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    Wafer level edge stacking
    1.
    发明申请
    Wafer level edge stacking 有权
    晶圆级边缘堆叠

    公开(公告)号：US20090316378A1

    公开(公告)日：2009-12-24

    申请号：US12456349

    申请日：2009-06-15

    Applicant: Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

    Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

    IPC: H05K7/02 ,  H05K3/34

    CPC classification number: H01L25/105 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01067 ,  H01L2924/01322 ,  Y10T29/49144

    Abstract: A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween.

    Abstract translation: 微电子组件可以包括第一微电子器件和第二微电子器件。 每个微电子器件具有包括至少一个半导体管芯的管芯结构，并且每个微电子器件具有第一表面，远离第一表面的第二表面和至少一个边缘表面，该边缘表面以远离第一表面的直角延伸 和第二表面。 至少一个导电元件沿着第一表面延伸到至少一个边缘表面上并且延伸到第二表面上。 第一微电子器件的至少一个导电元件可以导电地结合到第二微电子器件的至少一个导电元件，以在它们之间提供导电路径。

    Stacked microelectronic assemblies having vias extending through bond pads
    3.
    发明授权
    Stacked microelectronic assemblies having vias extending through bond pads 有权
    堆叠的微电子组件具有延伸穿过接合焊盘的通孔

    公开(公告)号：US08466542B2

    公开(公告)日：2013-06-18

    申请号：US12723039

    申请日：2010-03-12

    Applicant: Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    Inventor： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    IPC: H01L23/48 ,  H01L23/02 ,  H01L29/40

    CPC classification number: H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

    Abstract translation: 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。

    REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
    4.
    发明申请
    REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS 有权
    后照明固体状态图像传感器

    公开(公告)号：US20120112301A1

    公开(公告)日：2012-05-10

    申请号：US12940326

    申请日：2010-11-05

    Applicant: Giles Humpston ,  Moshe Kriman

    Inventor： Giles Humpston ,  Moshe Kriman

    IPC: H01L31/02 ,  H01L31/18

    CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

    Abstract translation: 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

    STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS
    5.
    发明申请
    STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS 有权
    堆叠式微电脑组件，具有通过焊盘延伸的VIAS

    公开(公告)号：US20100230795A1

    公开(公告)日：2010-09-16

    申请号：US12723039

    申请日：2010-03-12

    Applicant: Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    Inventor： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    IPC: H01L25/065 ,  H01L21/77 ,  H01L23/538

    CPC classification number: H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

    Abstract translation: 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。

    Wafer level edge stacking
    9.
    发明授权
    Wafer level edge stacking 有权
    晶圆级边缘堆叠

    公开(公告)号：US08680662B2

    公开(公告)日：2014-03-25

    申请号：US12456349

    申请日：2009-06-15

    Applicant: Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

    Inventor： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

    IPC: H01L23/02

    CPC classification number: H01L25/105 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01067 ,  H01L2924/01322 ,  Y10T29/49144

    Abstract: A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween.

    Abstract translation: 微电子组件可以包括第一微电子器件和第二微电子器件。 每个微电子器件具有包括至少一个半导体管芯的管芯结构，并且每个微电子器件具有第一表面，远离第一表面的第二表面和至少一个边缘表面，该边缘表面以远离第一表面的直角延伸 和第二表面。 至少一个导电元件沿着第一表面延伸到至少一个边缘表面上并且延伸到第二表面上。 第一微电子器件的至少一个导电元件可以导电地结合到第二微电子器件的至少一个导电元件，以在它们之间提供导电路径。

    Rear-face illuminated solid state image sensors
    10.
    发明授权
    Rear-face illuminated solid state image sensors 有权
    背面照明固态图像传感器

    公开(公告)号：US08624342B2

    公开(公告)日：2014-01-07

    申请号：US12940326

    申请日：2010-11-05

    Applicant: Giles Humpston ,  Moshe Kriman

    Inventor： Giles Humpston ,  Moshe Kriman

    IPC: H01L31/02

    CPC classification number: H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

    Abstract: A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

    Abstract translation: 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

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