公开(公告)号：US20200147751A1

公开(公告)日：2020-05-14

申请号：US16400554

申请日：2019-05-01

Applicant: KCTECH CO., LTD.

Inventor： JUN HO SON ,  Sung Ho SHIN

IPC: B24B37/30 ,  B24B37/04

Abstract: Provided are a membrane and carrier head using the membrane for polishing apparatus. The membrane comprises a first fixing flap extending inwards from the upper part of a side portion, a second fixing flap extending upwards from the upper part of the side portion, wherein the second fixing flap has a first inclined part, a second inclined part and a third extending part of extending upwards whereby a compensation force generated by the inclined parts realize the constant pressing force to the edge of a substrate during a polishing process.

公开(公告)号：US20220266415A1

公开(公告)日：2022-08-25

申请号：US17679110

申请日：2022-02-24

Applicant: KCTECH CO., LTD.

Inventor： Sung Ho SHIN ,  Geun Sik YUN ,  Hee Cheul JUNG ,  Tae Hyeon KIM ,  Kang Jae LEE ,  Jin Su BAE ,  Sun Su KIM

IPC: B24B37/015 ,  B24B57/02

Abstract: A substrate polishing apparatus according to an example embodiment may include a substrate carrier configured to grasp and move a substrate, a polishing pad configured to come into contact with a polishing target surface of the substrate and polish the polishing target surface of the substrate, and a spray unit including a spray member configured to spray a fluid toward the substrate carrier.

公开(公告)号：US20240286243A1

公开(公告)日：2024-08-29

申请号：US18453322

申请日：2023-08-22

Applicant: KCTECH CO., LTD.

Inventor： Sung Ho SHIN ,  Hee Cheul JUNG ,  Soo Ho KIM

IPC: B24B37/015

CPC classification number: B24B37/015

Abstract: Provided is a substrate polishing apparatus. The substrate polishing apparatus includes a carrier configured to grip a substrate, a polishing pad configured to polish a surface to be polished of the substrate gripped by the carrier while rotating, and a temperature control assembly configured to control a temperature of the polishing pad, and the temperature control assembly includes Deionized water (DIW) spraying module configured to spray DIW toward the polishing pad and a guide vane configured to guide at least a portion of the DIW sprayed from the DIW spraying module to an outside of the polishing pad.

公开(公告)号：US20220305611A1

公开(公告)日：2022-09-29

申请号：US17697891

申请日：2022-03-17

Applicant: KCTECH CO., LTD.

Inventor： Hee Cheul JUNG ,  Geun Sik YUN ,  Hyung Seob SHIM ,  Sung Ho SHIN

IPC: B24B37/015 ,  B24B37/20 ,  B24B57/02 ,  B24B55/03

Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.