公开(公告)号：US06483702B1

公开(公告)日：2002-11-19

申请号：US09225417

申请日：1999-01-05

Applicant: Steven Lofland

Inventor： Steven Lofland

IPC: H05K720

CPC classification number: G11C5/143 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K7/20509 ,  H01L2924/00

Abstract: An electronic card that includes an integrated circuit which is coupled to a substrate. The substrate is located between two thermally conductive covers. The assembly may further include a fastener that attaches the covers. Alternatively, the covers may be crimped or welded together. As another alternative embodiment the covers may be bonded to integrated circuit located on opposite sides of the substrate.

Abstract translation: 一种电子卡，包括耦合到基板的集成电路。 衬底位于两个导热罩之间。 组件还可以包括附接盖的紧固件。 或者，盖可以卷曲或焊接在一起。 作为另一替代实施例，盖可以结合到位于基板的相对侧上的集成电路。

公开(公告)号：US10305529B2

公开(公告)日：2019-05-28

申请号：US15021511

申请日：2013-12-26

Applicant: David Pidwerbecki ,  Mark Gallina ,  Mark Hemmeyer ,  Steven Lofland ,  Ponniah Ilavarasan ,  Michael Stewart ,  Kevin Byrd

Inventor： David Pidwerbecki ,  Mark Gallina ,  Mark Hemmeyer ,  Steven Lofland ,  Ponniah Ilavarasan ,  Michael Stewart ,  Kevin Byrd

IPC: H04B1/3888 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03 ,  G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H04M1/02 ,  H04M1/18

Abstract: Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.

公开(公告)号：US20160269067A1

公开(公告)日：2016-09-15

申请号：US15021511

申请日：2013-12-26

Applicant: David PIDWERBECKI ,  Mark GALLINA ,  Mark HEMMEYER ,  Steven LOFLAND ,  Ponniah ILAVARASAN ,  Michael STEWART ,  Kevin BYRD

Inventor： David Pidwerbecki ,  Mark Gallina ,  Mark Hemmeyer ,  Steven Lofland ,  Ponniah Ilavarasan ,  Michael Stewart ,  Kevin Byrd

IPC: H04B1/3888 ,  H05K3/28 ,  H05K1/02 ,  H05K1/03 ,  G06F1/16 ,  G06F1/18

CPC classification number: H04B1/3888 ,  G06F1/1626 ,  G06F1/1658 ,  G06F1/18 ,  G06F1/182 ,  G06F1/203 ,  H04M1/0202 ,  H04M1/026 ,  H04M1/0262 ,  H04M1/0277 ,  H04M1/185 ,  H05K1/0256 ,  H05K1/0373 ,  H05K3/284 ,  H05K2203/1327

Abstract: Systems and methods may provide for a device including a housing, one or more electronic components positioned within the housing, and a first cured resin composition positioned within the housing, the first cured resin composition including a thermal energy storage material and a first filler material. The device may also include a second cured resin composition positioned within the housing, the second cured resin composition including the thermal energy storage material and a second filler material. The first filler material and the second filler material may be different, wherein the first cured resin composition and the second cured resin composition may encompass at least one of the one or more electronic components. In other examples, the electronic components include a power supply and the device complies with an ATEX equipment directive for explosive atmospheres. Moreover, component underfill and/or assembly overmold processes may be used to fabricate the device.

Abstract translation: 系统和方法可以提供包括壳体，定位在壳体内的一个或多个电子部件和定位在壳体内的第一固化树脂组合物的装置，第一固化树脂组合物包括热能储存材料和第一填充材料。 该装置还可以包括定位在壳体内的第二固化树脂组合物，第二固化树脂组合物包括热能储存材料和第二填料。 第一填充材料和第二填充材料可以不同，其中第一固化树脂组合物和第二固化树脂组合物可以包含一种或多种电子部件中的至少一种。 在其他示例中，电子元件包括电源，该设备符合爆炸性环境的ATEX设备指令。 此外，可以使用组件底部填充和/或组装过模制过程来制造该装置。

公开(公告)号：US20150043161A1

公开(公告)日：2015-02-12

申请号：US14125654

申请日：2013-08-10

Applicant: Daryl Nelson ,  Kevin Daniel ,  Daniel Chiang ,  Mark Gallina ,  Steven Lofland

Inventor： Daryl Nelson ,  Kevin Daniel ,  Daniel Chiang ,  Mark Gallina ,  Steven Lofland

IPC: G06F1/20

CPC classification number: G06F1/206 ,  G06F1/203 ,  G06F2200/201

Abstract: Mobile platforms and methods may provide for an integrated circuit such as a system on chip (SoC), a first heat spreader thermally coupled to the integrated circuit and a phase change material configuration thermally coupled to the first heat spreader. The integrated circuit may include logic to operate the integrated circuit in a performance burst mode according to a duty cycle, wherein the performance burst mode causes a phase change material to enter a liquid state within a graphite matrix of the phase change material configuration.

Abstract translation: 移动平台和方法可以提供诸如片上系统（SoC）的集成电路，热耦合到集成电路的第一散热器和热耦合到第一散热器的相变材料配置。 集成电路可以包括根据占空比以性能突发模式操作集成电路的逻辑，其中性能突发模式导致相变材料在相变材料配置的石墨矩阵内进入液态。