专利检索 ap:"Loreto Cantillep" 第 1 页

1.

发明授权
Electrically interconnected stacked die assemblies 有权
标题翻译：电互连叠层模组件

公开(公告)号：US08629543B2

公开(公告)日：2014-01-14

申请号：US12913604

申请日：2010-10-27

申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

IPC分类号： H01L23/02

CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。在一些实施例中，导电迹线由导电聚合物形成。提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

2.

发明授权
Electrically interconnected stacked die assemblies 有权

公开(公告)号：US08723332B2

公开(公告)日：2014-05-13

申请号：US12124077

申请日：2008-05-20

申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, Jr. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

IPC分类号： H01L23/48

CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

3.

发明申请
STACKED DIE ASSEMBLY HAVING REDUCED STRESS ELECTRICAL INTERCONNECTS 有权
标题翻译：具有减少应力电气互连的堆叠式电池组件

公开(公告)号：US20110272825A1

公开(公告)日：2011-11-10

申请号：US12939524

申请日：2010-11-04

申请人： Scott McGrath , Jeffrey S. Leal , Ravi Shenoy , Loreto Cantillep , Simon J. S. McElrea , Suzette K. Pangrle

发明人： Scott McGrath , Jeffrey S. Leal , Ravi Shenoy , Loreto Cantillep , Simon J. S. McElrea , Suzette K. Pangrle

IPC分类号： H01L23/522 , H01L21/56

CPC分类号： H01L21/563 , H01L23/3121 , H01L23/49805 , H01L23/562 , H01L24/06 , H01L24/16 , H01L24/24 , H01L24/32 , H01L24/82 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16225 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/73203 , H01L2224/76155 , H01L2224/82102 , H01L2225/06517 , H01L2225/06551 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/3512 , H01L2924/00

摘要： Methods are disclosed for improving electrical interconnection in stacked die assemblies, and stacked die assemblies are disclosed having structural features formed by the methods. The resulting stacked die assemblies are characterized by having reduced electrical interconnect failure.

摘要翻译： 公开了用于改进堆叠模具组件中的电互连的方法，并且公开了具有通过该方法形成的结构特征的堆叠模具组件。所得到的堆叠的模具组件的特征在于具有减小的电互连故障。

4.

发明申请
Electrically Interconnected Stacked Die Assemblies 有权
标题翻译：电连接堆叠模具组件

公开(公告)号：US20110037159A1

公开(公告)日：2011-02-17

申请号：US12913604

申请日：2010-10-27

申请人： Simon J. S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

发明人： Simon J. S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

IPC分类号： H01L23/52

CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。在一些实施例中，导电迹线由导电聚合物形成。提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

5.

发明申请
ELECTRICALLY INTERCONNECTED STACKED DIE ASSEMBLIES 有权
标题翻译：电气互连堆叠式电池组件

公开(公告)号：US20080303131A1

公开(公告)日：2008-12-11

申请号：US12124077

申请日：2008-05-20

申请人： Simon J.S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

发明人： Simon J.S. McElrea , Lawrence Douglas Andrews, JR. , Scott McGrath , Terrence Caskey , Scott Jay Crane , Marc E. Robinson , Loreto Cantillep

IPC分类号： H01L23/02

CPC分类号： H01L25/50 , H01L24/24 , H01L24/25 , H01L24/82 , H01L25/0657 , H01L2224/24011 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/48091 , H01L2224/48095 , H01L2224/48145 , H01L2224/48465 , H01L2224/76155 , H01L2224/82102 , H01L2225/06524 , H01L2225/06551 , H01L2225/06555 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/00014 , H01L2924/00 , H01L2924/00012

摘要： In die stack assembly configurations successive die in the stack are offset at a die edge at which die pads are situated, and the die are interconnected by electrically conductive traces. In some embodiments the electrically conductive traces are formed of an electrically conductive polymer. An electrically insulative conformal coating is provided having openings at die pads that are electrically connected.

摘要翻译： 在堆叠组件配置中，堆叠中的连续裸片在芯片边缘处被偏移，在芯片边缘处设置芯片，并且芯片通过导电迹线互连。在一些实施例中，导电迹线由导电聚合物形成。提供了一种电绝缘保形涂层，其在电连接的管芯焊盘处具有开口。

6.

发明授权
Stacked die assembly having reduced stress electrical interconnects 有权
标题翻译：堆叠的模具组件具有减小的应力电互连

公开(公告)号：US08912661B2

公开(公告)日：2014-12-16

申请号：US12939524

申请日：2010-11-04

申请人： Scott McGrath , Jeffrey S. Leal , Ravi Shenoy , Loreto Cantillep , Simon McElrea , Suzette K. Pangrle

发明人： Scott McGrath , Jeffrey S. Leal , Ravi Shenoy , Loreto Cantillep , Simon McElrea , Suzette K. Pangrle

IPC分类号： H01L23/48 , H01L21/56 , H01L23/00 , H01L23/31 , H01L25/065 , H01L23/498

CPC分类号： H01L21/563 , H01L23/3121 , H01L23/49805 , H01L23/562 , H01L24/06 , H01L24/16 , H01L24/24 , H01L24/32 , H01L24/82 , H01L25/0657 , H01L2224/0401 , H01L2224/05553 , H01L2224/05554 , H01L2224/16225 , H01L2224/24011 , H01L2224/24051 , H01L2224/24145 , H01L2224/24226 , H01L2224/32145 , H01L2224/73203 , H01L2224/76155 , H01L2224/82102 , H01L2225/06517 , H01L2225/06551 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01047 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/351 , H01L2924/3512 , H01L2924/00

摘要： Methods are disclosed for improving electrical interconnection in stacked die assemblies, and stacked die assemblies are disclosed having structural features formed by the methods. The resulting stacked die assemblies are characterized by having reduced electrical interconnect failure.

摘要翻译： 公开了用于改进堆叠模具组件中的电互连的方法，并且公开了具有通过该方法形成的结构特征的堆叠模具组件。所得到的堆叠的模具组件的特征在于具有减小的电互连故障。

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