Three-dimensional magnetic memory
    2.
    发明授权
    Three-dimensional magnetic memory 有权
    三维磁记忆体

    公开(公告)号:US08018765B2

    公开(公告)日:2011-09-13

    申请号:US12553670

    申请日:2009-09-03

    CPC classification number: G11C11/14 G11C5/02 G11C19/0808

    Abstract: Magnetic memories and methods are disclosed. A magnetic memory as described herein includes a plurality of stacked data storage layers to form a three-dimensional magnetic memory. Bits may be written to a data storage layer in the form of magnetic domains. The bits can then be transferred between the stacked data storage layers by heating a neighboring data storage layer, which allows the magnetic fields from the magnetic domains to imprint the magnetic domains in the neighboring data storage layer. By imprinting the magnetic domains into the neighboring data storage layer, the bits are copied from one data storage layer to another.

    Abstract translation: 公开了磁存储器和方法。 如本文所述的磁存储器包括多个堆叠的数据存储层以形成三维磁存储器。 位可以以磁畴的形式写入数据存储层。 然后可以通过加热相邻数据存储层在堆叠的数据存储层之间传送这些位,这允许来自磁畴的磁场将磁畴压印在相邻的数据存储层中。 通过将磁畴印刷到相邻数据存储层中,将这些位从一个数据存储层复制到另一个。

    READ/WRITE ELEMENTS FOR A THREE-DIMENSIONAL MAGNETIC MEMORY
    3.
    发明申请
    READ/WRITE ELEMENTS FOR A THREE-DIMENSIONAL MAGNETIC MEMORY 有权
    三维磁记忆读/写元件

    公开(公告)号:US20100039849A1

    公开(公告)日:2010-02-18

    申请号:US12191956

    申请日:2008-08-14

    CPC classification number: G11C11/15 G11C5/02 G11C11/1675 H01L27/228

    Abstract: Read/write elements for three-dimensional magnetic memories are disclosed. One embodiment describes an array of integrated read/write elements. The array includes read conductors formed proximate to one of the layers (i.e., storage stacks) of the three-dimensional magnetic memory. The array also includes flux caps formed proximate to the read conductors, and read sensors formed proximate to the flux caps. The array also includes a magnetic pole having a first end contacting the read sensor and a second end opposite the first end. First write conductors are fabricated between the magnetic poles, and second write conductors are also fabricated between the magnetic poles orthogonal to the first write conductors. The first write conductors and the second write conductors form current loops around the magnetic poles.

    Abstract translation: 公开了用于三维磁存储器的读/写元件。 一个实施例描述了集成读/写元件的阵列。 阵列包括靠近三维磁性存储器的一个层(即,存储堆叠)形成的读取导体。 阵列还包括靠近读取导体形成的焊剂帽,以及靠近焊剂帽形成的读取传感器。 阵列还包括具有接触读取传感器的第一端和与第一端相对的第二端的磁极。 在磁极之间制造第一写入导体,并且在与第一写入导体正交的磁极之间也制造第二写入导体。 第一写入导体和第二写入导体在磁极周围形成电流环。

    Lead contact structure for EMR elements
    4.
    发明授权
    Lead contact structure for EMR elements 失效
    EMR元件的引线接触结构

    公开(公告)号:US07633718B2

    公开(公告)日:2009-12-15

    申请号:US11168070

    申请日:2005-06-27

    CPC classification number: H01L43/08 G11C11/14 H01L43/12

    Abstract: EMR elements and methods of fabricating the EMR elements are disclosed. The EMR structure includes one or more layers that form an active region, such as a two-dimensional electron gas (2DEG). The EMR structure has a first side surface, having a plurality of lead protrusions that extend outwardly from the main body of the EMR structure, and an opposing second side surface. The lead protrusions are used to form the current and voltage leads for the EMR element. The active region extends through each lead protrusion and is accessible along a perimeter of each of the lead protrusions. Conductive material is formed along the perimeter of each lead protrusion and contacts the active region of the EMR structure along the perimeter. The lead protrusion and the corresponding conductive material contacting the active region of each lead protrusion form leads for the EMR element, such as current leads and voltage leads.

    Abstract translation: 公开了EMR元件和制造EMR元件的方法。 EMR结构包括形成有源区的一个或多个层,例如二维电子气(2DEG)。 EMR结构具有第一侧表面,具有从EMR结构的主体向外延伸的多个引线突起和相对的第二侧表面。 引线突起用于形成EMR元件的电流和电压引线。 有源区域延伸穿过每个引线突起,并且可沿着每个引线突起的周边被接近。 沿着每个引线突起的周边形成导电材料,并沿周边与EMR结构的有源区接触。 引线突起和与每个引线突起的有源区接触的相应的导电材料形成用于EMR元件的引线,例如电流引线和电压引线。

    Three-dimensional magnetic memory having bits transferrable between storage layers
    5.
    发明授权
    Three-dimensional magnetic memory having bits transferrable between storage layers 有权
    具有可在存储层之间传送的位的三维磁存储器

    公开(公告)号:US07606065B2

    公开(公告)日:2009-10-20

    申请号:US12116111

    申请日:2008-05-06

    CPC classification number: G11C11/14 G11C5/02 G11C19/0808

    Abstract: Magnetic memories and methods are disclosed. A magnetic memory as described herein includes a plurality of stacked data storage layers to form a three-dimensional magnetic memory. Bits may be written to a data storage layer in the form of magnetic domains. The bits can then be transferred between the stacked data storage layers by heating a neighboring data storage layer, which allows the magnetic fields from the magnetic domains to imprint the magnetic domains in the neighboring data storage layer. By imprinting the magnetic domains into the neighboring data storage layer, the bits are copied from one data storage layer to another.

    Abstract translation: 公开了磁存储器和方法。 如本文所述的磁存储器包括多个堆叠的数据存储层以形成三维磁存储器。 位可以以磁畴的形式写入数据存储层。 然后可以通过加热相邻数据存储层在堆叠的数据存储层之间传送这些位,这允许来自磁畴的磁场将磁畴压印在相邻的数据存储层中。 通过将磁畴印刷到相邻数据存储层中,将这些位从一个数据存储层复制到另一个。

    WAFER-LEVEL METHOD FOR FABRICATING AN OPTICAL CHANNEL AND APERTURE STRUCTURE IN MAGNETIC RECORDING HEAD SLIDERS FOR USE IN THERMALLY-ASSISTED RECORDING (TAR)
    6.
    发明申请
    WAFER-LEVEL METHOD FOR FABRICATING AN OPTICAL CHANNEL AND APERTURE STRUCTURE IN MAGNETIC RECORDING HEAD SLIDERS FOR USE IN THERMALLY-ASSISTED RECORDING (TAR) 审中-公开
    用于制作用于热辅助记录(TAR)的磁记录头滑块中的光通道和光孔结构的波形方法

    公开(公告)号:US20090258186A1

    公开(公告)日:2009-10-15

    申请号:US12101066

    申请日:2008-04-10

    Abstract: A process for forming a plurality of sliders for use in thermally-assisted recording (TAR) disk drives includes a wafer-level process for forming a plurality of aperture structures, and optionally abutting optical channels, on a wafer surface prior to cutting the wafer into individual sliders. The wafer has a generally planar surface arranged into a plurality of rectangularly-shaped regions. In each rectangular region a first metal layer is deposited on the wafer surface, followed by a layer of radiation-transmissive aperture material, which is then lithographically patterned to define the width of the aperture, the aperture width being parallel to the length of the rectangularly-shaped region. A second metal layer is deposited over the patterned layer of aperture material. The resulting structure is then lithographically patterned to define an aperture structure comprising aperture material surrounded by metal and having parallel radiation entrance and exit faces orthogonal to the wafer surface.

    Abstract translation: 用于形成用于热辅助记录(TAR)盘驱动器中的多个滑动件的方法包括在将晶片切割成晶片之前在晶片表面上形成多个孔结构和可选地邻接的光通道的晶片级工艺 个人滑块 晶片具有布置成多个矩形区域的大致平坦的表面。 在每个矩形区域中,第一金属层沉积在晶片表面上,随后是一层辐射透射的孔隙材料,然后将其光刻图案化以限定孔的宽度,孔的宽度平行于矩形的长度 形状区域。 在孔材料的图案化层上沉积第二金属层。 然后将所得结构光刻图案化以限定孔结构,该孔结构包括由金属包围并具有与晶片表面正交的平行辐射入射面和出射面的孔隙材料。

    AP FREE LAYER CPP SENSOR WITH TOP APERTURE
    7.
    发明申请
    AP FREE LAYER CPP SENSOR WITH TOP APERTURE 有权
    AP自由层CPP传感器与顶级APERTURE

    公开(公告)号:US20090154027A1

    公开(公告)日:2009-06-18

    申请号:US11957466

    申请日:2007-12-16

    Abstract: Read sensors and associated methods of fabrication are disclosed. A read sensor as disclosed herein includes a first shield, a sensor stack including an antiparallel (AP) free layer, and insulating material disposed on the sensor stack. A aperture is formed through the insulating material above the sensor stack so that a subsequently deposited second shield is electrically coupled to the sensor stack through the aperture. The width of the aperture controls the current density that is injected into the top of the sensor stack. Also, hard bias structures may be formed to be electrically coupled to the sensor stack. The electrical coupling of the sensor stack and the hard bias structures allows current to laterally spread out as it passes through the sensor stack, and hence, provides a non-uniform current density.

    Abstract translation: 公开了传感器和相关的制造方法。 本文公开的读取传感器包括第一屏蔽层,包括反平行(AP)自由层的传感器堆叠以及设置在传感器堆叠上的绝缘材料。 通过传感器堆叠上方的绝缘材料形成孔,使得随后沉积的第二屏蔽件通过孔电耦合到传感器堆叠。 光圈的宽度控制注入到传感器叠层顶部的电流密度。 此外,可以形成硬偏置结构以电耦合到传感器堆叠。 传感器堆叠和硬偏置结构的电耦合允许电流在其通过传感器堆叠时横向展开,因此提供不均匀的电流密度。

    Method for producing a spin valve transistor with stabilization
    9.
    发明授权
    Method for producing a spin valve transistor with stabilization 失效
    用于制造具有稳定性的自旋阀晶体管的方法

    公开(公告)号:US07367111B2

    公开(公告)日:2008-05-06

    申请号:US11340263

    申请日:2006-01-25

    Abstract: A method and structure for a spin valve transistor (SVT) comprises a magnetic field sensor, an insulating layer adjacent the magnetic field sensor, a bias layer adjacent the insulating layer, a non-magnetic layer adjacent the bias layer, and a ferromagnetic layer over the non-magnetic layer, wherein the insulating layer and the non-magnetic layer comprise antiferromagnetic materials. The magnetic field sensor comprises a base region, a collector region adjacent the base region, an emitter region adjacent the base region, and a barrier region located between the base region and the emitter region. The bias layer is between the insulating layer and the non-magnetic layer. The bias layer is magnetic and is at least three times the thickness of the magnetic materials in the base region.

    Abstract translation: 自旋阀晶体管(SVT)的方法和结构包括磁场传感器,与磁场传感器相邻的绝缘层,与绝缘层相邻的偏置层,邻近偏置层的非磁性层,以及铁磁层 非磁性层,其中绝缘层和非磁性层包括反铁磁材料。 磁场传感器包括基极区域,邻近基极区域的集电极区域,邻近基极区域的发射极区域和位于基极区域和发射极区域之间的势垒区域。 偏置层位于绝缘层和非磁性层之间。 偏置层是磁性的,并且是基极区域中的磁性材料的厚度的至少三倍。

    MAGNETORESISTIVE SENSOR HAVING A STRUCTURE FOR ACTIVATING AND DEACTIVATING ELECTROSTATIC DISCHARGE PREVENTION CIRCUITRY
    10.
    发明申请
    MAGNETORESISTIVE SENSOR HAVING A STRUCTURE FOR ACTIVATING AND DEACTIVATING ELECTROSTATIC DISCHARGE PREVENTION CIRCUITRY 失效
    具有用于激活和消除静电放电防止电路的结构的磁传感器

    公开(公告)号:US20080037182A1

    公开(公告)日:2008-02-14

    申请号:US11426908

    申请日:2006-06-27

    CPC classification number: G11B5/40

    Abstract: A structure for preventing Electrostatic Discharge (ESD) damage to a magnetoresistive sensor during manufacture. The structure includes a switching element that can be switched off during testing of the sensor and then switched back on to provide ESD shunting to the sensor. The switch can be a thermally activated mechanical relay built onto the slider. The switch could also be a programmable resistor that includes a solid electrolyte sandwiched between first and second electrodes. One of the electrodes functions as an anode. When voltage is applied in a first direction an ion bridge forms across through the electrolyte across electrodes making the resistor conductive. When a voltage is applied in a second direction, the ion bridge recedes and the programmable resistor becomes essentially non-conductive. Another possible programmable resistor uses a phase change material that can change between an amorphous high resistance state and a crystalline low resistance state upon the application of a certain heat treatments.

    Abstract translation: 用于在制造期间防止静电放电(ESD)损坏磁阻传感器的结构。 该结构包括开关元件,该开关元件可以在测试传感器期间关闭,然后重新接通以向传感器提供ESD分流。 开关可以是内置在滑块上的热激活机械继电器。 开关也可以是可编程电阻器,其包括夹在第一和第二电极之间的固体电解质。 电极之一用作阳极。 当沿第一方向施加电压时,离子桥跨越电解质跨过电极跨过电极,使电阻器导电。 当沿第二个方向施加电压时,离子桥退出,可编程电阻基本上不导电。 另一种可能的可编程电阻器使用相变材料,其可以在施加某种热处理时在非晶高电阻状态和结晶低电阻状态之间变化。

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