公开(公告)号：US12187919B2

公开(公告)日：2025-01-07

申请号：US17552932

申请日：2021-12-16

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook Hwang ,  Hyun Goo Kong ,  Yun Su Kim

IPC: C09G1/02 ,  B82Y40/00 ,  H01L21/304

Abstract: A polishing slurry composition is provided. The polishing slurry composition includes polishing particles, a first polishing inhibitor containing a hydrophobic amino acid, and a second polishing inhibitor containing a cyclic polymer, and the first polishing inhibitor and the second polishing inhibitor are different.

公开(公告)号：US11883857B2

公开(公告)日：2024-01-30

申请号：US17505185

申请日：2021-10-19

Applicant: KCTECH CO., LTD.

Inventor： Hyung Chul Kim ,  You Sun Jung

IPC: B08B3/02 ,  B08B5/04

CPC classification number: B08B3/02 ,  B08B5/04 ,  B08B2203/0282

Abstract: A cleaning solution detection device includes a transfer part configured to unload and transfer a substrate having a surface to which a cleaning solution is applied when a cleaning process is completed, a detector configured to detect the cleaning solution that falls from the surface of the substrate in a process in which the substrate is unloaded and transferred by the transfer part, and a controller configured to determine whether a dangerous situation occurs due to a fall of the cleaning solution based on information detected by the detector.

公开(公告)号：US20230402297A1

公开(公告)日：2023-12-14

申请号：US18131099

申请日：2023-04-05

Applicant: KCTECH CO., LTD.

Inventor： Hyung Chul KIM ,  You Sun JUNG ,  Dong Min KIM

IPC: H01L21/67 ,  H01L21/687

CPC classification number: H01L21/67034 ,  H01L21/68785

Abstract: A substrate processing apparatus is disclosed. The substrate processing apparatus includes a chamber having a processing space in which substrate processing is performed therein, one or more exhaust lines connected to the chamber and configured to discharge a processing fluid from the processing space to an outside of the chamber, a supporting chuck disposed in the processing space, configured to support the substrate from below so that the substrate is disposed on an upper portion of the supporting chuck, and having an inner space configured to accommodate a first processing fluid, and one or more first supply lines configured to receive the first processing fluid from the outside of the chamber and transfer the first processing fluid to the inner space of the supporting chuck. In addition, various embodiments may be possible.

公开(公告)号：US20230271228A1

公开(公告)日：2023-08-31

申请号：US18112398

申请日：2023-02-21

Applicant: KCTECH CO., LTD.

Inventor： Geun Sik YOON

IPC: B08B3/02 ,  B08B1/00 ,  B08B3/10

CPC classification number: B08B3/022 ,  B08B1/002 ,  B08B3/10 ,  H01L21/67051

Abstract: Disclosed are a substrate processing apparatus and a cleaning nozzle for substrate processing included therein. More particularly, a substrate processing apparatus, including: a support for holding a disk-shaped substrate; and a cleaning nozzle for spraying a mixed fluid, in which liquid and gas are mixed, to a surface of the substrate in a slit shape through a slit-shaped discharge port to remove foreign substances remaining on the substrate with the mixed fluid discharged from the discharge port is provided. Accordingly, a substrate processing apparatus capable of improving the mixing uniformity of gas and liquid in a slit-shaped discharge fluid; and a cleaning nozzle for substrate processing used therefor are provided.

公开(公告)号：US20230260806A1

公开(公告)日：2023-08-17

申请号：US18012685

申请日：2021-05-28

Applicant: KCTECH CO., LTD.

Inventor： Dong Hwa LEE ,  Hyung Chul KIM ,  You Sun JUNG

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/66

CPC classification number: H01L21/67034 ,  H01L21/02068 ,  H01L21/6715 ,  H01L22/12 ,  H01L21/6719 ,  H01L21/67178

Abstract: A substrate processing system, according to one embodiment, comprises: a cleaning device, positioned at a first position, for performing a cleaning process for a substrate; a drying device, positioned at a second position, for performing a drying process for the substrate; and a transfer unit for transferring the substrate from the cleaning device to the drying device, wherein the first position and the second position may be vertically arranged.

公开(公告)号：US20230001462A1

公开(公告)日：2023-01-05

申请号：US17781700

申请日：2020-11-05

Applicant: KCTECH CO., LTD.

Inventor： Hyung Chul KIM ,  Dong Hwa LEE ,  You Sun JUNG

IPC: B08B13/00 ,  B08B7/00

Abstract: The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.

公开(公告)号：US20220266415A1

公开(公告)日：2022-08-25

申请号：US17679110

申请日：2022-02-24

Applicant: KCTECH CO., LTD.

Inventor： Sung Ho SHIN ,  Geun Sik YUN ,  Hee Cheul JUNG ,  Tae Hyeon KIM ,  Kang Jae LEE ,  Jin Su BAE ,  Sun Su KIM

IPC: B24B37/015 ,  B24B57/02

Abstract: A substrate polishing apparatus according to an example embodiment may include a substrate carrier configured to grasp and move a substrate, a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate, and a spray unit including a spray member configured to spray a fluid toward the substrate carrier.

公开(公告)号：US20220177727A1

公开(公告)日：2022-06-09

申请号：US17415703

申请日：2019-07-11

Applicant: KCTECH CO., LTD.

Inventor： Jung Yoon KIM ,  Jun Ha HWANG ,  Kwang Soo PARK ,  Hae Won YANG

IPC: C09G1/02

Abstract: The present disclosure relates to a polishing slurry composition for an STI process and, more specifically, to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a polymer having an amide bond, and a polysilicon film polishing barrier inclusive of a monomer having three or more chains linked to one or more atoms.

公开(公告)号：US20220127495A1

公开(公告)日：2022-04-28

申请号：US17511582

申请日：2021-10-27

Applicant: KCTECH CO., LTD.

Inventor： Jin Sook HWANG ,  Hyun Goo KONG ,  Eun Jin LEE

IPC: C09G1/02 ,  C09K3/14

Abstract: A polishing slurry composition is provided. The polishing slurry composition includes abrasive particles, an oxidizer, an iron-containing catalyst, and a stabilizer, and a retention rate of the oxidizer according to Equation 1 is 70% or greater. Retention rate (%) of oxidizer=(concentration (%) of oxidizer after 7 days at room temperature×100)/(initial concentration (%) of oxidizer in polishing slurry composition)  [Equation 1]

公开(公告)号：US11311979B2

公开(公告)日：2022-04-26

申请号：US17158657

申请日：2021-01-26

Applicant: Samsung Display Co., Ltd. ,  KCTECH CO.,LTD.

Inventor： Junggun Nam ,  Seungik Kang ,  Seungbae Kang ,  Pungseok Kim ,  Heesung Yang ,  Keunwoo Lee ,  Woojin Cho ,  Byoungkwon Choo

IPC: B24B37/07 ,  B32B38/00 ,  B24B37/20

Abstract: An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.