橡胶介质39等）覆盖Mo粉末压块以制备复合材料，然后将所得复合材料压入 在其上施加有外部等静压力抵靠柔性盖，并且板沿着侧壁通过盖板滑动，从而将由此滑动的板之间的复合材料压缩成Mo压坯。

    Semiconductor package and method for producing heat-radiating substrate for it
    6.
    发明授权
    Semiconductor package and method for producing heat-radiating substrate for it 有权
    半导体封装及其制造用散热基板的方法

    公开(公告)号：US06693353B1

    公开(公告)日：2004-02-17

    申请号：US09252880

    申请日：1999-02-18

    申请人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    发明人： Norio Hirayama ,  Mitsuo Osada ,  Akira Ichida ,  Yoshinari Amano ,  Kiyoshi Asai ,  Hidetoshi Maesato ,  Tadashi Arikawa ,  Kenji Sakimae

    IPC分类号： H01L2348

    CPC分类号： B22F3/045 ,  B22F3/02 ,  B22F2998/10 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3733 ,  H01L2924/0002 ,  B22F3/26 ,  H01L2924/00

    摘要： A package to be mounted with semiconductor chips has a heat-radiating substrate having a thickness of smaller than 0.4 mm of a Cu—Mo composite as prepared by impregnating from 30 to 40% by mass of copper (Cu) melt into a green compact of molybdenum. The heat-radiating substrate is produced by preparing an Mo green compact through isostatic molding, mounting Cu on the Mo green compact, heating it to thereby impregnate copper into the Mo green compact to give a Cu—Mo composite, and rolling the Cu—Mo composite into a sheet substrate. In the isostatic molding process, at least two or more plates. 27, 29, 31, 33, 35 and 37 are disposed adjacent to the inner surface of a side wall as divided into at least two portions, Mo powder is filled into the space as formed by those plates 27, 29, 31, 33, 35 and 37 with covering the Mo powder compact with a flexible cover, such as a rubber medium 39 or the like, to prepare a composite, then the resulting composite is put into a pressure tank, an external isostatic pressure is applied thereto against the flexible cover, and the plates are slid via the cover along the side wall thereby compressing the composite between the thus-slid plates into an Mo green compact.

    摘要翻译： 用半导体芯片安装的封装具有厚度小于0.4mm的Cu-Mo复合材料的散热基板，其通过将铜（Cu）熔体的30〜40质量％浸渍成为 钼。 散热基板是通过等静压成型制成Mo压坯，在Mo生坯上安装Cu加热，将铜浸渍到Mo生坯中得到Cu-Mo复合体，将Cu-Mo 复合成片状基材。 在等静压成型工艺中，至少有两个以上的板。 27,29,31,33,35,37与侧壁的内表面相邻设置，分为至少两部分，Mo粉末被填充到由这些板27,29,31,33,33形成的空间中， 35和37，用橡胶介质39等柔性盖覆盖Mo粉末压块以制备复合材料，然后将所得的复合材料放入压力罐中，对其施加外部等静压 盖板，并且板沿着侧壁通过盖板滑动，从而将由此滑动的板材之间的复合材料压缩成Mo压坯。