Semiconductor integrated circuit device, electronic apparatus, and charging controller for secondary battery
    1.
    发明授权
    Semiconductor integrated circuit device, electronic apparatus, and charging controller for secondary battery 有权
    半导体集成电路器件,电子设备和二次电池充电控制器

    公开(公告)号:US08860376B2

    公开(公告)日:2014-10-14

    申请号:US12664125

    申请日:2008-07-02

    IPC分类号: H02J7/04 H01M10/44 H02J7/00

    摘要: A charging control circuit for a secondary battery includes a temperature detection terminal for detecting the temperature of a secondary battery from an input detected voltage; a temperature comparison part having four threshold voltages corresponding to four reference temperatures, the temperature comparison part being configured to compare the four threshold voltages with the detected voltage input to the temperature detection terminal and to output a temperature range signal indicating the temperature range of the detected voltage; and a control part configured to control a charging current and/or a charging voltage based on the temperature range signal output from the temperature comparison part.

    摘要翻译: 二次电池的充电控制电路包括:温度检测端子,用于从输入检测电压检测二次电池的温度; 温度比较部分具有对应于四个参考温度的四个阈值电压,所述温度比较部分被配置为将四个阈值电压与输入到温度检测端子的检测电压进行比较,并输出指示检测到的温度范围的温度范围信号 电压; 以及控制部,被配置为基于从所述温度比较部输出的温度范围信号来控制充电电流和/或充电电压。

    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
    2.
    发明授权
    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body 有权
    半导体晶片处理带卷绕体,半导体晶片加工带贴附装置以及半导体晶片加工带卷绕体的半导体晶片处理装置

    公开(公告)号:US08392011B2

    公开(公告)日:2013-03-05

    申请号:US11476382

    申请日:2006-06-28

    CPC分类号: H01L21/67294

    摘要: A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

    摘要翻译: 提供半导体晶片处理带贴附装置,并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上,该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括:馈送装置,其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置,用于根据由磁带数据读/写装置读取的处理数据,将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。

    Current source circuit and delay circuit and oscillating circuit using the same
    3.
    发明授权
    Current source circuit and delay circuit and oscillating circuit using the same 有权
    电流源电路和延迟电路与使用振荡电路相同

    公开(公告)号:US08248176B2

    公开(公告)日:2012-08-21

    申请号:US12962698

    申请日:2010-12-08

    IPC分类号: H03L5/00 G01J5/00

    摘要: A disclosed current source circuit includes a current mirror circuit having two enhancement-type MOS transistors, a depletion-type MOS transistor configured to be connected to a drain of one of the two enhancement-type MOS transistors and to function as a constant current source, and a resistor configured to have a negative temperature property and be connected to a source of the one of the two enhancement-type MOS transistors.

    摘要翻译: 所公开的电流源电路包括具有两个增强型MOS晶体管的电流镜电路,耗尽型MOS晶体管被配置为连接到两个增强型MOS晶体管之一的漏极并用作恒流源, 以及被配置为具有负温度特性并连接到两个增强型MOS晶体管中的一个的源极的电阻器。

    Varistor
    4.
    发明授权
    Varistor 有权
    压敏电阻

    公开(公告)号:US08044761B2

    公开(公告)日:2011-10-25

    申请号:US12337081

    申请日:2008-12-17

    IPC分类号: H01C7/10

    CPC分类号: H01C7/112 H01C7/102 H01C7/105

    摘要: A varistor 1 comprises a varistor element 10, a pair of external electrodes 30a, 30b on one main side of the varistor element 10 and a resistor 60 on the same main side, wherein the resistor 60 is formed so as to connect the pair of external electrodes 30a, 30b. The varistor element 10 contains zinc oxide as the main component and Ca oxides, Si oxides and rare earth metal oxides as accessory components, wherein the proportion X of the calcium oxides in terms of calcium atoms is 2-80 atomic percent with respect to 100 mol of the main component and the proportion Y of the silicon oxides in terms of silicon atoms is 1-40 atomic percent with respect to 100 mol of the main component, X/Y satisfying formula (1) below, and the external electrodes and resistor contain oxides other than bismuth oxide and copper oxide 1≦X/Y

    摘要翻译: 变阻器1包括变阻器元件10,在可变电阻元件10的一个主侧上的一对外部电极30a,30b和同一主面上的电阻器60,其中电阻器60形成为连接一对外部电阻 电极30a,30b。 变阻器元件10包含氧化锌作为主要成分,以Ca氧化物,Si氧化物和稀土金属氧化物为辅助成分,其中,钙原子的氧化钙的比例X相对于100摩尔为2-80原子% ,硅原子的比例Y相对于主成分100摩尔为1〜40原子%,满足下式(1)的X / Y,外部电极和电阻含有 氧化铋和氧化铜以外的氧化物1&nlE; X / Y <3(1)。

    Perfluoropolyether-organopolysiloxane copolymer and a surface treatment composition comprising the same
    5.
    发明授权
    Perfluoropolyether-organopolysiloxane copolymer and a surface treatment composition comprising the same 有权
    全氟聚醚 - 有机聚硅氧烷共聚物和包含其的表面处理组合物

    公开(公告)号:US08022161B2

    公开(公告)日:2011-09-20

    申请号:US11898013

    申请日:2007-09-07

    IPC分类号: C08G77/46

    摘要: A perfluoropolyether-polyorganosiloxane copolymer comprising at least one perfluoropolyether block, at least one polyorganosiloxane block which may has a silalkylene group, and two monovalent groups represented by the following formula (1), each one at both ends of the copolymer, wherein X is a hydrolyzable group, R1 is an alkyl group having 1 to 4 carbon atoms or a phenyl group, y is an integer of from 1 to 5, and a is an integer of 2 or 3, said copolymer having a number average molecular weight, reduced to polystyrene, of from 7,000 to 25,000.

    摘要翻译: 包含至少一个全氟聚醚嵌段,至少一个可具有亚硅烷基的聚有机硅氧烷嵌段和由下式(1)表示的两个一价基团的全氟聚醚 - 聚有机硅氧烷共聚物,其中X是一个 可水解基团,R 1为具有1〜4个碳原子的烷基或苯基,y为1〜5的整数,a为2或3的整数,所述共聚物的数均分子量为 聚苯乙烯,从7000到25,000。

    Portable electronic apparatus with improved audio quality through a curved and sloped surface of a housing
    6.
    发明授权
    Portable electronic apparatus with improved audio quality through a curved and sloped surface of a housing 有权
    通过壳体的弯曲和倾斜的表面具有改善的音频质量的便携式电子设备

    公开(公告)号:US07746627B2

    公开(公告)日:2010-06-29

    申请号:US12489899

    申请日:2009-06-23

    IPC分类号: H05K5/00 G06F1/16

    CPC分类号: G06F1/1688 G06F1/1616

    摘要: A portable electronic apparatus includes a housing and an output device configured to output sound. The output device is disposed on a surface on an inside of a slope disposed on a lower surface of the housing, the slope resulting in the housing being opened in a predetermined direction. The slope forms a space between the slope and a mounting surface on which the housing is placed. The surface on the inside of the slope includes a curved surface. The curved surface may be concavely curved relative to the bottom surface of the housing. The electronic apparatus may also include an input device, and the output device may be disposed on a side forward of the input device.

    摘要翻译: 便携式电子设备包括壳体和被配置为输出声音的输出装置。 输出装置设置在设置在壳体的下表面上的斜面的内侧上的表面上,导致壳体沿预定方向打开。 斜坡在斜坡和安装表面之间形成一个空间,在该安装表面上放置了外壳。 斜坡内侧的表面包括一个曲面。 弯曲表面可以相对于壳体的底表面凹入弯曲。 电子设备还可以包括输入设备,并且输出设备可以设置在输入设备的前方的一侧。

    PERFLUOROPOLYETHER-MODIFIED POLYSILAZANE AND SURFACE TREATMENT AGENT USING SAME
    7.
    发明申请
    PERFLUOROPOLYETHER-MODIFIED POLYSILAZANE AND SURFACE TREATMENT AGENT USING SAME 审中-公开
    全氟代改性聚异氰酸酯和表面处理剂

    公开(公告)号:US20100015453A1

    公开(公告)日:2010-01-21

    申请号:US12504092

    申请日:2009-07-16

    IPC分类号: B32B17/06 C07F7/02 C09D4/00

    摘要: A perfluoropolyether-modified polysilazane is provided. The polysilazane consists of units having formula (1): F(CxF2xO)mCyF2y-Q-Si(NH)1.5   (1) wherein Q represents a divalent organic group, m represents an integer of 1 or greater, and x and y each represents an integer of 1 to 3. The polysilazane can be cured at normal temperatures, forms a tough coating on a substrate surface without application of a primer, and is useful as a surface treatment agent that is capable of maintaining water and oil repellency and releasability and the like, over a long period of time.

    摘要翻译: 提供全氟聚醚改性的聚硅氮烷。 聚硅氮烷由具有式(1)的单元组成:F(C x F 2 x O)m C y F 2y-Q-Si(NH)1.5(1)其中Q表示二价有机基团,m表示1或更大的整数,x和y各自表示 聚硅氮烷可以在正常温度下固化,在基材表面上形成坚韧的涂层,而不用底漆,并且可用作能够保持拒水拒油性和脱模性的表面处理剂, 喜欢,很长一段时间。

    Fuel reforming system
    8.
    发明授权
    Fuel reforming system 失效
    燃料重整系统

    公开(公告)号:US07547333B2

    公开(公告)日:2009-06-16

    申请号:US10554906

    申请日:2004-08-03

    摘要: In a fuel reforming system (32) of a fuel cell system (1), which includes a reformer (7) generating hydrogen-containing gas to be an electromotive fuel and a combustor (6) generating combustion gas, the combustor (6) has two combustion parts including a main combustion part (20) and a sub-combustion part (18), a fuel pre-vaporization part (19) between the two combustion parts and a main fuel injection valve (16) and a sub-fuel injection valve (15) which supply the fuel to the respective combustion parts. In start-up of the fuel cell system (1), predetermined amounts of fuel and air for generating heat quantity required in the fuel pre-vaporization part (19) are subjected to lean combustion in the sub-combustion part (18), the fuel to be combusted in the main combustion part (20) is pre-vaporized in the fuel pre-vaporization part (19) by use of the combustion gas from the sub-combustion part (18), and the pre-vaporized fuel obtained by the pre-vaporization and air are subjected to premixed lean combustion in the main combustion part (20).

    摘要翻译: 在燃料电池系统(1)的燃料重整系统(32)中,包括产生作为电动燃料的含氢气体的重整器(7)和产生燃烧气体的燃烧器(6),所述燃烧器(6)具有 包括主燃烧部分(20)和副燃烧部分(18)的两个燃烧部分,两个燃烧部分之间的燃料预蒸发部分(19)和主燃料喷射阀(16)和副燃料喷射 将燃料供应到各个燃烧部分的阀(15)。 在燃料电池系统(1)的启动中,在副燃烧部(18)中对燃料预汽化部(19)中所需的用于产生热量的预定量的燃料和空气进行稀薄燃烧, 在主燃烧部分(20)中燃烧的燃料通过使用来自副燃烧部分(18)的燃烧气体在燃料预蒸发部分(19)中预蒸发,并且由 预燃气和空气在主燃烧部分(20)中经受预混稀燃燃烧。

    Diluent for a flourine-containing silicone coating agent
    9.
    发明申请
    Diluent for a flourine-containing silicone coating agent 失效
    稀释剂含有含氟硅氧烷涂层剂

    公开(公告)号:US20080257217A1

    公开(公告)日:2008-10-23

    申请号:US12003161

    申请日:2007-12-20

    IPC分类号: C09D143/04

    摘要: A diluent for a fluorine-containing silicone coating agent, said diluent comprising (A) at least one selected from diisopropyl ether and hexane, and (B) a fluorinated solvent having a boiling point, at atmospheric pressure, which is higher than that of the component (A) by at least 30° C. and is 180° C. or lower, with a weight ratio of the component (A) to the component (B) ranging from 95/5 to 50/50.

    摘要翻译: 一种含氟硅氧烷涂层剂的稀释剂,所述稀释剂包含(A)选自二异丙醚和己烷中的至少一种,和(B)在大气压下具有沸点的氟化溶剂,其高于 组分(A)至少30℃并且为180℃或更低,组分(A)与组分(B)的重量比为95/5至50/50。

    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body
    10.
    发明申请
    Semiconductor wafer processing tape winding body, semiconductor wafer processing tape sticking apparatus and semiconductor wafer processing apparatus that use the semiconductor wafer processing tape winding body 有权
    半导体晶片处理带卷绕体,半导体晶片加工带贴附装置以及半导体晶片加工带卷绕体的半导体晶片处理装置

    公开(公告)号:US20070162175A1

    公开(公告)日:2007-07-12

    申请号:US11476382

    申请日:2006-06-28

    IPC分类号: G06F19/00

    CPC分类号: H01L21/67294

    摘要: A semiconductor wafer processing tape sticking apparatus is provided and is capable of sticking a semiconductor wafer processing tape to a semiconductor wafer under the optimum conditions based on the processing data that has been written to a data carrier member and that has been read from the data carrier member without accessing the host computer unlike a conventional method. The semiconductor wafer processing tape sticking apparatus includes: a feeding apparatus provided with a feeding shaft to which a semiconductor wafer processing tape winding body can be detachably attached; a tape data read/write device for reading and writing the processing data that has been written to a data carrier member of the semiconductor wafer processing tape winding body; and a tape sticking apparatus for sticking a semiconductor wafer processing tape that has been fed out from the feeding apparatus to the semiconductor wafer based on the processing data that has been read by the tape data read/write device.

    摘要翻译: 提供半导体晶片处理带贴附装置,并且能够在最佳条件下将半导体晶片处理带粘贴到半导体晶片处理带上,该条件基于已经写入数据载体成员并从数据载体读取的处理数据 不像常规方法那样访问主机。 半导体晶片处理带贴附装置包括:馈送装置,其具有可以可拆卸地安装半导体晶片加工带卷绕体的馈送轴; 用于读取和写入已经写入到半导体晶片处理带卷绕体的数据载体构件的处理数据的磁带数据读/写装置; 以及胶带粘贴装置,用于根据由磁带数据读/写装置读取的处理数据,将从馈送装置输出的半导体晶片处理带粘贴到半导体晶片。