Sliding material and a method for its manufacture
    1.
    发明申请
    Sliding material and a method for its manufacture 有权
    滑动材料及其制造方法

    公开(公告)号:US20080020215A1

    公开(公告)日:2008-01-24

    申请号:US11822878

    申请日:2007-07-10

    IPC分类号: B32B15/04 B22F3/24

    摘要: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.

    摘要翻译: 滑动材料具有形成在背板顶上的烧结层。 烧结层含有5-15质量%的不均匀分布在Cu-Sn合金基体中的Bi,其基本上由8-12质量%的Sn和余量的Cu组成。 滑动材料可以通过不均匀地混合Cu-Sn合金粉末和Bi粉末来制造,将混合粉末分散在背板上,并烧结混合粉末以在背板上形成烧结层。 滑动材料即使在诸如液压设备或建筑设备的苛刻条件下使用也不会发生卡住,也不会将烧结层与背板分离。

    Solder paste
    2.
    发明授权
    Solder paste 有权
    焊膏

    公开(公告)号:US06391123B1

    公开(公告)日:2002-05-21

    申请号:US09970036

    申请日:2001-10-04

    IPC分类号: B23K3526

    摘要: A solder paste comprises a lead-free solder alloy powder and a flux and is suitable for use in reflow soldering of electronic parts at a soldering temperature of 230° C. or below with minimized damage to the electronic parts to form soldered joints of good bond strength. The solder alloy powder is a mixture of from 10 to 30 vol % of a first powder of an Sn—Bi alloy consisting essentially of 10-45 wt % of Bi and a balance of Sn and from 70 to 90 vol % of a second powder of an Sn—Zn alloy consisting essentially of 9-15 wt % of Zn and a balance of Sn. The mixture gives an alloy having a composition upon melting which consists essentially of 7-11 wt % of Zn, 1-5 wt % of Bi, and a balance of Sn.

    摘要翻译: 焊膏包括无铅焊料合金粉末和焊剂,适用于在230℃或更低的焊接温度下回流焊接电子部件,同时对电子部件的损伤最小化,形成良好焊接的焊接接头 强度。 焊料合金粉末为10〜30体积%的Sn-Bi合金的第一粉末的混合物,其主要由Bi的10-45重量%和余量的Sn和70〜90体积%的第二粉末组成 的基本上由9-15重量%的Zn和余量的Sn组成的Sn-Zn合金。 混合物得到熔融组成的合金,其基本上由7-11重量%的Zn,1-5重量%的Bi和余量的Sn组成。

    Sliding material and a method for its manufacture
    3.
    发明授权
    Sliding material and a method for its manufacture 有权
    滑动材料及其制造方法

    公开(公告)号:US07906222B2

    公开(公告)日:2011-03-15

    申请号:US11822878

    申请日:2007-07-10

    摘要: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.

    摘要翻译: 滑动材料具有形成在背板顶上的烧结层。 烧结层含有5-15质量%的不均匀分布在Cu-Sn合金基体中的Bi,其基本上由8-12质量%的Sn和余量的Cu组成。 滑动材料可以通过不均匀地混合Cu-Sn合金粉末和Bi粉末来制造,将混合粉末分散在背板上,并烧结混合粉末以在背板上形成烧结层。 滑动材料即使在诸如液压设备或建筑设备的苛刻条件下使用也不会发生卡住,也不会将烧结层与背板分离。