公开(公告)号：US20220266415A1

公开(公告)日：2022-08-25

申请号：US17679110

申请日：2022-02-24

Applicant: KCTECH CO., LTD.

Inventor： Sung Ho SHIN ,  Geun Sik YUN ,  Hee Cheul JUNG ,  Tae Hyeon KIM ,  Kang Jae LEE ,  Jin Su BAE ,  Sun Su KIM

IPC: B24B37/015 ,  B24B57/02

Abstract: A substrate polishing apparatus according to an example embodiment may include a substrate carrier configured to grasp and move a substrate, a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate, and a spray unit including a spray member configured to spray a fluid toward the substrate carrier.