Imprint method and imprint apparatus
    1.
    发明授权
    Imprint method and imprint apparatus 有权
    压印方法和压印装置

    公开(公告)号:US08973494B2

    公开(公告)日:2015-03-10

    申请号:US13023225

    申请日:2011-02-08

    IPC分类号: G03F7/00 B82Y10/00

    摘要: According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template.

    摘要翻译: 根据一个实施例,公开了压印方法。 该方法可以包括通过将转印材料落到处理衬底的主表面上来形成体积大于预定参考体积的转印材料的液滴。 该方法可以包括通过挥发液滴来将液滴的体积减小到小于参考体积。 此外,该方法可以包括通过使体积减小到小于参考体积的液滴与模板的转印表面接触来将转印材料填充到设置在模板的转印表面中的凹部中。

    Pattern forming method, pattern forming apparatus, and method for manufacturing semiconductor device
    2.
    发明授权
    Pattern forming method, pattern forming apparatus, and method for manufacturing semiconductor device 有权
    图案形成方法,图案形成装置以及半导体装置的制造方法

    公开(公告)号:US08772179B2

    公开(公告)日:2014-07-08

    申请号:US13607504

    申请日:2012-09-07

    IPC分类号: H01L21/00

    摘要: According to one embodiment, a pattern forming method using a template containing a pattern that has at least one recess section or protrusion section to transfer the shape of the pattern to a resin layer on a substrate, is provided. The method includes a process for coating the resin on the substrate, a process for making the hardness of the first portion as a portion of the resin higher than the hardness of the second portion as the portion other than the first portion, and a process in which the portion other than the pattern of the template makes contact with the first portion, in a state where a gap is maintained between the template and the resin, the shape of the pattern is transferred to the second portion, and the resin is cured. Embodiments of an apparatus for pattern forming are also provided.

    摘要翻译: 根据一个实施例,提供一种使用包含具有至少一个凹部或突起部的图案的模板的图案形成方法,以将图案的形状转印到基板上的树脂层。 该方法包括在基板上涂布树脂的方法,使作为树脂部分的第一部分的硬度高于作为第一部分以外的部分的第二部分的硬度的方法,以及 在模板和树脂之间保持间隙的状态下,模板图案之外的部分与第一部分接触的部分,图案的形状被转印到第二部分,树脂固化。 还提供了用于图案形成的装置的实施例。

    FINE PROCESSING METHOD, FINE PROCESSING APPARATUS, AND RECORDING MEDIUM WITH FINE PROCESSING PROGRAM RECORDED THEREON
    3.
    发明申请
    FINE PROCESSING METHOD, FINE PROCESSING APPARATUS, AND RECORDING MEDIUM WITH FINE PROCESSING PROGRAM RECORDED THEREON 有权
    精细加工方法,精细加工设备和记录有精细加工程序的记录介质

    公开(公告)号:US20120074605A1

    公开(公告)日:2012-03-29

    申请号:US13204844

    申请日:2011-08-08

    IPC分类号: B29C43/02

    摘要: According to one embodiment, a fine processing method includes determining a resist amount required for each first region of a pattern formation surface and a total amount of resist. The method include dividing the total amount of resist by a volume of one resist drop to determine the resist drops total number. The method include determining a provisional position for the resist drop of the total number. The method include assigning the each first region to nearest one resist drop, and partitioning again the pattern formation surface into second regions assigned to the each resist drop. The method include determining a divided value by dividing the volume of the one resist drop by the required total amount of resist determined. The method include finalizing a final position of the each resist drop, if a distribution of the divided value in the pattern formation surface falls within a target range.

    摘要翻译: 根据一个实施例,精细处理方法包括确定图案形成表面的每个第一区域和抗蚀剂总量所需的抗蚀剂量。 该方法包括将抗蚀剂的总量除以一个抗蚀剂滴的体积以确定抗蚀剂滴数总数。 该方法包括确定总数的抗蚀剂落下的临时位置。 该方法包括将每个第一区域分配给最接近的一个抗蚀剂层,以及再次将图案形成表面分割成分配给每个抗蚀剂层的第二区域。 该方法包括通过将一个抗蚀剂液滴的体积除以所需的抗蚀剂总量确定分割值。 如果图案形成表面中的分割值的分布落在目标范围内,则该方法包括确定每个抗蚀剂液滴的最终位置。

    Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
    7.
    发明授权
    Semiconductor manufacturing apparatus and method for manufacturing semiconductor device 有权
    半导体制造装置及半导体装置的制造方法

    公开(公告)号:US08901012B2

    公开(公告)日:2014-12-02

    申请号:US13599358

    申请日:2012-08-30

    IPC分类号: C23C16/52 H01L21/67 C23C16/44

    摘要: According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.

    摘要翻译: 根据一个实施例,半导体制造装置包括基板台,转印单元和控制单元。 衬底可在衬底台上设置。 转印单元被配置为通过可附接地和可移除地保持模板将具有不均匀构造的图案转印到基板的主表面上。 转印面上设有图案。 控制单元被配置为在传送图案之前获取与主表面上的多个异物相关的信息。 控制单元添加包括由传送单元传送的图案的多个基板的数量。 在总和达到上限的情况下,控制单元使得传送单元不执行图案的传送。

    CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS, CONTROL SYSTEM FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
    8.
    发明申请
    CONTROL METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS, CONTROL SYSTEM FOR SEMICONDUCTOR MANUFACTURING APPARATUS, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE 失效
    半导体制造装置的控制方法,半导体制造装置的控制系统及半导体装置的制造方法

    公开(公告)号:US20100023146A1

    公开(公告)日:2010-01-28

    申请号:US12497349

    申请日:2009-07-02

    IPC分类号: G06F19/00

    摘要: A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data.

    摘要翻译: 一种半导体制造装置的控制方法,包括:当半导体制造装置处理晶片时,产生作为对数数据的半导体制造装置的工作状态的历史; 基于对数数据,指定在由半导体制造装置处理的晶片处理之后的处理结果中作为异常处理结果的半导体制造装置的操作状态为异常状态的处理结果; 基于处理结果和异常处理结果创建半导体制造装置的控制数据; 以及使用控制数据来控制半导体制造装置的处理。

    IMMERSION LITHOGRAPHY METHOD
    9.
    发明申请
    IMMERSION LITHOGRAPHY METHOD 审中-公开
    实验方法

    公开(公告)号:US20090296054A1

    公开(公告)日:2009-12-03

    申请号:US12473034

    申请日:2009-05-27

    IPC分类号: G03B27/52

    摘要: An immersion lithography method includes preparing an exposure tool having an exposure stage, a projection lens having an immersion head movable on the stage and used to form an immersion region and an illumination light source provided on the projection lens via a mask, placing a to-be-exposed substrate on the stage, supplying a liquid by use of the immersion head and forming the immersion region disposed between a surface portion of the substrate and a lower end portion of the projection lens, and relatively moving the stage and projection lens while holding the immersion region and exposing a region of the substrate covered with the immersion region. A first distance between the projection lens and the substrate is kept unchanged and a second distance between the immersion head and substrate is changed according to an exposure sequence.

    摘要翻译: 浸没式光刻方法包括制备具有曝光台的曝光工具,具有可在舞台上移动并用于形成浸没区域的浸没头的投影透镜和经由掩模设置在投影透镜上的照明光源, 曝光后的基板,通过浸渍头供给液体,形成设置在基板的表面部分和投影透镜的下端部之间的浸渍区域,并且保持平台和投影透镜同时保持 浸没区域并暴露被浸渍区域覆盖的基板的区域。 投影透镜和基板之间的第一距离保持不变,并且浸没头和基板之间的第二距离根据曝光顺序而改变。

    IMMERSION EXPOSURE METHOD OF AND IMMERSION EXPOSURE APPARATUS FOR MAKING EXPOSURE IN A STATE WHERE THE SPACE BETWEEN THE PROJECTION LENS AND SUBSTRATE TO BE PROCESSED IS FILLED WITH A LIQUID
    10.
    发明申请
    IMMERSION EXPOSURE METHOD OF AND IMMERSION EXPOSURE APPARATUS FOR MAKING EXPOSURE IN A STATE WHERE THE SPACE BETWEEN THE PROJECTION LENS AND SUBSTRATE TO BE PROCESSED IS FILLED WITH A LIQUID 审中-公开
    在投影镜头和待处理的衬底之间的空间填充液体的状态下,接触曝光方法和浸入曝光装置

    公开(公告)号:US20080218715A1

    公开(公告)日:2008-09-11

    申请号:US12044439

    申请日:2008-03-07

    IPC分类号: G03B27/42

    摘要: An immersion exposure method is disclosed which, while causing a relative movement of an immersion area formed so as to intervene between a substrate to be exposed on an exposure stage and a projection lens to the substrate, exposes an irradiation area of the substrate covered with the immersion area. An exposure stage is moved in a first direction, thereby exposing a first exposure area of the substrate. The exposure stage is moved in a second direction opposite to the first direction, thereby exposing a second exposure area adjoining the first exposure area. In a state where the second exposure area is held inside the immersion boundary of the immersion area, the exposure stage is moved from the movement end position of the exposure stage in a first exposure moving process to the movement start position of the exposure stage in a second exposure moving process.

    摘要翻译: 公开了一种浸没曝光方法,其中,使形成的浸渍区域的相对运动在曝光台上待曝光的基板和投影透镜之间介入到基板的同时,使被覆盖的基板的照射区域曝光 沉浸区域。 曝光阶段沿第一方向移动,从而暴露基板的第一曝光区域。 曝光阶段在与第一方向相反的第二方向上移动,从而暴露与第一曝光区域相邻的第二曝光区域。 在第二曝光区域保持在浸没区域的浸没边界内的状态下,曝光阶段在第一曝光移动处理中从曝光台的移动结束位置移动到曝光台的移动开始位置 第二曝光移动过程。