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公开(公告)号：US08074905B2
公开(公告)日：2011-12-13
申请号：US11692969
申请日：2007-03-29
Applicant: Marcus Schaefer , Reiner Pech , Matthaeus Schantz
Inventor： Marcus Schaefer , Reiner Pech , Matthaeus Schantz
IPC: B02C19/00
CPC classification number: B02C23/08 , B02C21/00 , B02C25/00 , B07C5/08 , C01B33/02 , C30B15/00 , C30B29/06
Abstract: The invention relates to a device for comminuting and sorting polycrystalline silicon, comprising an instrument for feeding a coarse polysilicon fraction into a crushing system, the crushing system associated with a sorting system for classifying the polysilicon fraction, wherein the device is provided with a controller which allows variable adjustment of at least one crushing parameter in the crushing system and/or at least one sorting parameter in the sorting system.
Abstract translation: 本发明涉及一种用于粉碎和分选多晶硅的装置，包括用于将粗多晶硅部分进料到破碎系统中的装置，所述破碎系统与用于对多晶硅部分进行分类的分选系统相关联，其中该装置设置有控制器， 允许在破碎系统中的至少一个破碎参数和/或分选系统中的至少一个排序参数进行变量调整。
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公开(公告)号：US08747794B2
公开(公告)日：2014-06-10
申请号：US13197997
申请日：2011-08-04
Applicant: Reiner Pech , Erich Dornberger
Inventor： Reiner Pech , Erich Dornberger
IPC: C01B33/02 , C01B33/037 , B02C19/18 , B07B9/02
CPC classification number: C01B33/037 , Y10T428/2982
Abstract: Polycrystalline silicon of the invention contains: (a) polycrystalline silicon fragments, wherein at least 90% of the fragments have a size from 10 to 40 mm, (b)
Abstract translation: 本发明的多晶硅含有：（a）多晶硅碎片，其中至少90％的片段具有10至40mm的尺寸，（b）<15ppmw的粒径<400μm的硅粉粒子; （c）<14ppmw的粒径<50μm的硅粉粒子; （d）<10ppmw的粒径<10μm的硅粉粒子; （e）<3ppmw的粒径小于1μm的硅粉颗粒; 和（f）表面金属杂质含量为0.1ppbw和≥100ppbw。 本发明的多晶硅制造方法包括将沉积在西门子反应器中的细棒上的多晶硅压碎成碎片; 按大小分类片段; 并用压缩空气或干冰处理碎片以从碎片中除去硅粉，而不用湿化学清洗。
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公开(公告)号：US20120052297A1
公开(公告)日：2012-03-01
申请号：US13197997
申请日：2011-08-04
Applicant: Reiner PECH , Erich DORNBERGER
Inventor： Reiner PECH , Erich DORNBERGER
CPC classification number: C01B33/037 , Y10T428/2982
Abstract: Polycrystalline silicon of the invention contains: (a) polycrystalline silicon fragments, wherein at least 90% of the fragments have a size from 10 to 40 mm, (b)
Abstract translation: 本发明的多晶硅含有：（a）多晶硅碎片，其中至少90％的片段具有10至40mm的尺寸，（b）<15ppmw的粒径<400μm的硅粉粒子; （c）<14ppmw的粒径<50μm的硅粉粒子; （d）<10ppmw的粒径<10μm的硅粉粒子; （e）<3ppmw的粒径小于1μm的硅粉颗粒; 和（f）表面金属杂质含量为0.1ppbw和≥100ppbw。 本发明的多晶硅制造方法包括将沉积在西门子反应器中的细棒上的多晶硅压碎成碎片; 按大小分类片段; 并用压缩空气或干冰处理碎片以从碎片中除去硅粉，而不用湿化学清洗。
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4.发明申请DEVICE AND METHOD FOR THE FLEXIBLE CLASSIFICATION OF POLYCRYSTALLINE SILICON FRAGMENTS 审中-公开用于柔性分类多晶硅片的装置和方法公开(公告)号：US20090120848A1
公开(公告)日：2009-05-14
申请号：US12296219
申请日：2007-03-28
Applicant: Marcus Schaefer , Reiner Pech
Inventor： Marcus Schaefer , Reiner Pech
CPC classification number: B07B1/00 , B07B13/003 , B07B13/04
Abstract: Polycrystalline silicon fragments are sorted into defined particle fractions in a flexible manner independent of initial particle size distribution and desired fraction size by a first mechanical screening into a fine fraction and residual fraction, followed by optoelectronic sorting of the residual fraction.
Abstract translation: 多晶硅片段以灵活的方式被分选成限定的颗粒组分，独立于初始粒度分布和期望的级分尺寸，通过第一次机械筛选成精细级分和残余级分，然后对剩余级分进行光电分选。
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公开(公告)号：US10478860B2
公开(公告)日：2019-11-19
申请号：US12296219
申请日：2007-03-28
Applicant: Marcus Schaefer , Reiner Pech
Inventor： Marcus Schaefer , Reiner Pech
Abstract: Polycrystalline silicon fragments are sorted into defined particle fractions in a flexible manner independent of initial particle size distribution and desired fraction size by a first mechanical screening into a fine fraction and residual fraction, followed by optoelectronic sorting of the residual fraction.
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Patent Agency Ranking
公开(公告)号：US08833042B2
公开(公告)日：2014-09-16
申请号：US12664418
申请日：2008-06-05
Applicant: Hanns Wochner , Bruno Lichtenegger , Reiner Pech
Inventor： Hanns Wochner , Bruno Lichtenegger , Reiner Pech
Abstract: An automated filling system for introducing crushed polysilicon fragments into shipping bags without significant contamination positions a freely suspended energy absorber into a freely suspended bag of non-contaminating material prior to filling, and following filling, the energy absorber is removed, and the bag is sealed. The system can replace manual packaging which has been required for semiconductor applications.
Abstract translation: 用于将破碎的多晶硅碎片引入运输袋而没有明显污染的自动填充系统将自由悬浮的能量吸收器在填充之前将自由悬浮的能量吸收剂定位到自由悬浮的无污染物质袋中，并且在填充之后，去除能量吸收器，并且将袋密封 。 该系统可以替代半导体应用所需的手动包装。
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7.发明申请METHOD AND DEVICE FOR PRODUCING CLASSIFIED HIGH-PURITY POLYCRYSTALLINE SILICON FRAGMENTS 有权用于生产分级高纯度多晶硅片的方法和装置公开(公告)号：US20100001106A1
公开(公告)日：2010-01-07
申请号：US12375457
申请日：2007-07-13
Applicant: Marcus Schaefer , Reiner Pech , Hanns Wochner
Inventor： Marcus Schaefer , Reiner Pech , Hanns Wochner
CPC classification number: C30B29/06 , B02C21/00 , B02C23/08 , B02C2210/02 , C30B15/00
Abstract: Polysilicon rods from the Siemens process are crushed into fragments and further processed to fragments having very low metal contamination in an economical manner by purposefully fabricating parts contacting the polysilicon from materials which cause high metal contamination, and removing the metal contamination by a cleaning bath or baths tailored to the particular metal contamination. By this process, economical materials previously scrupulously avoided, such as low alloy steel, can be used for crushers, conveyors, and other polysilicon-contacting parts of the crushing and classifying system.
Abstract translation: 西门子工艺的多晶硅棒被粉碎成碎片，并以经济的方式进一步加工成具有非常低金属污染的碎片，目的是通过有目的地制造与导致高金属污染的材料接触多晶硅的部件，以及通过清洗浴或浴来去除金属污染 适合特定的金属污染。 通过这种方法，先前严格避免的经济材料，如低合金钢，可用于破碎和分级系统的破碎机，输送机和其他多晶硅接触部件。
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公开(公告)号：US20070235574A1
公开(公告)日：2007-10-11
申请号：US11692969
申请日：2007-03-29
Applicant: Marcus Schaefer , Reiner Pech , Matthaeus Schantz
Inventor： Marcus Schaefer , Reiner Pech , Matthaeus Schantz
IPC: B02C25/00
CPC classification number: B02C23/08 , B02C21/00 , B02C25/00 , B07C5/08 , C01B33/02 , C30B15/00 , C30B29/06
Abstract: The invention relates to a device for comminuting and sorting polycrystalline silicon, comprising an instrument for feeding a coarse polysilicon fraction into a crushing system, the crushing system associated with a sorting system for classifying the polysilicon fraction, wherein the device is provided with a controller which allows variable adjustment of at least one crushing parameter in the crushing system and/or at least one sorting parameter in the sorting system.
Abstract translation: 本发明涉及一种用于粉碎和分选多晶硅的装置，包括用于将粗多晶硅部分进料到破碎系统中的装置，所述破碎系统与用于对多晶硅部分进行分类的分选系统相关联，其中该装置设置有控制器， 允许在破碎系统中的至少一个破碎参数和/或分选系统中的至少一个排序参数进行变量调整。
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9.发明授权公开(公告)号：US09209009B2
公开(公告)日：2015-12-08
申请号：US13772756
申请日：2013-02-21
Applicant: Gerhard Traunspurger , Laszlo Fabry , Reiner Pech
Inventor： Gerhard Traunspurger , Laszlo Fabry , Reiner Pech
CPC classification number: C01B33/02 , C01B33/037 , C01P2002/88 , C01P2002/89 , C01P2002/90 , C01P2006/80 , C30B11/00 , C30B13/00 , C30B15/00 , C30B29/06 , H01L21/02046
Abstract: The invention provides chunk polycrystalline silicon having a concentration of carbon at the surface of 0.5-35 ppbw. A process for cleaning polycrystalline silicon chunks having carbon contaminations at the surface, includes a thermal treatment of the polycrystalline silicon chunks in a reactor at a temperature of 350 to 600° C., the polycrystalline silicon chunks being present in an inert gas atmosphere during the thermal treatment, and the polycrystalline silicon chunks after the thermal treatment having a concentration of carbon at the surface of 0.5-35 ppbw.
Abstract translation: 本发明提供了在0.5-35ppbw的表面具有碳浓度的块状多晶硅。 用于清洗表面具有碳污染的多晶硅块的方法包括在350-600℃的温度下对反应器中的多晶硅块进行热处理，多晶硅块存在于惰性气体气氛中 热处理和热处理后的多晶硅块，其表面的碳浓度为0.5-35ppbw。
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公开(公告)号：US20100154357A1
公开(公告)日：2010-06-24
申请号：US12664418
申请日：2008-06-05
Applicant: Hanns Wochner , Bruno Lichtenegger , Reiner Pech
Inventor： Hanns Wochner , Bruno Lichtenegger , Reiner Pech
Abstract: An automated filling system for introducing crushed polysilicon fragments into shipping bags without significant contamination positions a freely suspended energy absorber into a freely suspended bag of non-contaminating material prior to filling, and following filling, the energy absorber is removed, and the bag is sealed. The system can replace manual packaging which has been required for semiconductor applications.
Abstract translation: 用于将破碎的多晶硅碎片引入运输袋而没有明显污染的自动填充系统将自由悬浮的能量吸收器在填充之前将自由悬浮的能量吸收剂定位到自由悬浮的无污染物质袋中，并且在填充之后，去除能量吸收器，并且将袋密封 。 该系统可以替代半导体应用所需的手动包装。
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