摘要:
A substrate holding member according to an embodiment includes an opening having a minimum internal diameter lager than a diameter of a space in which a substrate to be exposed on a substrate stage is disposed, wherein an inner peripheral surface of the opening has a shape expanding toward a lower surface at least partly.
摘要:
An immersion lithography method includes preparing an exposure tool having an exposure stage, a projection lens having an immersion head movable on the stage and used to form an immersion region and an illumination light source provided on the projection lens via a mask, placing a to-be-exposed substrate on the stage, supplying a liquid by use of the immersion head and forming the immersion region disposed between a surface portion of the substrate and a lower end portion of the projection lens, and relatively moving the stage and projection lens while holding the immersion region and exposing a region of the substrate covered with the immersion region. A first distance between the projection lens and the substrate is kept unchanged and a second distance between the immersion head and substrate is changed according to an exposure sequence.
摘要:
In one embodiment, an exposure apparatus is configured to irradiate a mask with illumination light and to irradiate a wafer with light from the mask irradiated with the illumination light. The apparatus includes an information acquisition unit configured to acquire use history information that is information regarding a use history of the mask. The apparatus further includes a condition derivation unit configured to derive a setting value or a change amount of an optical setting condition of the exposure apparatus, based on the acquired use history information and correspondence information that indicates a correspondence between the use history of the mask and the optical setting condition of the exposure apparatus. The apparatus further includes an exposure unit configured to set the optical setting condition of the exposure apparatus to an optical setting condition specified by the derived setting value or change amount, and to expose the wafer under the set optical setting condition.
摘要:
In one embodiment, a template chuck for an imprint apparatus includes first and second bodies configured to contact an upper surface and a lower surface of a template, respectively, to sandwich the template vertically. The chuck further includes contact members configured to contact side surfaces of the template to sandwich the template laterally. The chuck further includes a deformation controller configured to deform the template by applying a stress to the template through the contact members. In addition, the first body, the second body, and the contact members are configured to be movable individually.
摘要:
A template repair method according to one embodiment is a method for repairing a template including a template base material and a first mold release layer formed on a pattern surface of the template base material, and a restorative material is supplied to the pattern surface of the template base material in the template repair method. The restorative material has affinity to the base material and non-affinity to the mold release layer.
摘要:
An exposure apparatus includes a first exposure apparatus used for exposing a peripheral portion of a wafer in maskless manner, the first exposure apparatus including a light source configured to emit light, a stage on which the wafer is to be placed, and a light controller configured to control the light emitted from the light source and irradiated onto a peripheral portion of the wafer placed on the stage, the light controller controlling at least one of shape, size and coverage on the wafer of the light emitted from the light source.