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公开(公告)号：US20080020215A1
公开(公告)日：2008-01-24
申请号：US11822878
申请日：2007-07-10
Applicant: Sinzo Nakamura , Naoki Sato , Toshio Hakuto
Inventor： Sinzo Nakamura , Naoki Sato , Toshio Hakuto
CPC classification number: B22F7/08 , B22F3/16 , B22F2998/00 , B22F2999/00 , Y10T428/12903 , Y10T428/12917 , Y10T428/12951 , Y10T428/31678 , B22F2207/01 , B22F3/10 , B22F2201/01 , B22F3/02
Abstract: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.
Abstract translation: 滑动材料具有形成在背板顶上的烧结层。 烧结层含有5-15质量％的不均匀分布在Cu-Sn合金基体中的Bi，其基本上由8-12质量％的Sn和余量的Cu组成。 滑动材料可以通过不均匀地混合Cu-Sn合金粉末和Bi粉末来制造，将混合粉末分散在背板上，并烧结混合粉末以在背板上形成烧结层。 滑动材料即使在诸如液压设备或建筑设备的苛刻条件下使用也不会发生卡住，也不会将烧结层与背板分离。
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公开(公告)号：US07906222B2
公开(公告)日：2011-03-15
申请号：US11822878
申请日：2007-07-10
Applicant: Sinzo Nakamura , Naoki Sato , Toshio Hakuto
Inventor： Sinzo Nakamura , Naoki Sato , Toshio Hakuto
CPC classification number: B22F7/08 , B22F3/16 , B22F2998/00 , B22F2999/00 , Y10T428/12903 , Y10T428/12917 , Y10T428/12951 , Y10T428/31678 , B22F2207/01 , B22F3/10 , B22F2201/01 , B22F3/02
Abstract: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.
Abstract translation: 滑动材料具有形成在背板顶上的烧结层。 烧结层含有5-15质量％的不均匀分布在Cu-Sn合金基体中的Bi，其基本上由8-12质量％的Sn和余量的Cu组成。 滑动材料可以通过不均匀地混合Cu-Sn合金粉末和Bi粉末来制造，将混合粉末分散在背板上，并烧结混合粉末以在背板上形成烧结层。 滑动材料即使在诸如液压设备或建筑设备的苛刻条件下使用也不会发生卡住，也不会将烧结层与背板分离。
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公开(公告)号：US07854996B2
公开(公告)日：2010-12-21
申请号：US11632957
申请日：2004-11-12
Applicant: Issaku Sato , Sinzo Nakamura , Naoki Sato , Toshio Hakuto
Inventor： Issaku Sato , Sinzo Nakamura , Naoki Sato , Toshio Hakuto
CPC classification number: B22F7/08 , B22F2998/10 , C22C9/00 , C22C9/02 , C22C12/00 , C22C13/02 , C22C28/00 , C22C30/00 , C22C30/04 , F16C33/121 , F16C33/14 , F16C2204/10 , F16C2204/12 , F16C2220/20 , F16C2220/24 , F16C2220/60 , F16C2223/80 , Y10T428/12028 , Y10T428/12042 , Y10T428/12063 , B22F7/004 , B22F3/26
Abstract: A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.
Abstract translation: 常规的含Bi滑动材料有时在以高旋转速度操作的滑动部分中被抓住。 本发明提供一种在高速旋转的滑动部件中不会卡住的滑动材料及其制造方法。 含有至少20质量％的Bi并且液相线温度至多为200℃的低熔点合金被制成渗透到包含Cu-Sn基合金的多孔部分中。 作为低熔点合金，适合Bi-Sn系合金或Bi-In系合金。 在将低熔点合金糊料施加到多孔部分之后，低熔点合金熔化并渗透到多孔部分中。
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公开(公告)号：US20080193324A1
公开(公告)日：2008-08-14
申请号：US11632957
申请日：2004-11-12
Applicant: Issaku Sato , Sinzo Nakamura , Naoki Sato , Toshio Hakuto
Inventor： Issaku Sato , Sinzo Nakamura , Naoki Sato , Toshio Hakuto
CPC classification number: B22F7/08 , B22F2998/10 , C22C9/00 , C22C9/02 , C22C12/00 , C22C13/02 , C22C28/00 , C22C30/00 , C22C30/04 , F16C33/121 , F16C33/14 , F16C2204/10 , F16C2204/12 , F16C2220/20 , F16C2220/24 , F16C2220/60 , F16C2223/80 , Y10T428/12028 , Y10T428/12042 , Y10T428/12063 , B22F7/004 , B22F3/26
Abstract: A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture.A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.
Abstract translation: 常规的含Bi滑动材料有时在以高旋转速度操作的滑动部分中被抓住。 本发明提供一种在高速旋转的滑动部件中不会卡住的滑动材料及其制造方法。 含有至少20质量％的Bi并且液相线温度至多为200℃的低熔点合金被制成渗透到包含Cu-Sn基合金的多孔部分中。 作为低熔点合金，适合Bi-Sn系合金或Bi-In系合金。 在将低熔点合金糊料施加到多孔部分之后，低熔点合金熔化并渗透到多孔部分中。
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