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Patent Agency Ranking
1.发明申请LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS 审中-公开印刷电路板表面安装组件的低剖面焊盘阵列技术公开(公告)号：US20120224331A1
公开(公告)日：2012-09-06
申请号：US13473847
申请日：2012-05-17
Applicant: Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
Inventor： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
IPC: H05K7/00
CPC classification number: H05K3/3484 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H05K3/3436 , H05K3/3463 , H05K2201/10719 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/00 , H01L2224/05599
Abstract: A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
Abstract translation: 间隔接触阵列设置在倒装芯片封装的安装基板和基板之间。 通过将安装基板上的低轮廓焊料凸块与板上的低轮廓焊膏配合，可以形成对位接触阵列。 此后，通过将板上的低轮廓焊膏回流到安装基板上的低轮廓焊料凸块上来形成间隔接触阵列。
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公开(公告)号：US10305529B2
公开(公告)日：2019-05-28
申请号：US15021511
申请日：2013-12-26
Applicant: David Pidwerbecki , Mark Gallina , Mark Hemmeyer , Steven Lofland , Ponniah Ilavarasan , Michael Stewart , Kevin Byrd
Inventor： David Pidwerbecki , Mark Gallina , Mark Hemmeyer , Steven Lofland , Ponniah Ilavarasan , Michael Stewart , Kevin Byrd
IPC: H04B1/3888 , H05K3/28 , H05K1/02 , H05K1/03 , G06F1/16 , G06F1/18 , G06F1/20 , H04M1/02 , H04M1/18
Abstract: Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
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3.发明申请USING MATERIALS TO INCREASE STRUCTURAL RIGIDITY, DECREASE SIZE, IMPROVE SAFETY, ENHANCE THERMAL PERFORMANCE AND SPEED CHARGING IN SMALL FORM FACTOR DEVICES 审中-公开使用材料增加结构刚度，减小尺寸，提高安全性，提高小型表面因素设备中的热性能和速度充电公开(公告)号：US20160269067A1
公开(公告)日：2016-09-15
申请号：US15021511
申请日：2013-12-26
Applicant: David PIDWERBECKI , Mark GALLINA , Mark HEMMEYER , Steven LOFLAND , Ponniah ILAVARASAN , Michael STEWART , Kevin BYRD
Inventor： David Pidwerbecki , Mark Gallina , Mark Hemmeyer , Steven Lofland , Ponniah Ilavarasan , Michael Stewart , Kevin Byrd
CPC classification number: H04B1/3888 , G06F1/1626 , G06F1/1658 , G06F1/18 , G06F1/182 , G06F1/203 , H04M1/0202 , H04M1/026 , H04M1/0262 , H04M1/0277 , H04M1/185 , H05K1/0256 , H05K1/0373 , H05K3/284 , H05K2203/1327
Abstract: Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.
Abstract translation: 系统和方法可以提供包括壳体，定位在壳体内的一个或多个电子部件和定位在壳体内的第一固化树脂组合物的装置，第一固化树脂组合物包括热能储存材料和第一填充材料。 该装置还可以包括定位在壳体内的第二固化树脂组合物，第二固化树脂组合物包括热能储存材料和第二填料。 第一填充材料和第二填充材料可以不同，其中第一固化树脂组合物和第二固化树脂组合物可以包含一种或多种电子部件中的至少一种。 在其他示例中，电子元件包括电源，该设备符合爆炸性环境的ATEX设备指令。 此外，可以使用组件底部填充和/或组装过模制过程来制造该装置。
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4.发明申请Surface Mount Components Joined Between a Package Substrate and a Printed Circuit Board 审中-公开在封装基板和印刷电路板之间连接的表面贴装元件公开(公告)号：US20090051004A1
公开(公告)日：2009-02-26
申请号：US11844672
申请日：2007-08-24
Applicant: Weston C. Roth , James D. Jackson , Damion Searls , Kevin Byrd
Inventor： Weston C. Roth , James D. Jackson , Damion Searls , Kevin Byrd
CPC classification number: H01L23/49816 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/15311 , H05K1/0231 , H05K1/145 , H05K3/3436 , H05K2201/094 , H05K2201/10242 , H05K2201/10515 , H05K2201/1053 , H05K2201/10636 , H05K2201/10734 , Y02P70/611 , Y02P70/613 , H01L2924/00
Abstract: A microelectronic package and a method of forming the package. The package includes a first level package mounted to a carrier. The first level package includes a package substrate having a die side and a carrier side; and a microelectronic die mounted on the package substrate at the die side thereof. The carrier has a substrate side, and the first level package is mounted on the carrier at the substrate side thereof. A rigid body is attached to the carrier side of the substrate at an attachment location of the substrate and to the substrate side of the carrier at an attachment location of the carrier, the attachment location of the carrier being electrically unconnected, the rigid body being configured and disposed to provide structural support between the substrate and the carrier.
Abstract translation: 微电子封装和形成封装的方法。 该包装包括安装在载体上的第一级封装。 第一级封装包括具有裸片侧和载体侧的封装基板; 以及在其芯片侧安装在封装基板上的微电子管芯。 载体具有基板侧，并且第一级封装在其基板侧安装在载体上。 刚性体在基板的安装位置和载体的安装位置处附着到基板的载体侧，载体的附接位置电连接，刚体被构造成 并设置成在基板和载体之间提供结构支撑。
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5.发明申请Low profile solder grid array technology for printed circuit board surface mount components 审中-公开薄型焊料阵列技术用于印刷电路板表面贴装元件公开(公告)号：US20090310320A1
公开(公告)日：2009-12-17
申请号：US12214006
申请日：2008-06-16
Applicant: Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
Inventor： Weston Roth , Kevin Byrd , Damion Searls , James D. Jackson
CPC classification number: H05K3/3484 , H01L2224/05571 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/73204 , H01L2924/00014 , H01L2924/01322 , H01L2924/01327 , H01L2924/15311 , H05K3/3436 , H05K3/3463 , H05K2201/10719 , H05K2201/10992 , H05K2203/043 , Y02P70/613 , H01L2924/00 , H01L2224/05599
Abstract: A standoff contact array is disposed between a mounting substrate of a flip-chip package and a board. The standoff contact array is formable by mating a low-profile solder bump on the mounting substrate with a low-profile solder paste on the board. Thereafter, the standoff contact array is formed by reflowing the low-profile solder paste on the board against the low-profile solder bump on the mounting substrate.
Abstract translation: 间隔接触阵列设置在倒装芯片封装的安装基板和基板之间。 通过将安装基板上的低轮廓焊料凸块与板上的低轮廓焊膏配合，可以形成对位接触阵列。 此后，通过将板上的低轮廓焊膏回流到安装基板上的低轮廓焊料凸块上来形成间隔接触阵列。
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