公开(公告)号：US08778469B2

公开(公告)日：2014-07-15

申请号：US13614475

申请日：2012-09-13

申请人： Sohei Kawanami ,  Yoshinori Ami ,  Yoko Mitsui

发明人： Sohei Kawanami ,  Yoshinori Ami ,  Yoko Mitsui

IPC分类号： B32B7/04 ,  B32B17/00 ,  C03B23/20 ,  C03B23/203 ,  H05B33/04 ,  H05B33/10 ,  G02F1/13

CPC分类号： H01L51/5246 ,  C03C3/14 ,  C03C8/04 ,  C03C8/18 ,  C03C8/24 ,  C03C23/0025 ,  G02F1/1339 ,  G02F2202/28 ,  H01G9/2077 ,  H01J9/26 ,  H01J2211/446 ,  H01J2211/48 ,  H01L51/448 ,  H01L51/524 ,  Y02E10/542 ,  Y02E10/549 ,  Y10T428/239

摘要： When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.

摘要翻译： 当通过使用激光密封等进行局部加热时，玻璃基板和密封层之间的接合强度得到改善，从而提供了具有增加的可靠性的电子设备。 电子设备包括第一玻璃基板，第二玻璃基板和密封层，用于密封设置在这些玻璃基板之间的电子元件部分。 密封层是通过诸如激光或红外光的电磁波局部加热密封材料而熔融粘合密封材料，密封材料的密封玻璃，低膨胀填料和电磁波所获得的层 吸收器。 在第一和第二玻璃基板中，每个反应层被制造成具有与密封层的界面至少30nm的最大深度。

公开(公告)号：US08697242B2

公开(公告)日：2014-04-15

申请号：US13341188

申请日：2011-12-30

申请人： Sohei Kawanami ,  Atsuo Hiroi

发明人： Sohei Kawanami ,  Atsuo Hiroi

IPC分类号： B32B15/04 ,  B32B17/06 ,  H05B6/02 ,  B05D3/06

CPC分类号： C03C23/0025 ,  C03C8/04 ,  C03C8/08 ,  C03C8/24 ,  C03C27/06 ,  H01J9/261 ,  H01J2211/34 ,  H01J2211/48 ,  H01L51/5246 ,  Y10T428/265

摘要： The invention provides a glass member provided with a sealing material layer, which suppresses generation of failures such as cracks or breakage of glass substrates or a sealing layer even when the distance between two glass substrates is narrowed, and thereby makes it possible to improve the sealing property between the glass substrates and its reliability. A glass substrate has a surface provided with a sealing region, on which a sealing material layer having a thickness of at most 15 μm is formed. The sealing material layer includes a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, wherein the total content of the laser absorbent and the low-expansion filler being the optional component in the glass material for sealing is within the range of from 2 to 44 vol %.

摘要翻译： 本发明提供了一种设置有密封材料层的玻璃构件，即使当两个玻璃基板之间的距离变窄时，也能抑制诸如玻璃基板或密封层的裂纹或破裂等故障的产生，从而可以提高密封性 玻璃基板之间的性质及其可靠性。 玻璃基板具有设置有密封区域的表面，其上形成有至多15μm的厚度的密封材料层。 密封材料层包括用于密封的玻璃材料的烧制材料，其包含密封玻璃，激光吸收剂和任选的低膨胀填料，其中激光吸收剂和低膨胀填料的总含量是 用于密封的玻璃材料在2至44体积％的范围内。

公开(公告)号：US20130011598A1

公开(公告)日：2013-01-10

申请号：US13614475

申请日：2012-09-13

申请人： Sohei Kawanami ,  Yoshinori Ami ,  Yoko Mitsui

发明人： Sohei Kawanami ,  Yoshinori Ami ,  Yoko Mitsui

IPC分类号： C03B23/20 ,  H05B33/10 ,  H05B33/04 ,  B32B7/04 ,  G02F1/1339

CPC分类号： H01L51/5246 ,  C03C3/14 ,  C03C8/04 ,  C03C8/18 ,  C03C8/24 ,  C03C23/0025 ,  G02F1/1339 ,  G02F2202/28 ,  H01G9/2077 ,  H01J9/26 ,  H01J2211/446 ,  H01J2211/48 ,  H01L51/448 ,  H01L51/524 ,  Y02E10/542 ,  Y02E10/549 ,  Y10T428/239

摘要： When local heating by use of laser sealing or the like is applied, the bonding strength between glass substrates and a sealing layer is improved to provide an electronic device having increased reliability. An electronic device includes a first glass substrate, a second glass substrate, and a sealing layer to seal an electronic element portion disposed between these glass substrates. The sealing layer is a layer obtained by locally heating a sealing material by an electromagnetic wave, such as laser light or infrared light, to melt-bond the sealing material, the sealing material containing sealing glass, a low-expansion filler and an electromagnetic wave absorber. In the first and second glass substrates, each reacted layer is produced to have a maximum depth of at least 30 nm from an interface with the sealing layer.

摘要翻译： 当通过使用激光密封等进行局部加热时，玻璃基板和密封层之间的接合强度得到改善，从而提供了具有增加的可靠性的电子设备。 电子设备包括第一玻璃基板，第二玻璃基板和密封层，用于密封设置在这些玻璃基板之间的电子元件部分。 密封层是通过诸如激光或红外光的电磁波局部加热密封材料而熔融粘合密封材料，密封材料的密封玻璃，低膨胀填料和电磁波所获得的层 吸收器。 在第一和第二玻璃基板中，每个反应层被制造成具有与密封层的界面至少30nm的最大深度。

公开(公告)号：US08287995B2

公开(公告)日：2012-10-16

申请号：US13113180

申请日：2011-05-23

申请人： Koichi Shibuya ,  Asahi Ide ,  Sohei Kawanami

发明人： Koichi Shibuya ,  Asahi Ide ,  Sohei Kawanami

IPC分类号： B32B5/16 ,  H05B33/04 ,  H05B6/00 ,  H01J9/26 ,  B29C65/16 ,  H01L31/042 ,  H01L27/142

CPC分类号： H01L51/5246 ,  C03C8/04 ,  C03C8/08 ,  C03C8/18 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  G02F1/1339 ,  H01G9/2077 ,  H01L51/448 ,  H01L51/56 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/2982

摘要： The invention seeks to increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing. A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5T to 1T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.

摘要翻译： 本发明旨在通过抑制激光密封时的玻璃基板的裂纹，裂缝等来提高电子器件的密封性和可靠性。 玻璃基板3具有密封区域。 在密封区域，设置包含含有低膨胀填料的密封用玻璃材料和激光吸收剂的密封材料层5。 用于密封的玻璃材料不包含颗粒尺寸超过密封材料层5的厚度T的低膨胀填料颗粒，并且包含基于厚度T的粒径在0.5T至1T范围内的低膨胀填料颗粒 密封材料层5的体积比为0.1〜50％。 将这种玻璃基板3和具有设置有电子元件的元件形成区域的玻璃基板2层叠，并且用激光6照射密封材料层5并熔融以粘合玻璃基板2和3。

公开(公告)号：US20120202030A1

公开(公告)日：2012-08-09

申请号：US13451508

申请日：2012-04-19

申请人： Satoshi KONDO ,  Motoshi ONO ,  Sohei KAWANAMI

发明人： Satoshi KONDO ,  Motoshi ONO ,  Sohei KAWANAMI

IPC分类号： B32B17/06 ,  B32B37/00 ,  B32B7/02 ,  B32B27/40 ,  B32B17/10

CPC分类号： B32B7/06 ,  B32B17/06 ,  B32B17/10 ,  B32B17/10293 ,  C03C3/062 ,  C03C3/122 ,  C03C3/19 ,  C03C8/08 ,  C03C8/24 ,  C03C27/10 ,  G02F1/1333 ,  G02F2001/133302 ,  H05B33/10 ,  Y10T156/10 ,  Y10T428/24967 ,  Y10T428/31601 ,  Y10T428/31612 ,  Y10T428/31645

摘要： The present invention relates to a glass laminate including: a thin glass substrate having a first main surface and a second main surface; a supporting glass substrate having a first main surface and a second main surface, provided such that the first main surface thereof faces the first main surface of the thin glass substrate; a resin layer formed between the thin glass substrate and the supporting glass substrate, fixed to the first main surface of the supporting glass substrate and closely adhered to the first main surface of the thin glass substrate with peelability to the first main surface thereof; and an outer frame layer containing a glass sealing material and being formed by firing at an outer side of a peripheral part of the resin layer.

摘要翻译： 玻璃层压板技术领域本发明涉及一种玻璃层压体，其特征在于，包括：具有第一主表面和第二主表面的薄玻璃基板; 支撑玻璃基板，其具有第一主表面和第二主表面，其设置成使得其第一主表面面对薄玻璃基板的第一主表面; 在所述薄玻璃基板和所述支撑玻璃基板之间形成的树脂层，固定在所述支撑玻璃基板的所述第一主面上，并且与所述薄玻璃基板的所述第一主面紧贴，并具有对所述第一主面的剥离性; 以及包含玻璃密封材料并通过在树脂层的周边部分的外侧烧成而形成的外框层。

公开(公告)号：US20110209813A1

公开(公告)日：2011-09-01

申请号：US13104174

申请日：2011-05-10

申请人： Koichi SHIBUYA ,  Asahi Ide ,  Sohei Kawanami

发明人： Koichi SHIBUYA ,  Asahi Ide ,  Sohei Kawanami

IPC分类号： C03B29/00

CPC分类号： H01L51/5246 ,  C03C8/14 ,  C03C8/24 ,  C03C27/06 ,  H01G9/2077 ,  H01L51/448 ,  H01L51/56 ,  H05B33/04 ,  Y02E10/549 ,  Y02P70/521

摘要： Laser sealing property and reliability of a glass panel are increased by suppressing cracks, fractures, separation and the like of glass substrates and a sealing material layer at the time of laser sealing.A first paste for a sealing material containing no laser absorbent and a second paste for a sealing material containing a laser absorbent are applied in this order on a sealing region 2a of a glass substrate 2. A laminate film of a coating layer 11 of the first paste for a sealing material and a coating layer 12 of the second paste for a sealing material is fired, to form a sealing material layer 3 having a laminated structure of a layer 4 of the first glass material for sealing and a layer 5 of the second glass material for sealing. The second glass substrate 2 having such a sealing material layer 3 is laminated with a glass substrate having an element-formed region, and the sealing material layer 3 is irradiated with a laser light from the side of the layer 4 of the first glass material for sealing through the second glass substrate 2 for bonding.

摘要翻译： 通过在激光密封时抑制玻璃基板和密封材料层的裂纹，断裂，分离等，可以提高玻璃面板的激光密封性和可靠性。 将用于不含激光吸收剂的密封材料的第一糊料和用于含有激光吸收剂的密封材料的第二糊料依次施加到玻璃基板2的密封区域2a上。第一涂层层11的层合膜 用于密封材料的糊料和用于密封材料的第二糊料的涂层12被烧制，以形成具有第一密封用玻璃材料层4的层叠结构的密封材料层3和第二密封材料层5 用于密封的玻璃材料。 具有这种密封材料层3的第二玻璃基板2与具有元件形成区域的玻璃基板层叠，并且从第一玻璃材料层4的侧面照射密封材料层3 密封通过第二玻璃基板2进行接合。

公开(公告)号：US20110223371A1

公开(公告)日：2011-09-15

申请号：US13115229

申请日：2011-05-25

申请人： Sohei KAWANAMI

发明人： Sohei KAWANAMI

IPC分类号： C03B23/20 ,  B32B17/00 ,  C03C27/10 ,  C03C3/14

CPC分类号： C03C8/24 ,  G02F1/1341 ,  H01G9/2077 ,  H01L51/5246 ,  H05B33/04 ,  Y02E10/542 ,  Y02P70/521 ,  Y10T428/239 ,  Y10T428/26

摘要： The bonding strength to a glass substrate comprising soda lime glass is increased with good reproducibility at a time of laser sealing, to improve the sealing ability and the reliability of an electronic device.A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 is provided, which is a fired layer of a glass material for sealing containing a sealing glass, a low-expansion filler and a laser absorbent. The sealing glass contains, as represented by mass percentage, from 70 to 90% of Bi2O3, from 1 to 20% of ZnO, from 2 to 12% of B2O3 and from 10 to 380 ppm of Na2O. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element, are laminated, the sealing material layer 5 is irradiated with a laser light 6 to be melted to bond the glass substrates 2 and 3.

摘要翻译： 包括钠钙玻璃的玻璃基板的结合强度在激光密封时以良好的再现性增加，以提高电子器件的密封能力和可靠性。 玻璃基板3具有密封区域。 在密封区域上设置密封材料层5，该密封材料层是包含密封玻璃，低膨胀填料和激光吸收剂的用于密封的玻璃材料的烧制层。 密封玻璃以质量百分比表示，含有70〜90％的Bi2O3，1〜20％的ZnO，2〜12％的B2O3和10〜380ppm的Na2O。 这样的玻璃基板3和具有设置有电子元件的元件形成区域的玻璃基板2层叠，用激光6照射密封材料层5以熔融以粘合玻璃基板2和3。

公开(公告)号：US20110223360A1

公开(公告)日：2011-09-15

申请号：US13113180

申请日：2011-05-23

申请人： Koichi Shibuya ,  Asahi Ide ,  Sohei Kawanami

发明人： Koichi Shibuya ,  Asahi Ide ,  Sohei Kawanami

IPC分类号： B32B3/02 ,  B32B17/00 ,  C03C27/06

CPC分类号： H01L51/5246 ,  C03C8/04 ,  C03C8/08 ,  C03C8/18 ,  C03C8/24 ,  C03C23/0025 ,  C03C27/06 ,  G02F1/1339 ,  H01G9/2077 ,  H01L51/448 ,  H01L51/56 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/2495 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/2982

摘要： To increase the sealing property and the reliability of an electronic device by suppressing cracks, fractures and the like of a glass substrate at the time of laser sealing.A glass substrate 3 has a sealing region. On the sealing region, a sealing material layer 5 comprising a glass material for sealing containing a low-expansion filler and a laser absorbent is provided. The glass material for sealing contains no low-expansion filler particles having particle sizes exceeding the thickness T of the sealing material layer 5 and contains low-expansion filler particles having particle sizes within a range of from 0.5 T to 1 T based on the thickness T of the sealing material layer 5 in a volume ratio of from 0.1 to 50%. Such a glass substrate 3 and a glass substrate 2 having an element-formed region provided with an electronic element are laminated, and the sealing material layer 5 is irradiated with a laser light 6 and melted to bond the glass substrates 2 and 3.

摘要翻译： 为了通过抑制激光密封时的玻璃基板的裂纹，裂纹等来提高电子器件的密封性和可靠性。 玻璃基板3具有密封区域。 在密封区域，设置包含含有低膨胀填料的密封用玻璃材料和激光吸收剂的密封材料层5。 用于密封的玻璃材料不包含粒度超过密封材料层5的厚度T的低膨胀填料颗粒，并且包含基于厚度T的粒径在0.5T至1T范围内的低膨胀填料颗粒 的密封材料层5的体积比为0.1〜50％。 将这种玻璃基板3和具有设置有电子元件的元件形成区域的玻璃基板2层叠，并且用激光6照射密封材料层5并熔融以粘合玻璃基板2和3。

公开(公告)号：US20120147538A1

公开(公告)日：2012-06-14

申请号：US13341188

申请日：2011-12-30

申请人： Sohei Kawanami ,  Atsuo Hiroi

发明人： Sohei Kawanami ,  Atsuo Hiroi

IPC分类号： H05K7/00 ,  C03C17/02 ,  C03C27/12 ,  B32B17/06

CPC分类号： C03C23/0025 ,  C03C8/04 ,  C03C8/08 ,  C03C8/24 ,  C03C27/06 ,  H01J9/261 ,  H01J2211/34 ,  H01J2211/48 ,  H01L51/5246 ,  Y10T428/265

摘要： The invention provides a glass member provided with a sealing material layer, which suppresses generation of failures such as cracks or breakage of glass substrates or a sealing layer even when the distance between two glass substrates is narrowed, and thereby makes it possible to improve the sealing property between the glass substrates and its reliability. A glass substrate has a surface provided with a sealing region, on which a sealing material layer having a thickness of at most 15 μm is formed. The sealing material layer includes a fired material of a glass material for sealing containing a sealing glass, a laser absorbent and optionally a low-expansion filler, wherein the total content of the laser absorbent and the low-expansion filler being the optional component in the glass material for sealing is within the range of from 2 to 44 vol %.

摘要翻译： 本发明提供了一种设置有密封材料层的玻璃构件，即使当两个玻璃基板之间的距离变窄时，也能抑制诸如玻璃基板或密封层的裂纹或破裂等故障的产生，从而可以提高密封性 玻璃基板之间的性质及其可靠性。 玻璃基板具有设置有密封区域的表面，其上形成有至多15μm的厚度的密封材料层。 密封材料层包括用于密封的玻璃材料的烧制材料，其包含密封玻璃，激光吸收剂和任选的低膨胀填料，其中激光吸收剂和低膨胀填料的总含量是 用于密封的玻璃材料在2至44体积％的范围内。