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    Sensor
    5.
    发明申请
    Sensor 审中-公开
    传感器

    公开(公告)号：US20100117224A1

    公开(公告)日：2010-05-13

    申请号：US12638870

    申请日：2009-12-15

    申请人： Simon J. S. McElrea ,  Marc E. Robinson

    发明人： Simon J. S. McElrea ,  Marc E. Robinson

    IPC分类号： H01L23/538 ,  H01L23/48 ,  H01L21/30 ,  H01L21/50

    CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L24/73 ,  H01L24/82 ,  H01L27/14636 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2924/00

    摘要： A sensor die in a sensor device includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some devices, a conformal dielectric coating over at least part of the active area of the front side of the die. The sensor die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. In some devices, a coating over the active area of the sensor die provides mechanical and chemical protection for underlying structures in and on the die. In an image sensor device, for example, the coating over the image sensor array on the die is substantially optically transparent. Also, a package contains such a sensor die mounted on and electrically connected to a support; and assemblies include such a sensor die and additional die mounted on and electrically connected to opposite sides of a support. Also, methods are disclosed for making the sensor die, devices, packages, and assemblies.

    摘要翻译： 传感器装置中的传感器管芯包括至少一个邻近互连边缘的管芯侧壁和在一些器件中在管芯前侧的至少一部分有源区域上的共形绝缘涂层的共形绝缘涂层。 传感器芯片可以通过可应用于可流动形式的导电材料（例如可固化导电聚合物）连接到支撑体中，该可固化导电聚合物被施加到模具侧壁上的电介质涂层上或附近，并被固化 以完成管芯上的互连焊盘和支撑电路上的暴露部位之间的连接。 在一些设备中，传感器管芯的有源区域上的涂层为模具中和模具上的底层结构提供机械和化学保护。 在图像传感器装置中，例如，模具上的图像传感器阵列上的涂层基本上是光学透明的。 另外，一个封装包含安装在支架上并与其电连接的传感器芯片; 并且组件包括这样的传感器管芯和安装在支撑件的相对侧并电连接到支撑件的相对侧的附加管芯。 此外，公开了用于制造传感器管芯，器件，封装和组件的方法。

    Image Sensor
    6.
    发明申请
    Image Sensor 审中-公开
    图像传感器

    公开(公告)号：US20100052087A1

    公开(公告)日：2010-03-04

    申请号：US12550012

    申请日：2009-08-28

    申请人： Simon J. S. McElrea ,  Marc E. Robinson

    发明人： Simon J. S. McElrea ,  Marc E. Robinson

    IPC分类号： H01L31/0203 ,  H01L31/0216 ,  H01L21/56

    CPC分类号： H01L27/14618 ,  H01L24/24 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

    摘要： An image sensor die includes a conformal dielectric coating over at least a die sidewall adjacent an interconnect edge and, in some embodiments, a conformal dielectric coating over the image array area of the front side of the die. The die can be connected to circuitry in a support by an electrically conductive material that is applicable in a flowable form, such as a curable electrically conductive polymer, which is applied onto or adjacent the dielectric coating on the die sidewall, and which is cured to complete connection between interconnect pads on the die and exposed sites on the support circuitry. The coating over the image array area, at least, is substantially transparent to visible light, and provides mechanical and chemical protection for underlying structures in and on the image sensor. Also, a package contains such an image sensor die mounted on and electrically connected to a support; and assemblies include such an image sensor die and additional die mounted on and electrically connected to opposite sides of a support. Also, methods are disclosed for making the image sensor die, packages, and assemblies.

    摘要翻译： 图像传感器管芯包括在邻近互连边缘的至少一个管芯侧壁上的保形电介质涂层，并且在一些实施例中，在管芯前侧的图像阵列区域上包括共形绝缘涂层。 模具可以通过可应用于可流动形式的导电材料（例如可固化导电聚合物）连接到支撑体中，该可固化导电聚合物施加到模具侧壁上的电介质涂层上或附近，并被固化至 芯片上的互连焊盘和支撑电路上的暴露部位之间的完整连接。 至少在图像阵列区域上的涂层对可见光基本上是透明的，并为图像传感器中和图像传感器上的底层结构提供机械和化学保护。 此外，包装包含安装在支撑件上并电连接到支撑件的图像传感器模具; 并且组件包括这样的图像传感器裸片和安装在支撑件的相对侧并且电连接到支撑件的相对侧的附加模具。 此外，公开了用于制造图像传感器管芯，封装和组件的方法。