公开(公告)号：US12119440B2

公开(公告)日：2024-10-15

申请号：US17130694

申请日：2020-12-22

申请人： LINTEC CORPORATION ,  Panasonic Corporation

发明人： Takeshi Ansai ,  Yuichi Kurata ,  Hajime Nishino ,  Tomoki Shiozaki ,  Kazuhiro Yoshii

IPC分类号： H01M10/0525 ,  C08K3/30 ,  C08K5/00 ,  C09J7/20 ,  C09J7/38 ,  C09J133/08 ,  H01M50/195 ,  H01M50/198

CPC分类号： H01M10/0525 ,  C08K5/0025 ,  C08K5/005 ,  C09J7/20 ,  C09J7/38 ,  C09J133/08 ,  H01M50/195 ,  H01M50/198 ,  C08K2003/3045 ,  C08K2201/003 ,  C08K2201/005 ,  C09J7/201 ,  C09J2203/33 ,  C09J2301/302 ,  C09J2301/408 ,  C09J2433/00 ,  C09J133/08 ,  C08K2003/3045

摘要： A pressure sensitive adhesive sheet for batteries, which includes a base material and a pressure sensitive adhesive layer provided on one surface side of the base material. The pressure sensitive adhesive layer contains inorganic fine particles having a water content of 0.4% or less in a single body.

公开(公告)号：US12114981B2

公开(公告)日：2024-10-15

申请号：US16972942

申请日：2019-05-28

申请人： LINTEC CORPORATION

发明人： Yoshiaki Hagihara ,  Shigeto Okuji

IPC分类号： A61B5/27 ,  A61B5/00 ,  A61B5/256 ,  D03D1/00 ,  D03D15/00 ,  D03D15/533 ,  D03D15/67 ,  D04B1/14 ,  H05K1/11 ,  H05K3/10

CPC分类号： A61B5/27 ,  A61B5/256 ,  D03D1/0088 ,  D03D15/00 ,  D03D15/533 ,  D03D15/67 ,  D04B1/14 ,  H05K1/11 ,  H05K3/103 ,  A61B5/6804 ,  A61B2562/0209 ,  D05D2303/40 ,  D10B2401/16 ,  D10B2403/02431

摘要： Disclosed is an electrode-wiring-equipped cloth material including: a cloth material main body; an electrode section which is provided on a surface of or inside the cloth material main body and contains a conductive linear body; a wiring section which is provided adjacent to the electrode section on the surface of or inside the cloth material main body and contains a conductive linear body, in which cloth material at least one conductive linear body contained in the electrode section and at least on conductive linear body contained in the wiring section are the same single conductive linear body.

公开(公告)号：US20240186565A1

公开(公告)日：2024-06-06

申请号：US18285176

申请日：2022-03-29

申请人： LINTEC Corporation

发明人： Sae HASHIMOTO ,  Takashi MORIOKA

IPC分类号： H01M10/056

CPC分类号： H01M10/056 ,  H01M2300/0028 ,  H01M2300/0071 ,  H01M2300/0091

摘要： A solid electrolyte contains: an electrolyte solution containing a lithium salt and a carbonate solvent; and metal oxide particles. In the solid electrolyte, the lithium salt is at least one selected from lithium-bis(fluorosulfonyl)imide and lithium borofluoride, the carbonate solvent is at least one selected from dimethyl carbonate and propylene carbonate, a molar ratio (lithium salt/carbonate solvent) of the lithium salt to the carbonate solvent is in a range from 1/4 to 1/1, a mass ratio (electrolyte solution/metal oxide particle) of the electrolyte solution to the metal oxide particles is in a range from 72/28 to 93/7, and a specific surface area of the metal oxide particles measured by a BET method is in a range from 160 m2/g to 700 m2/g.

公开(公告)号：US11974504B2

公开(公告)日：2024-04-30

申请号：US17786269

申请日：2020-12-01

申请人： LINTEC Corporation

发明人： Yuta Seki ,  Kunihisa Kato ,  Tsuyoshi Muto

IPC分类号： H10N10/857 ,  H10N10/01 ,  H10N10/17

CPC分类号： H10N10/857 ,  H10N10/01 ,  H10N10/17

摘要： Provided are: a thermoelectric conversion body that has high electrical conductivity, achieving high thermoelectric conversion efficiency when used in a thermoelectric conversion module, and is less susceptible to warpage during manufacture; a method for manufacturing the same; and a thermoelectric conversion module using the same. A thermoelectric conversion body that is a fired product of a composition containing a thermoelectric semiconductor material and a heat resistant resin, wherein, with the heat resistant resin being subjected to temperature elevation and a weight of the heat resistant resin at 400° C. being defined as 100%, a temperature at which the heat resistant resin undergoes a further 5% reduction in weight is 480° C. or lower; a thermoelectric conversion module including the thermoelectric conversion body; and a method for manufacturing the thermoelectric conversion body.

公开(公告)号：US20240123703A1

公开(公告)日：2024-04-18

申请号：US18264892

申请日：2022-01-27

申请人： LINTEC Corporation

发明人： Yoshiaki HAGIHARA

IPC分类号： B32B5/06 ,  B32B5/02 ,  B32B5/26 ,  B32B37/18 ,  B32B38/08

CPC分类号： B32B5/073 ,  B32B5/024 ,  B32B5/263 ,  B32B37/18 ,  B32B38/08 ,  B32B2038/008 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/106 ,  B32B2305/076 ,  B32B2307/54 ,  B32B2313/04

摘要： A carbon fiber reinforced plastic includes: a base portion including a plurality of stacked carbon fiber layers including carbon fibers arranged at least in a single direction; a resin with which the base portion is impregnated; and a carbon yarn, in which the carbon yarn penetrates the plurality of carbon fiber layers.

公开(公告)号：US20240002711A1

公开(公告)日：2024-01-04

申请号：US18039893

申请日：2021-11-30

申请人： LINTEC CORPORATION

发明人： Naoki TAYA ,  Koji TSUCHIBUCHI

IPC分类号： C09J201/00 ,  C09J11/04

CPC分类号： C09J201/00 ,  C09J11/04 ,  C09J2301/312 ,  C09J2301/304 ,  C09J2301/50

摘要： A high-frequency-dielectric-heating adhesive for bonding three or more adherends to each other is provided. A dielectric property DP1 of the adhesive and a dielectric property DP2 of each of the adherends satisfy a numerical formula (Numerical Formula 1). The adherends are each an adherend having no flow start temperature or an adherend having the flow start temperature. A flow start temperature TF2 (degrees C.) of the adherends and a flow start temperature TF1 (degrees C.) of the adhesive satisfy a numerical formula (Numerical Formula 2). The dielectric properties DP1, DP2 are defined by values of dielectric properties (tan δ/ε′r), where tan δ and ε′r are respectively a dielectric dissipation factor and a relative permittivity at 23 degrees C. and a frequency of 40.68 MHz,


0

公开(公告)号：US20230413389A1

公开(公告)日：2023-12-21

申请号：US18035251

申请日：2021-11-05

申请人： LINTEC CORPORATION

发明人： Go ONISHI ,  Takuya OSHIMA ,  Yasunao MIYAZAWA

IPC分类号： H05B3/34 ,  H05B3/03 ,  H05B3/10

CPC分类号： H05B3/34 ,  H05B3/10 ,  H05B3/03

摘要： A wiring sheet includes: a pseudo sheet structure including a plurality of conductive linear bodies arranged at intervals; a pair of electrodes; and a first power feeder provided for one of the electrodes and a second power feeder provided for the other of the electrodes, in which provided that the number of the conductive linear bodies is N, a resistance value of each conductive linear body is r, a resistance value of each electrode is R, a resistance value of each electrode between the n-th conductive linear body and the (n−1)th conductive linear body counted from a side at which the first power feeder and the second power feeder are provided is Rn, the wiring sheet satisfies all conditions represented by numerical formulae (F1) to (F3) below,


r/R≤300  (F1)



Rn≤Rn−1  (F2)



where n is an integer of 2 or more,



0

公开(公告)号：US11781033B2

公开(公告)日：2023-10-10

申请号：US17575811

申请日：2022-01-14

申请人： LINTEC Corporation

发明人： Masanori Yamagishi ,  Akinori Sato

IPC分类号： C09D133/04 ,  C09J163/00 ,  C09J7/20 ,  C09J7/30 ,  C09J4/06 ,  C09J7/25 ,  C09J7/38 ,  C08L63/00 ,  H01L23/00 ,  C09J133/00 ,  C08L33/00

CPC分类号： C09D133/04 ,  C08L63/00 ,  C09J4/06 ,  C09J7/20 ,  C09J7/25 ,  C09J7/30 ,  C09J7/38 ,  C09J163/00 ,  H01L24/26 ,  C08L33/00 ,  C08L2203/16 ,  C08L2203/20 ,  C09J133/00 ,  C09J2203/326 ,  C09J2433/00 ,  C09J2463/00 ,  H01L2224/11 ,  H01L2224/11515 ,  C09D133/04 ,  C08L63/00

摘要： A curable resin film of the present invention forms a first protective film (1a) by attaching the curable resin film containing an epoxy-based thermosetting component having a weight-average molecular weight of 200 to 4,000 to a surface (5a) of a semiconductor wafer (5) having a plurality of bumps (51) with an average peak height (h1) of 50 to 400 μm, an average diameter of 60 to 500 μm, and an average pitch of 100 to 800 μm, heating the attached curable resin film at 100° C. to 200° C. for 0.5 to 3 hours, and curing the heated curable resin film, and when longitudinal sections thereof are observed by a scanning electron microscope, a ratio (h3/h1) of an average thickness (h3) of the first protective film (1a) at a center position between the bumps (51) to an average peak height (h1) of the bumps (51), and a ratio (h2/h1) of an average thickness (h2) of the first protective film (1a) at a position being in contact with the plurality of bumps (51) to the average peak height (h1) satisfy a relationship represented by the following expression of [{(h2/h1)−(h3/h1)}≤0.1].

公开(公告)号：US11760854B2

公开(公告)日：2023-09-19

申请号：US15316034

申请日：2015-06-02

申请人： LINTEC CORPORATION

发明人： Toshifumi Mimura ,  Yuuta Suzuki ,  Satoshi Naganawa

IPC分类号： C08J7/048 ,  C23C14/08 ,  B05D1/00 ,  C08J7/04 ,  C08J7/043 ,  B05D5/00 ,  B05D7/04 ,  B05D7/00 ,  C23C14/00

CPC分类号： C08J7/048 ,  B05D1/60 ,  B05D1/62 ,  B05D5/00 ,  B05D7/04 ,  B05D7/51 ,  C08J7/043 ,  C08J7/0427 ,  C23C14/0036 ,  C23C14/086 ,  C08J2383/16

摘要： The present invention is a gas barrier laminate comprising a base unit that comprises a base and a modification-promoting layer, and a gas barrier layer that is formed on a side of the modification-promoting layer with respect to the base unit,



the modification-promoting layer having a modulus of elasticity at 23° C. of less than 30 GPa,
the base unit having a water vapor transmission rate at a temperature of 40° C. and a relative humidity of 90% of 1.0 g/(m2·day) or less, and
the gas barrier layer being a layer formed by applying a modification treatment to a surface of a layer that comprises a polysilazane-based compound and is formed on the side of the modification-promoting layer with respect to the base unit, and
a method for producing the gas barrier laminat, and
an electronic device member comprising the gas barrier laminate, and
an electronic device comprising the electronic device member.

公开(公告)号：US20230272247A1

公开(公告)日：2023-08-31

申请号：US17910119

申请日：2020-12-02

申请人： LINTEC CORPORATION

发明人： Yoichi TAKAHASHI ,  Sho KOSABA ,  Yuka FUJII

IPC分类号： C09J7/38 ,  C09J7/10 ,  C09J11/06

CPC分类号： C09J7/385 ,  C09J7/10 ,  C09J11/06 ,  C09J2203/354 ,  C09J2301/312 ,  C09J2301/416

摘要： An adhesive sheet (1) comprising an adhesive layer (11) composed of an adhesive having active energy ray curability and ultraviolet ray absorbability, wherein when one surface of the adhesive layer (11) is irradiated with ultraviolet rays having a light amount of 2000 mJ/cm2 to cure the adhesive layer (11) and an infrared absorption spectrum is then measured by a total reflection measurement method for each of an irradiated surface and a non-irradiated surface, the maximum value of the absolute value of absorbance is 0.0001 to 0.012 within a wavenumber range of 700 to 1000 cm−1 in a difference spectrum obtained by subtracting the infrared absorption spectrum of the non-irradiated surface from the infrared absorption spectrum of the irradiated surface, and when the adhesive layer (11) is irradiated with ultraviolet rays having a light amount of 2000 mJ/cm2 to cure the adhesive layer (11), the difference in a gel fraction of the adhesive constituting the adhesive layer (11) before and after the irradiation is 5 points or more and 50 points or less. According to such an adhesive sheet (1), both the light resistance and the blister resistance can be achieved satisfactorily.