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公开(公告)号：US08544713B2
公开(公告)日：2013-10-01
申请号：US12646777
申请日：2009-12-23
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K1/20
CPC分类号： B23K3/082 , B23K1/0016 , B23K1/203 , B23K3/087 , B23K2101/42 , H05K3/3447 , H05K3/3489 , H05K2203/0763 , H05K2203/1361
摘要： An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.
摘要翻译： 一种装置在安装在印刷电路板上的部件的突起上涂覆通量。 投影通过印刷电路板并从印刷电路板突出。 该装置包括保持印刷电路板的印刷电路板保持部件，具有突起从喷嘴离开喷嘴的开口的喷嘴，将喷嘴移动到预定的喷嘴移动部件， 位置，以及向焊嘴供给焊剂的焊剂供给部件。 通过将突起浸入通过开口的喷嘴中所含的焊剂中，将焊剂至少涂覆在突起上。
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公开(公告)号：US08302835B2
公开(公告)日：2012-11-06
申请号：US13142419
申请日：2009-12-28
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K1/08
CPC分类号： H05K3/3468 , B23K1/0016 , B23K1/085 , B23K3/0653 , H05K3/3447 , H05K2203/0763
摘要： To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder.By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a lead 31 of electronic component 30 being inserted into the insert hole 19a, it is possible to fill the through hole of the printed circuit board P with the molten solder 4, so that the reliability can be improved.
摘要翻译： 为了防止喷嘴中的堵塞而不使用任何惰性气体，并且通过用熔融焊料填充印刷电路板的通孔来允许提高可靠性。 通过将焊锡槽2中的熔融焊料4从内筒15的内部流入喷嘴盖19，喷嘴帽19的内部填充有熔融焊料4，并且填充喷嘴内部的熔融焊料4 帽19从内筒15和外筒16之间向下流动而基本上不从插入孔19a流到外部。 这使得熔融焊料4不会被氧化，因为熔融焊料4不暴露于外部空气。 因此，与现有的焊接装置同样，能够防止喷嘴3内的堵塞而不填充一部分惰性气体的喷嘴出口。 此外，由于电子部件30的引线31插入到插入孔19a中进行焊接，所以可以用熔融焊料4填充印刷电路板P的通孔，从而可以提高可靠性 。
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公开(公告)号：US20110284619A1
公开(公告)日：2011-11-24
申请号：US13142419
申请日：2009-12-28
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
IPC分类号： B23K3/06
CPC分类号： H05K3/3468 , B23K1/0016 , B23K1/085 , B23K3/0653 , H05K3/3447 , H05K2203/0763
摘要： To prevent clogging in a jet nozzle without using any inert gas and to allow reliability to be improved by filling a through hole of a printed circuit board with the molten solder.By flowing the molten solder 4 in the solder bath 2 from inside of the inner cylinder 15 to a nozzle cap 19, the inside of the nozzle cap 19 is filled with the molten solder 4, and the molten solder 4 filling the inside of the nozzle cap 19 is flown downward from between an inner cylinder 15 and an outer cylinder 16 without substantially flowing it to outside from an insert hole 19a. This enables the molten solder 4 to be prevented from oxidizing because the molten solder 4 is not exposed to the outside air. For this reason, it is possible to prevent clogging in the jet nozzle 3 without filling a part of nozzle outlet with any inert gas as in the conventional soldering apparatus. Further, since the soldering is performed with a lead 31 of electronic component 30 being inserted into the insert hole 19a, it is possible to fill the through hole of the printed circuit board P with the molten solder 4, so that the reliability can be improved.
摘要翻译： 为了防止喷嘴中的堵塞而不使用任何惰性气体，并且通过用熔融焊料填充印刷电路板的通孔来允许提高可靠性。 通过将焊锡槽2中的熔融焊料4从内筒15的内部流入喷嘴盖19，喷嘴帽19的内部填充有熔融焊料4，并且填充喷嘴内部的熔融焊料4 帽19从内筒15和外筒16之间向下流动而基本上不从插入孔19a流到外部。 这使得熔融焊料4不会被氧化，因为熔融焊料4不暴露于外部空气。 因此，与现有的焊接装置同样，能够防止喷嘴3内的堵塞而不填充一部分惰性气体的喷嘴出口。 此外，由于电子部件30的引线31插入到插入孔19a中进行焊接，所以可以用熔融焊料4填充印刷电路板P的通孔，从而可以提高可靠性 。
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4.发明申请公开(公告)号：US20100163600A1
公开(公告)日：2010-07-01
申请号：US12646819
申请日：2009-12-23
申请人： Issaku SATO , Akira TAKAGUCHI
发明人： Issaku SATO , Akira TAKAGUCHI
CPC分类号： B23K3/0646 , B23K1/085
摘要： A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.
摘要翻译： 焊锡槽包含含有焊料的焊料浴主体和加热焊料的加热部件。 加热构件安装在焊料槽主体的底部和侧面的外表面上。 加热构件包括安装在焊料槽主体的底部和侧面的外表面上的由不锈钢制成的热扩散构件，安装在热扩散构件上并连接到热扩散构件的多孔绝热体， 以及埋入多孔隔热体中的加热元件。 加热元件也远离热扩散构件。
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公开(公告)号：US07255933B2
公开(公告)日：2007-08-14
申请号：US10919525
申请日：2004-08-17
申请人： Issaku Sato , Kenzo Tadokoro , Hideaki Tanibata
发明人： Issaku Sato , Kenzo Tadokoro , Hideaki Tanibata
CPC分类号： B22F7/04 , B22F2003/248 , B22F2998/00 , B22F2998/10 , F04B1/122 , F04B27/1054 , F05C2201/0475 , F05C2201/0493 , F05C2203/086 , F05C2253/12 , F16C33/14 , F16C33/208 , F16C2204/12 , F16C2220/20 , F16C2220/60 , F16C2223/08 , Y10S384/91 , Y10T428/12063 , Y10T428/12146 , Y10T428/12181 , Y10T428/12569 , Y10T428/12722 , Y10T428/12903 , Y10T428/12924 , B22F5/006 , B22F1/0096 , B22F3/16
摘要： A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a metal backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate. After sintering of the pulverized powder to form bearing metal layer, the bearing metal layer is pressed and densified. After densification, the bearing metal layer is annealed, again pressed, and then coated with a resin having good sliding properties.
摘要翻译： 多层滑动部件通过以下步骤制备：将1-50体积份的镀Cu固体润滑剂粉末与100体积份的含有5-20质量％Sn的Cu基合金粉末和余量 的Cu以形成混合粉末，在还原气氛中烧结混合粉末以形成烧结体，粉碎烧结体以形成粉末，将通过粉碎形成的粉末分散在金属背板上，并将分散的粉末烧结成键 分散的粉末的颗粒彼此并且到背板。 在粉碎粉末烧结以形成承载金属层之后，承压金属层被压制和致密化。 在致密化之后，将轴承金属层退火，再次压制，然后用具有良好滑动性能的树脂涂覆。
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公开(公告)号：US07195825B2
公开(公告)日：2007-03-27
申请号：US10644965
申请日：2003-08-21
申请人： Issaku Sato , Kenzou Tadokoro , Hideaki Tanibata
发明人： Issaku Sato , Kenzou Tadokoro , Hideaki Tanibata
CPC分类号： F16C33/14 , B22F7/04 , B22F2003/248 , B22F2998/00 , B22F2998/10 , F16C33/121 , F16C2204/12 , F16C2220/20 , F16C2220/60 , F16C2223/04 , F16C2223/40 , Y10S384/91 , Y10T428/12028 , Y10T428/12146 , Y10T428/12181 , Y10T428/12722 , Y10T428/12903 , Y10T428/12924 , B22F5/006 , B22F1/0096 , B22F3/16
摘要： A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sintering the mixed powder in a reducing atmosphere to form a sintered mass, pulverizing the sintered mass to form a powder, dispersing the powder formed by pulverizing on a steel backing plate, and sintering the dispersed powder to bond grains of the dispersed powder to each other and to the backing plate.
摘要翻译： 多层滑动部件通过以下步骤制备：将1-50体积份的镀Cu固体润滑剂粉末与100体积份的含有5-20质量％Sn的Cu基合金粉末和余量 的Cu形成混合粉末，在还原气氛中烧结混合粉末以形成烧结体，粉碎烧结体以形成粉末，将通过粉碎形成的粉末分散在钢背板上，并将分散的粉末烧结成键 分散的粉末的颗粒彼此并且到背板。
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公开(公告)号：US06492033B2
公开(公告)日：2002-12-10
申请号：US09810341
申请日：2001-03-19
申请人： Issaku Sato , Naoki Sato
发明人： Issaku Sato , Naoki Sato
IPC分类号： B32B1520
CPC分类号： C22C1/0425 , B22F7/04 , B22F2003/248 , B22F2998/00 , F04B27/086 , F04B27/1054 , F05C2201/0421 , F05C2201/0493 , F05C2253/12 , F16C33/121 , F16C2204/12 , Y10S384/91 , Y10S384/912 , Y10T428/12063 , Y10T428/12924 , C22C32/0089
摘要： A lead-free plain bearing is formed by dispersing an alloy powder formed from 7-13 mass percent of Sn, 0.1-5 mass percent of Ag, and Cu on a backing, such as a steel plate, and sintering. The alloy powder may further include one or more of 0.05-0.5 mass percent of molybdenum disulfide powder and 0.1-2 mass percent of graphite powder. The bearing surface may be rough finished by machining to a roughness of 0.3-1 &mgr;m Ra and then fine finished by polishing to a roughness of at most 0.1 &mgr;Ra.
摘要翻译： 通过将由7-13质量％的Sn，0.1-5质量％的Ag和Cu形成的合金粉末分散在诸如钢板的背衬上并烧结来形成无铅滑动轴承。 合金粉末还可以包含0.05〜0.5质量％的二硫化钼粉末和0.1〜2质量％的石墨粉末中的一种或多种。 轴承表面可以通过机械加工粗糙度达到0.3-1μmRa的粗糙度，然后通过抛光精加工成至多0.1μmRa的粗糙度。
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公开(公告)号：US08403199B2
公开(公告)日：2013-03-26
申请号：US13257936
申请日：2010-03-24
申请人： Issaku Sato , Akira Takaguchi
发明人： Issaku Sato , Akira Takaguchi
CPC分类号： B23K3/0653 , B23K1/085 , B23K2101/42 , H05K3/3415 , H05K3/3447 , H05K3/3468 , H05K2203/0746 , H05K2203/0763
摘要： To enable the molten solder to be partially spouted onto a component-mounting member in a stable state without decreasing the revolutions of a pump which is difficult to set a spouted amount of molten solder, even if a nozzle having a small spouting opening is used in a partial-jet-solder bath.As shown in FIG. 3, an automatic partial-jet-soldering apparatus 100 is provided with a solder bath 4 that has a nozzle base portion 44 and contains molten solder 7, a pump 5 that supplies the molten solder 7 contained in the solder bath 4 under a predetermined pressure to the nozzle base portion 44, plural nozzles 8a and the like that have predetermined solder-spouting areas and connect the nozzle base portion 44 to spout the molten solder 7 supplied from the pump 5 under the predetermined pressure so that it rises by its surface tension, and a dummy nozzle 32 that has a solder-spouting area more than that of any of the nozzles 8a and the like and connects the nozzle base portion 44 to spout the molten solder 7 supplied from the pump 5 under the predetermined pressure, wherein the dummy nozzle 32 is positioned on a position which is nearer the pump 5 than the nozzles 8a and the like.
摘要翻译： 为了使熔融焊料能够以稳定的状态部分地喷射到部件安装部件上，而不会减少难以设定喷射量的熔融焊料的泵的转数，即使使用具有小喷射口的喷嘴 部分喷射焊锡浴。 如图所示。 如图3所示，自动部分喷射焊接装置100设置有具有喷嘴基部44并且包含熔融焊料7的焊料槽4，将包含在焊料槽4中的熔融焊料7供给到预定压力的泵5 到喷嘴基部44，具有预定的焊料喷射区域的多个喷嘴8a等，并且连接喷嘴基部44以在预定压力下喷出从泵5供应的熔融焊料7，使得其以其表面张力 以及具有大于喷嘴8a等的焊料喷射面积的虚拟喷嘴32，并且连接喷嘴基部44以在预定压力下喷出从泵5供给的熔融焊料7，其中， 虚拟喷嘴32位于比喷嘴8a等靠近泵5的位置。
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公开(公告)号：US07854996B2
公开(公告)日：2010-12-21
申请号：US11632957
申请日：2004-11-12
申请人： Issaku Sato , Sinzo Nakamura , Naoki Sato , Toshio Hakuto
发明人： Issaku Sato , Sinzo Nakamura , Naoki Sato , Toshio Hakuto
CPC分类号： B22F7/08 , B22F2998/10 , C22C9/00 , C22C9/02 , C22C12/00 , C22C13/02 , C22C28/00 , C22C30/00 , C22C30/04 , F16C33/121 , F16C33/14 , F16C2204/10 , F16C2204/12 , F16C2220/20 , F16C2220/24 , F16C2220/60 , F16C2223/80 , Y10T428/12028 , Y10T428/12042 , Y10T428/12063 , B22F7/004 , B22F3/26
摘要： A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.
摘要翻译： 常规的含Bi滑动材料有时在以高旋转速度操作的滑动部分中被抓住。 本发明提供一种在高速旋转的滑动部件中不会卡住的滑动材料及其制造方法。 含有至少20质量％的Bi并且液相线温度至多为200℃的低熔点合金被制成渗透到包含Cu-Sn基合金的多孔部分中。 作为低熔点合金，适合Bi-Sn系合金或Bi-In系合金。 在将低熔点合金糊料施加到多孔部分之后，低熔点合金熔化并渗透到多孔部分中。
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公开(公告)号：US20100163606A1
公开(公告)日：2010-07-01
申请号：US12646777
申请日：2009-12-23
申请人： Issaku SATO , Akira TAKAGUCHI
发明人： Issaku SATO , Akira TAKAGUCHI
CPC分类号： B23K3/082 , B23K1/0016 , B23K1/203 , B23K3/087 , B23K2101/42 , H05K3/3447 , H05K3/3489 , H05K2203/0763 , H05K2203/1361
摘要： An apparatus coats flux on a projection of a part mounted on a printed circuit board. The projection passes through the printed circuit board and projects from the printed circuit board. The apparatus contains a printed-circuit-board-holding member that holds the printed circuit board, a nozzle having an opening through which the projection comes in the nozzle and comes off the nozzle, a nozzle-moving member that moves the nozzle to a predetermined position, and a flux-supplying member that supplies the flux to the nozzle. The flux is coated on at least the projection by dipping the projection in the flux contained in the nozzle through the opening.
摘要翻译： 一种装置在安装在印刷电路板上的部件的突起上涂覆通量。 投影通过印刷电路板并从印刷电路板突出。 该装置包括保持印刷电路板的印刷电路板保持部件，具有突起从喷嘴离开喷嘴的开口的喷嘴，将喷嘴移动到预定的喷嘴移动部件， 位置，以及向焊嘴供给焊剂的焊剂供给部件。 通过将突起浸入通过开口的喷嘴中所含的焊剂中，将焊剂至少涂覆在突起上。
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